Membership
Tour
Register
Log in
Mieko Kashi
Follow
Person
Yokohama, JP
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Mass production method of semiconductor integrated circuit device a...
Patent number
8,293,648
Issue date
Oct 23, 2012
Renesas Electronics Corporation
Takuya Futase
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Mass production method of semiconductor integrated circuit device a...
Patent number
8,034,717
Issue date
Oct 11, 2011
Renesas Electronics Corporation
Takuya Futase
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Mass production method of semiconductor integrated circuit device a...
Patent number
7,964,509
Issue date
Jun 21, 2011
Renesas Electronics Corporation
Takuya Futase
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Mass production method of semiconductor integrated circuit device a...
Patent number
6,737,221
Issue date
May 18, 2004
Renesas Technology Corp.
Takuya Futase
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Mass production method of semiconductor integrated circuit device a...
Patent number
6,586,161
Issue date
Jul 1, 2003
Hitachi, Ltd.
Takuya Futase
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
ADSORPTION MEMBER AND METHOD OF MANUFACTURING SAME
Publication number
20230173452
Publication date
Jun 8, 2023
Hitachi Metals, Ltd.
Mieko KASHI
C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information
Patent Application
MASS PRODUCTION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE A...
Publication number
20120009800
Publication date
Jan 12, 2012
Hitachi ULSI Systems Co., Ltd.
Takuya FUTASE
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
MASS PRODUCTION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE A...
Publication number
20090011597
Publication date
Jan 8, 2009
RENESAS TECHNOLOGY CORP.
TAKUYA FUTASE
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
MASS PRODUCTION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE A...
Publication number
20080182414
Publication date
Jul 31, 2008
RENESAS TECHNOLOGY CORP.
Takuya Futase
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Mass production method of semiconductor integrated circuit device a...
Publication number
20040259300
Publication date
Dec 23, 2004
RENESAS TECHNOLOGY CORP.
Takuya Futase
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Mass production method of semiconductor integrated curcuit device a...
Publication number
20030207214
Publication date
Nov 6, 2003
Hitachi, Ltd.
Takuya Futase
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Mass production method of semiconductor integrated circuit device a...
Publication number
20030017419
Publication date
Jan 23, 2003
Hitachi, Ltd.
Takuya Futase
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...