Michiro Ogawa

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component-embedded substrate and electronic component de...
- Patent number 10,524,361
- Issue date Dec 31, 2019
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component device
- Patent number 9,257,373
- Issue date Feb 9, 2016
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate, method for manufacturing the wiring substrate, an...
- Patent number 9,232,642
- Issue date Jan 5, 2016
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring board having pads highly resistant...
- Patent number 9,024,207
- Issue date May 5, 2015
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and electronic component device
- Patent number 8,686,298
- Issue date Apr 1, 2014
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing the same
- Patent number 8,399,779
- Issue date Mar 19, 2013
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and electronic component device
- Patent number 8,153,902
- Issue date Apr 10, 2012
- Shinko Electric Industries Co., Ltd.
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE AND ELECTRONIC COMPONENT DE...
- Publication number 20190246502
- Publication date Aug 8, 2019
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT DEVICE
- Publication number 20140145317
- Publication date May 29, 2014
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE WIRING SUBSTRATE, AN...
- Publication number 20140021625
- Publication date Jan 23, 2014
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130185936
- Publication date Jul 25, 2013
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130153271
- Publication date Jun 20, 2013
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND ELECTRONIC COMPONENT DEVICE
- Publication number 20120145437
- Publication date Jun 14, 2012
- Junichi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND ELECTRONIC COMPONENT DEVICE
- Publication number 20100132993
- Publication date Jun 3, 2010
- Shinko Electric Industries Co., Ltd.
- Junichi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100065322
- Publication date Mar 18, 2010
- Shinko Electric Industries Co., Ltd.
- Michiro Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Michiro Ogawa

Person

Patents Grantslast 30 patents

Electronic component-embedded substrate and electronic component de...

Electronic component device

Wiring substrate, method for manufacturing the wiring substrate, an...

Method of manufacturing a wiring board having pads highly resistant...

Wiring board and electronic component device

Wiring board and method of manufacturing the same

Wiring board and electronic component device

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE AND ELECTRONIC COMPONENT DE...

ELECTRONIC COMPONENT DEVICE

WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE WIRING SUBSTRATE, AN...

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD AND ELECTRONIC COMPONENT DEVICE

WIRING BOARD AND ELECTRONIC COMPONENT DEVICE

WIRING BOARD AND METHOD OF MANUFACTURING THE SAME