Michitoshi Arata

Person

Shimodate-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thermosetting resin composition, and prepreg and laminated board us...
- Patent number 7,208,539
- Issue date Apr 24, 2007
- Hitachi Chemical Co., Ltd.
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prepreg for printed wiring boards, resin varnish, resin composition...
- Patent number 6,696,155
- Issue date Feb 24, 2004
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Prepreg for printed wiring boards, resin varnish, resin composition...
- Patent number 6,692,792
- Issue date Feb 17, 2004
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of producing prepreg for printed wiring boards, glass fiber...
- Patent number 6,572,968
- Issue date Jun 3, 2003
- Hitachi Chemical Co., Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive-coated copper foil, and copper-clad laminate and printed c...
- Patent number 6,558,797
- Issue date May 6, 2003
- Hitachi Chemical Company, Ltd.
- Michitoshi Arata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin compositions for printed circuit board and printed circ...
- Patent number 6,462,147
- Issue date Oct 8, 2002
- Hitachi Chemical Company, Ltd.
- Michitoshi Arata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formald...
- Patent number 6,329,474
- Issue date Dec 11, 2001
- Hitachi Chemical Company, Ltd.
- Michitoshi Arata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flame retardant epoxy resin composition for printed board, and prep...
- Patent number 6,214,468
- Issue date Apr 10, 2001
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy composition for printed circuit boards
- Patent number 6,180,250
- Issue date Jan 30, 2001
- Hitachi Chemical Co., Ltd.
- Michitoshi Arata
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
Thermosetting resin composition and prepreg and laminated sheet usi...
- Publication number 20050234173
- Publication date Oct 20, 2005
- Hitachi Chemical Co., Ltd.
- Shinji Tsuchikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Prepreg for printed wiring boards, resin varnish, resin composition...
- Publication number 20030180536
- Publication date Sep 25, 2003
- Nozomu Takano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method of producing prepreg for printed wiring boards, glass fiber...
- Publication number 20010053447
- Publication date Dec 20, 2001
- Nozomu Takano
- C03 - GLASS MINERAL OR SLAG WOOL

Michitoshi Arata

Person

Patents Grantslast 30 patents

Thermosetting resin composition, and prepreg and laminated board us...

Prepreg for printed wiring boards, resin varnish, resin composition...

Prepreg for printed wiring boards, resin varnish, resin composition...

Method of producing prepreg for printed wiring boards, glass fiber...

Adhesive-coated copper foil, and copper-clad laminate and printed c...

Epoxy resin compositions for printed circuit board and printed circ...

Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formald...

Flame retardant epoxy resin composition for printed board, and prep...

Epoxy composition for printed circuit boards

Patents Applicationslast 30 patents

Thermosetting resin composition and prepreg and laminated sheet usi...

Prepreg for printed wiring boards, resin varnish, resin composition...

Method of producing prepreg for printed wiring boards, glass fiber...