Miguel CAMARGO SOTO

Person

Mexicali, MX

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods related to wire bond cleaning and wire bonding...
- Patent number 12,087,728
- Issue date Sep 10, 2024
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of optimizing laser cutting of wafers for producing integrat...
- Patent number 11,701,739
- Issue date Jul 18, 2023
- Skyworks Solutions, Inc.
- Juan Arturo Jerez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatuses for removal of wires from packaging substrates
- Patent number 11,616,045
- Issue date Mar 28, 2023
- Skyworks Solutions, Inc.
- Cesar Melendrez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond cleaning method and wire bonding recovery process
- Patent number 11,302,669
- Issue date Apr 12, 2022
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF OPTIMIZING LASER CUTTING OF WAFERS FOR PRODUCING INTEGRAT...
- Publication number 20230415269
- Publication date Dec 28, 2023
- Skyworks Solutions, Inc.
- Juan Arturo Jerez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVAL OF WIRES FROM PACKAGING SUBSTRATES
- Publication number 20230378127
- Publication date Nov 23, 2023
- Skyworks Solutions, Inc.
- Cesar MELENDREZ MURILLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS RELATED TO WIRE BOND CLEANING AND WIRE BONDING...
- Publication number 20220336413
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Aldrin Quinones GARING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUPD WIRE BOND CAPILLARY DESIGN
- Publication number 20210111146
- Publication date Apr 15, 2021
- Skyworks Solutions, Inc.
- Miguel Camargo Soto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF OPTIMIZING LASER CUTTING OF WAFERS FOR PRODUCING INTEGRAT...
- Publication number 20200324374
- Publication date Oct 15, 2020
- SKYWORKS SOLUTIONS, INC.
- Juan Arturo Jerez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUSES FOR REMOVAL OF WIRES FROM PACKAGING SUBSTRATES
- Publication number 20200105717
- Publication date Apr 2, 2020
- SKYWORKS SOLUTIONS, INC.
- Cesar MELENDREZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND STRENGTHENING
- Publication number 20160322329
- Publication date Nov 3, 2016
- SKYWORKS SOLUTIONS, INC.
- Aldrin Quinones GARING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Miguel CAMARGO SOTO

Person

Patents Grantslast 30 patents

Systems and methods related to wire bond cleaning and wire bonding...

Method of optimizing laser cutting of wafers for producing integrat...

Methods and apparatuses for removal of wires from packaging substrates

Wire bond cleaning method and wire bonding recovery process

Patents Applicationslast 30 patents

METHOD OF OPTIMIZING LASER CUTTING OF WAFERS FOR PRODUCING INTEGRAT...

REMOVAL OF WIRES FROM PACKAGING SUBSTRATES

SYSTEMS AND METHODS RELATED TO WIRE BOND CLEANING AND WIRE BONDING...

CUPD WIRE BOND CAPILLARY DESIGN

METHOD OF OPTIMIZING LASER CUTTING OF WAFERS FOR PRODUCING INTEGRAT...

METHODS AND APPARATUSES FOR REMOVAL OF WIRES FROM PACKAGING SUBSTRATES

WIRE BOND STRENGTHENING