Micree ZHAN

Follow

Person

Beijing, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Chip heat dissipation structure, chip structure, circuit board and...
- Patent number 12,100,639
- Issue date Sep 24, 2024
- BITMAIN TECHNOLOGIES INC.
- Dan Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink, integrated circuit chip and circuit board
- Patent number 11,152,278
- Issue date Oct 19, 2021
- BITMAIN TECHNOLOGIES INC.
- Tong Zou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP HEAT DISSIPATING STRUCTURE, CHIP STRUCTURE, CIRCUIT BOARD AND...
- Publication number 20210280504
- Publication date Sep 9, 2021
- Bitmain Technologies Inc.
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HEAT DISSIPATION STRUCTURE, CHIP STRUCTURE, CIRCUIT BOARD AND...
- Publication number 20210280493
- Publication date Sep 9, 2021
- Bitmain Technologies Inc.
- Dan SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK, INTEGRATED CIRCUIT CHIP AND CIRCUIT BOARD
- Publication number 20200235031
- Publication date Jul 23, 2020
- Bitmain Technologies Inc.
- Tong ZOU
- H01 - BASIC ELECTRIC ELEMENTS