Michitaka Mikami

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Saga-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Au bonding wire for semiconductor device
- Patent number 8,440,137
- Issue date May 14, 2013
- Tanaka Denshi Kogyo K.K.
- Satoshi Teshima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
ALUMINUM RIBBON FOR ULTRASONIC BONDING
- Publication number 20130164559
- Publication date Jun 27, 2013
- TANAKA DENSHI KOGYO K.K.
- Michitaka Mikami
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
HIGH STRENGTH AND HIGH ELONGATION RATIO OF AU ALLOY BONDING WIRE
- Publication number 20120312428
- Publication date Dec 13, 2012
- TANAKA DENSHI KOGYO K.K.
- Michitaka Mikami
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ALUMINUM FOR ULTRASONIC BONDING
- Publication number 20110236697
- Publication date Sep 29, 2011
- TANAKA DENSHI KOGYO, K.K.
- Michitaka Mikami
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Wire Bump Material
- Publication number 20080075626
- Publication date Mar 27, 2008
- TANAKA DENSHI KOGYO K.K.
- Michitaka Mikami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Au Bonding Wire For Semiconductor Device
- Publication number 20070298276
- Publication date Dec 27, 2007
- TANAKA DENSHI KOGYO K.K.
- Satoshi Teshima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...