Michiyoshi Takano

Person

Okaya, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Methods for manufacturing semiconductor devices
- Patent number 8,136,238
- Issue date Mar 20, 2012
- Seiko Epson Corporation
- Michiyoshi Takano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device, circuit substrate, electro-optic device and e...
- Patent number 7,888,799
- Issue date Feb 15, 2011
- Seiko Epson Corporation
- Shuichi Tanaka
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device, circuit substrate, electro-optic device and e...
- Patent number 7,741,712
- Issue date Jun 22, 2010
- Seiko Epson Corporation
- Shuichi Tanaka
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device and semiconductor chip
- Patent number 7,638,886
- Issue date Dec 29, 2009
- Seiko Epson Corporation
- Akinori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that improves electrical connection reliability
- Patent number 7,560,814
- Issue date Jul 14, 2009
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, circuit substrate, electro-optic device and e...
- Patent number 7,276,792
- Issue date Oct 2, 2007
- Seiko Epson Corporation
- Shuichi Tanaka
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Manufacturing a bump electrode with roughened face
- Patent number 7,233,067
- Issue date Jun 19, 2007
- Seiko Epson Corporation
- Michiyoshi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that improves electrical connection reliability
- Patent number 7,230,338
- Issue date Jun 12, 2007
- Seiko Epson Corporation
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrates, semiconductor devices, semiconductor manufactur...
- Patent number 7,157,308
- Issue date Jan 2, 2007
- Seiko Epson Corporation
- Michiyoshi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing a bump electrode with roughened face
- Patent number 6,872,651
- Issue date Mar 29, 2005
- Seiko Epson Corporation
- Michiyoshi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device
- Patent number 6,605,523
- Issue date Aug 12, 2003
- Seiko Epson Corporation
- Michiyoshi Takano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Package
- Publication number 20240170380
- Publication date May 23, 2024
- SEIKO EPSON CORPORATION
- Michiyoshi TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CIRCUIT SUBSTRATE, ELECTRO-OPTIC DEVICE AND E...
- Publication number 20100252829
- Publication date Oct 7, 2010
- SEIKO EPSON CORPORATION
- Shuichi TANAKA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CIRCUIT SUBSTRATES, SEMICONDUCTOR DEVICE, SEMICONDUCTOR MANUFACTURI...
- Publication number 20090139085
- Publication date Jun 4, 2009
- SEIKO EPSON CORPORATION
- Michiyoshi TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20090035929
- Publication date Feb 5, 2009
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, CIRCUIT SUBSTRATE, ELECTRO-OPTIC DEVICE AND E...
- Publication number 20080012130
- Publication date Jan 17, 2008
- SEIKO EPSON CORPORATION
- Shuichi TANAKA
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Manufacturing a bump electrode with roughened face
- Publication number 20070267744
- Publication date Nov 22, 2007
- SEIKO EPSON CORPORATION
- Michiyoshi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device that improves electrical connection reliability
- Publication number 20070228560
- Publication date Oct 4, 2007
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATES, SEMICONDUCTOR DEVICES, SEMICONDUCTOR MANUFACTUR...
- Publication number 20070124928
- Publication date Jun 7, 2007
- SEIKO EPSON CORPORATION
- Michiyoshi TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and semiconductor chip
- Publication number 20070045837
- Publication date Mar 1, 2007
- Seiko Epson Corporation
- Akinori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20070026661
- Publication date Feb 1, 2007
- SEIKO EPSON CORPORATION
- Michiyoshi TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, circuit substrate, electro-optic device and e...
- Publication number 20050275115
- Publication date Dec 15, 2005
- Shuichi Tanaka
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Semiconductor device, circuit board, and electronic instrument
- Publication number 20050269697
- Publication date Dec 8, 2005
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20050272243
- Publication date Dec 8, 2005
- SEIKO EPSON CORPORATION
- Takeshi Yuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing a bump electrode with roughened face
- Publication number 20050062158
- Publication date Mar 24, 2005
- SEIKO EPSON CORPORATION
- Michiyoshi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit substrates, semiconductor devices, semiconductor manufactur...
- Publication number 20040217470
- Publication date Nov 4, 2004
- Michiyoshi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit substrates, semiconductor devices, semiconductor manufactur...
- Publication number 20040217456
- Publication date Nov 4, 2004
- Michiyoshi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for making the same
- Publication number 20040004273
- Publication date Jan 8, 2004
- SEIKO EPSON CORPORATION
- Michiyoshi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same, circuit...
- Publication number 20030173108
- Publication date Sep 18, 2003
- Seiko Epson Corporation
- Michiyoshi Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, method of manufacturing the same, manufacturi...
- Publication number 20030145947
- Publication date Aug 7, 2003
- Seiko Epson Corporation
- Michiyoshi Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method for semiconductor device
- Publication number 20010036685
- Publication date Nov 1, 2001
- Seiko Epson Corporation
- Michiyoshi Takano
- H01 - BASIC ELECTRIC ELEMENTS

Michiyoshi Takano

Person

Patents Grantslast 30 patents

Methods for manufacturing semiconductor devices

Semiconductor device, circuit substrate, electro-optic device and e...

Semiconductor device, circuit substrate, electro-optic device and e...

Semiconductor device and semiconductor chip

Semiconductor device that improves electrical connection reliability

Semiconductor device, circuit substrate, electro-optic device and e...

Manufacturing a bump electrode with roughened face

Semiconductor device that improves electrical connection reliability

Circuit substrates, semiconductor devices, semiconductor manufactur...

Manufacturing a bump electrode with roughened face

Manufacturing method for semiconductor device

Patents Applicationslast 30 patents

Semiconductor Package

SEMICONDUCTOR DEVICE, CIRCUIT SUBSTRATE, ELECTRO-OPTIC DEVICE AND E...

CIRCUIT SUBSTRATES, SEMICONDUCTOR DEVICE, SEMICONDUCTOR MANUFACTURI...

Method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE, CIRCUIT SUBSTRATE, ELECTRO-OPTIC DEVICE AND E...

Manufacturing a bump electrode with roughened face

Semiconductor device that improves electrical connection reliability

CIRCUIT SUBSTRATES, SEMICONDUCTOR DEVICES, SEMICONDUCTOR MANUFACTUR...

Semiconductor device and semiconductor chip

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Semiconductor device, circuit substrate, electro-optic device and e...

Semiconductor device, circuit board, and electronic instrument

Method of manufacturing semiconductor device

Manufacturing a bump electrode with roughened face

Circuit substrates, semiconductor devices, semiconductor manufactur...

Circuit substrates, semiconductor devices, semiconductor manufactur...

Semiconductor device and method for making the same

Semiconductor device and method of manufacturing the same, circuit...

Semiconductor device, method of manufacturing the same, manufacturi...

Manufacturing method for semiconductor device