Mieko Suzuki

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical polishing apparatus and method of chemical mech...
- Patent number 6,951,512
- Issue date Oct 4, 2005
- NEC Electronics Corporation
- Mieko Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus and method of chemical mech...
- Patent number 6,783,446
- Issue date Aug 31, 2004
- NEC Electronics Corporation
- Mieko Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Method of forming polish stop by plasma treatment for interconnection
- Patent number 6,551,914
- Issue date Apr 22, 2003
- NEC Electronics Corporation
- Mieko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for polishing a metal film
- Patent number 6,361,708
- Issue date Mar 26, 2002
- NEC Corporation
- Akira Kubo
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing method for highly accurate in-plane u...
- Patent number 6,235,071
- Issue date May 22, 2001
- NEC Corporation
- Yasuaki Tsuchiya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method and apparatus polishing wafer for extended effective area of...
- Patent number 6,110,014
- Issue date Aug 29, 2000
- NEC Corporation
- Mieko Suzuki
- B24 - GRINDING POLISHING
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 6,054,383
- Issue date Apr 25, 2000
- NEC Corporation
- Mieko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process of semiconductor device
- Patent number 5,904,558
- Issue date May 18, 1999
- NEC Corporation
- Mieko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating multilevel interconnections in a semiconducto...
- Patent number 5,607,880
- Issue date Mar 4, 1997
- NEC Corporation
- Mieko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing semiconductor integrated circuit device having...
- Patent number 5,491,108
- Issue date Feb 13, 1996
- NEC Corporation
- Mieko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming multi-layered interconnections with fluorine compound treat...
- Patent number 5,420,075
- Issue date May 30, 1995
- NEC Corporation
- Tetsuya Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a semiconductor device
- Patent number 5,332,694
- Issue date Jul 26, 1994
- NEC Corporation
- Mieko Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chemical mechanical polishing apparatus and method of chemical mech...
- Publication number 20040259482
- Publication date Dec 23, 2004
- Mieko Suzuki
- B24 - GRINDING POLISHING

Mieko Suzuki

Person

Patents Grantslast 30 patents

Chemical mechanical polishing apparatus and method of chemical mech...

Chemical mechanical polishing apparatus and method of chemical mech...

Method of forming polish stop by plasma treatment for interconnection

Method and apparatus for polishing a metal film

Chemical mechanical polishing method for highly accurate in-plane u...

Method and apparatus polishing wafer for extended effective area of...

Fabrication method of semiconductor device

Fabrication process of semiconductor device

Method of fabricating multilevel interconnections in a semiconducto...

Method of producing semiconductor integrated circuit device having...

Forming multi-layered interconnections with fluorine compound treat...

Process for manufacturing a semiconductor device

Patents Applicationslast 30 patents

Chemical mechanical polishing apparatus and method of chemical mech...