Michiya Kohiki

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier-attached copper foil, laminate, laminate producing method,...
- Patent number 10,349,531
- Issue date Jul 9, 2019
- JX Nippon Mining & Metals Corporation
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil, copper foil with carrier, substrate, r...
- Patent number 10,257,938
- Issue date Apr 9, 2019
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil provided with carrier, laminate, printed wiring board,...
- Patent number 10,187,983
- Issue date Jan 22, 2019
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil provided with carrier, laminate, printed wiring board,...
- Patent number 10,178,775
- Issue date Jan 8, 2019
- JX Nippon Mining & Metals Corporation
- Yoshiyuki Miyoshi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Ultrathin copper foil and method of manufacturing the same, and ult...
- Patent number 9,930,776
- Issue date Mar 27, 2018
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper foil provided with carrier, laminate, printed wiring board,...
- Patent number 9,839,124
- Issue date Dec 5, 2017
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil with carrier
- Patent number 9,788,423
- Issue date Oct 10, 2017
- JX Nippon Mining & Metals Corporation
- Tomota Nagaura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper foil with carrier, method of producing same, copper foil wit...
- Patent number 9,578,741
- Issue date Feb 21, 2017
- JX Nippon Mining & Metals Corporation
- Tomota Nagaura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Copper foil for printed wiring board, method for producing said cop...
- Patent number 9,028,972
- Issue date May 12, 2015
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process and apparatus for producing a metal covered polyimide compo...
- Patent number 8,721,864
- Issue date May 13, 2014
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal covered polyimide composite, process for producing the compos...
- Patent number 8,568,899
- Issue date Oct 29, 2013
- JX Nippon Mining & Metals Corporation
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
NEGATIVE ELECTRODE CURRENT COLLECTOR FOR SECONDARY BATTERY
- Publication number 20200036010
- Publication date Jan 30, 2020
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...
- Publication number 20180063950
- Publication date Mar 1, 2018
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER FOIL WITH RELEASE LAYER, LAMINATED MATERIAL, METHOD FOR PROD...
- Publication number 20170362733
- Publication date Dec 21, 2017
- JX NIPPON MINING & METALS CORPORATION
- MICHIYA KOHIKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Carrier-Attached Copper Foil, Laminate, Laminate Producing Method,...
- Publication number 20170019991
- Publication date Jan 19, 2017
- JX NIPPON MINING & METALS CORPORATION
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, AND METHO...
- Publication number 20160381805
- Publication date Dec 29, 2016
- JX NIPPON MINING & METALS CORPORATION
- YOSHIYUKI MIYOSHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
COPPER FOIL WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, AND METHO...
- Publication number 20160381806
- Publication date Dec 29, 2016
- JX NIPPON MINING & METALS CORPORATION
- YOSHIYUKI MIYOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL WITH CARRIER, LAMINATE, METHOD OF PRODUCING PRINTED WIR...
- Publication number 20160374205
- Publication date Dec 22, 2016
- JX NIPPON MINING & METALS CORPORATION
- TERUMASA MORIYAMA
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER FOIL WITH CARRIER
- Publication number 20160242281
- Publication date Aug 18, 2016
- JX NIPPON MINING & METALS CORPORATION
- Tomota Nagaura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...
- Publication number 20160234935
- Publication date Aug 11, 2016
- JX NIPPON MINING & METALS CORPORATION
- MICHIYA KOHIKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...
- Publication number 20160212846
- Publication date Jul 21, 2016
- JX NIPPON MINING & METALS CORPORATION
- Michiya KOHIKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...
- Publication number 20160212857
- Publication date Jul 21, 2016
- JX NIPPON MINING & METALS CORPORATION
- YOSHIYUKI MIYOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...
- Publication number 20160157356
- Publication date Jun 2, 2016
- JX NIPPON MINING & METALS CORPORATION
- MICHIYA KOHIKI
- B32 - LAYERED PRODUCTS
Information Patent Application
Ultrathin Copper Foil And Method Of Manufacturing The Same, And Ult...
- Publication number 20150195909
- Publication date Jul 9, 2015
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper Foil with Carrier, Method of Producing Same, Copper Foil wit...
- Publication number 20150047884
- Publication date Feb 19, 2015
- JX NIPPON MINING & METALS CORPORATION
- Tomota Nagaura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrolytic Copper Foil, and Negative Electrode Current Collector...
- Publication number 20140346048
- Publication date Nov 27, 2014
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER FOIL AND PRODUCTION METHOD OF ELECTROLYTIC COPP...
- Publication number 20140318973
- Publication date Oct 30, 2014
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER FOIL FOR AN ANODE OF A NEGATIVE ELECTRODE COLLE...
- Publication number 20140030591
- Publication date Jan 30, 2014
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTIC COPPER FOIL
- Publication number 20130256140
- Publication date Oct 3, 2013
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL FOR PRINTED WIRING BOARD, METHOD FOR PRODUCING SAID COP...
- Publication number 20130220685
- Publication date Aug 29, 2013
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Process and Apparatus for Producing a Metal Covered Polyimide Compo...
- Publication number 20120132531
- Publication date May 31, 2012
- JX NIPPON MINING & METALS CORPORATION
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal Covered Polyimide Composite, Process for Producing the Compos...
- Publication number 20100221563
- Publication date Sep 2, 2010
- Nippon Mining & Metals Co., Ltd.
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Metal Covered Polyimide Composite, Process for Producing the Compos...
- Publication number 20100215982
- Publication date Aug 26, 2010
- Nippon Mining & Metals Co., Ltd.
- Michiya Kohiki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Two-Layered Copper-Clad Laminate
- Publication number 20100040873
- Publication date Feb 18, 2010
- Nippon Mining & Metals Co., Ltd.
- Michiya Kohiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Michiya Kohiki

Person

Patents Grantslast 30 patents

Carrier-attached copper foil, laminate, laminate producing method,...

Surface-treated copper foil, copper foil with carrier, substrate, r...

Copper foil provided with carrier, laminate, printed wiring board,...

Copper foil provided with carrier, laminate, printed wiring board,...

Ultrathin copper foil and method of manufacturing the same, and ult...

Copper foil provided with carrier, laminate, printed wiring board,...

Copper foil with carrier

Copper foil with carrier, method of producing same, copper foil wit...

Copper foil for printed wiring board, method for producing said cop...

Process and apparatus for producing a metal covered polyimide compo...

Metal covered polyimide composite, process for producing the compos...

Patents Applicationslast 30 patents

NEGATIVE ELECTRODE CURRENT COLLECTOR FOR SECONDARY BATTERY

COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...

COPPER FOIL WITH RELEASE LAYER, LAMINATED MATERIAL, METHOD FOR PROD...

Carrier-Attached Copper Foil, Laminate, Laminate Producing Method,...

COPPER FOIL WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, AND METHO...

COPPER FOIL WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, AND METHO...

COPPER FOIL WITH CARRIER, LAMINATE, METHOD OF PRODUCING PRINTED WIR...

COPPER FOIL WITH CARRIER

COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...

COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...

COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD,...

SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, R...

Ultrathin Copper Foil And Method Of Manufacturing The Same, And Ult...

Copper Foil with Carrier, Method of Producing Same, Copper Foil wit...

Electrolytic Copper Foil, and Negative Electrode Current Collector...

ELECTROLYTIC COPPER FOIL AND PRODUCTION METHOD OF ELECTROLYTIC COPP...

ELECTROLYTIC COPPER FOIL FOR AN ANODE OF A NEGATIVE ELECTRODE COLLE...

ELECTROLYTIC COPPER FOIL

COPPER FOIL FOR PRINTED WIRING BOARD, METHOD FOR PRODUCING SAID COP...

Process and Apparatus for Producing a Metal Covered Polyimide Compo...

Metal Covered Polyimide Composite, Process for Producing the Compos...

Metal Covered Polyimide Composite, Process for Producing the Compos...

Two-Layered Copper-Clad Laminate