Michito Sato

Person

Nishishirakawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing apparatus with a waste liquid receiver
- Patent number 10,850,365
- Issue date Dec 1, 2020
- Shin-Etsu Handotai Co., Ltd.
- Michito Sato
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Turn table transport carriage
- Patent number 10,737,365
- Issue date Aug 11, 2020
- Shin-Etsu Handotai Co., Ltd.
- Michito Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Method for measuring template and method for evaluating same
- Patent number 10,661,410
- Issue date May 26, 2020
- Shin-Etsu Handotai Co., Ltd.
- Michito Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and polishing apparatus
- Patent number 10,537,972
- Issue date Jan 21, 2020
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and wafer polishing method
- Patent number 10,532,442
- Issue date Jan 14, 2020
- Shin-Etsu Handotai Co., Ltd.
- Michito Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing polishing head, polishing head, and polish...
- Patent number 10,464,189
- Issue date Nov 5, 2019
- Shin-Etsu Handotai Co., Ltd.
- Masaaki Oseki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 10,414,017
- Issue date Sep 17, 2019
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing method
- Patent number 10,300,576
- Issue date May 28, 2019
- Shin-Etsu Handotai Co., Ltd.
- Masaaki Oseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad and method for manufacturing the same
- Patent number 10,201,886
- Issue date Feb 12, 2019
- FUJIBO HOLDINGS, INC.
- Michito Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Final polishing method of silicon wafer and silicon wafer
- Patent number 10,043,673
- Issue date Aug 7, 2018
- Shin-Etsu Handotai Co., Ltd.
- Michito Sato
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for dressing urethane foam pad for use in polishing
- Patent number 9,981,361
- Issue date May 29, 2018
- Shin-Etsu Handotai Co., Ltd.
- Junichi Ueno
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer and manufacturing method thereof
- Patent number 9,076,750
- Issue date Jul 7, 2015
- Shin-Etsu Handotai Co., Ltd.
- Michito Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for reducing wafer contamination using freshly, conditioned...
- Patent number 6,503,363
- Issue date Jan 7, 2003
- SEH America, Inc.
- Masami Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer etching apparatus
- Patent number 5,211,794
- Issue date May 18, 1993
- Shin-Etsu Handotai Co., Ltd.
- Tatsuo Enomoto
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR POLISHING WAFER
- Publication number 20230137813
- Publication date May 4, 2023
- Shin-Etsu Handotai Co., Ltd.
- Masaaki OSEKI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD
- Publication number 20180369984
- Publication date Dec 27, 2018
- Shin-Etsu Handotai Co., Ltd.
- Masaaki OSEKI
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MEASURING TEMPLATE AND METHOD FOR EVALUATING SAME
- Publication number 20180264620
- Publication date Sep 20, 2018
- Shin-Etsu Handotai Co., Ltd.
- Michito SATO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING METHOD AND POLISHING APPARATUS
- Publication number 20180229344
- Publication date Aug 16, 2018
- Shin-Etsu Handotai Co., Ltd.
- Junichi UENO
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20180222008
- Publication date Aug 9, 2018
- Shin-Etsu Handotai Co., Ltd.
- Michito SATO
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING POLISHING HEAD, POLISHING HEAD, AND POLISH...
- Publication number 20180043500
- Publication date Feb 15, 2018
- Shin-Etsu Handotai Co., Ltd.
- Masaaki OSEKI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20170304986
- Publication date Oct 26, 2017
- Shin-Etsu Handotai Co., Ltd.
- Junichi UENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TURN TABLE TRANSPORT CARRIAGE
- Publication number 20170304991
- Publication date Oct 26, 2017
- Shin-Etsu Handotai Co., Ltd.
- Michito SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND WAFER POLISHING METHOD
- Publication number 20170304992
- Publication date Oct 26, 2017
- Shin-Etsu Handotai Co., Ltd.
- Michito SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINAL POLISHING METHOD OF SILICON WAFER AND SILICON WAFER
- Publication number 20170213742
- Publication date Jul 27, 2017
- Shin-Etsu Handotai Co., Ltd.
- Michito SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING PAD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170144266
- Publication date May 25, 2017
- Shin-Etsu Handotai Co., Ltd
- Michito SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DRESSING URETHANE FOAM PAD FOR USE IN POLISHING
- Publication number 20160214230
- Publication date Jul 28, 2016
- Shin-Etsu Handotai Co., Ltd.
- Junichi UENO
- B24 - GRINDING POLISHING
Information Patent Application
TEMPLATE ASSEMBLY AND METHOD OF PRODUCING TEMPLATE ASSEMBLY
- Publication number 20160008947
- Publication date Jan 14, 2016
- Shin-Etsu Handotai Co., Ltd.
- Michito SATO
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR WAFER AND MANUFACTURING METHOD THEREOF
- Publication number 20140008768
- Publication date Jan 9, 2014
- Shin-Etsu Handotai Co., Ltd.
- Michito Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for reducing wafer contamination
- Publication number 20020053402
- Publication date May 9, 2002
- Masami Nakano
- H01 - BASIC ELECTRIC ELEMENTS

Michito Sato

Person

Patents Grantslast 30 patents

Polishing apparatus with a waste liquid receiver

Turn table transport carriage

Method for measuring template and method for evaluating same

Polishing method and polishing apparatus

Polishing apparatus and wafer polishing method

Method for manufacturing polishing head, polishing head, and polish...

Polishing apparatus

Polishing method

Polishing pad and method for manufacturing the same

Final polishing method of silicon wafer and silicon wafer

Apparatus for dressing urethane foam pad for use in polishing

Semiconductor wafer and manufacturing method thereof

System for reducing wafer contamination using freshly, conditioned...

Wafer etching apparatus

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR POLISHING WAFER

POLISHING METHOD

METHOD FOR MEASURING TEMPLATE AND METHOD FOR EVALUATING SAME

POLISHING METHOD AND POLISHING APPARATUS

POLISHING APPARATUS

METHOD FOR MANUFACTURING POLISHING HEAD, POLISHING HEAD, AND POLISH...

POLISHING APPARATUS

TURN TABLE TRANSPORT CARRIAGE

POLISHING APPARATUS AND WAFER POLISHING METHOD

FINAL POLISHING METHOD OF SILICON WAFER AND SILICON WAFER

POLISHING PAD AND METHOD FOR MANUFACTURING THE SAME

APPARATUS FOR DRESSING URETHANE FOAM PAD FOR USE IN POLISHING

TEMPLATE ASSEMBLY AND METHOD OF PRODUCING TEMPLATE ASSEMBLY

SEMICONDUCTOR WAFER AND MANUFACTURING METHOD THEREOF

System for reducing wafer contamination