Michiyo Mizutani

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Nagoya, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding material and bonding method for electric element
- Patent number 5,794,839
- Issue date Aug 18, 1998
- Nippondenso Co., Ltd.
- Yuji Kimura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...