Mihir Oka

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal compression bonder nozzle with vacuum relief features
- Patent number 12,176,318
- Issue date Dec 24, 2024
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compression bonder nozzle with vacuum relief features
- Patent number 11,652,080
- Issue date May 16, 2023
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for mitigating surface imperfections on die ba...
- Patent number 10,546,823
- Issue date Jan 28, 2020
- Intel Corporation
- Balu Pathangey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered solder for fine pitch first-level interconnect (FLI) appli...
- Patent number 10,515,914
- Issue date Dec 24, 2019
- Intel Corporation
- Mihir A. Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintered solder for fine pitch first-level interconnect (FLI) appli...
- Patent number 10,224,299
- Issue date Mar 5, 2019
- Intel Corporation
- Mihir A. Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,859,248
- Issue date Jan 2, 2018
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-on-die using water-soluble resist system and method
- Patent number 9,659,889
- Issue date May 23, 2017
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
DBF film as a thermal interface material
- Patent number 9,530,718
- Issue date Dec 27, 2016
- Intel Corporation
- Hitesh Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry-removable protective coatings
- Patent number 9,472,517
- Issue date Oct 18, 2016
- Intel Corporation
- Mihir A. Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,412,702
- Issue date Aug 9, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...
- Publication number 20240186280
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES
- Publication number 20230238352
- Publication date Jul 27, 2023
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES
- Publication number 20210288021
- Publication date Sep 16, 2021
- Intel Corporation
- Mihir Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLI...
- Publication number 20190157225
- Publication date May 23, 2019
- Intel Corporation
- Mihir A. OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MITIGATING SURFACE IMPERFECTIONS ON DIE BA...
- Publication number 20190067213
- Publication date Feb 28, 2019
- Intel Corporation
- Balu Pathangey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INKJET PRINTABLE MASK APPARATUS AND METHOD FOR SOLDER ON DIE TECHNO...
- Publication number 20180315731
- Publication date Nov 1, 2018
- Intel Corporation
- Kosuke Hirota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLI...
- Publication number 20180190604
- Publication date Jul 5, 2018
- Intel Corporation
- Mihir A. OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY-REMOVABLE PROTECTIVE COATINGS
- Publication number 20170033069
- Publication date Feb 2, 2017
- Intel Corporation
- Mihir A. Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20160307869
- Publication date Oct 20, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY-REMOVABLE PROTECTIVE COATINGS
- Publication number 20150270235
- Publication date Sep 24, 2015
- Mihir A. Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SOLDER-ON-DIE USING WATER-SOLUBLE RESIST SYSTEM AND METHOD
- Publication number 20150179595
- Publication date Jun 25, 2015
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20140264951
- Publication date Sep 18, 2014
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DBF FILM AS A THERMAL INTERFACE MATERIAL
- Publication number 20140177194
- Publication date Jun 26, 2014
- Hitesh Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO IMPROVE LASER MARK CONTRAST ON DIE BACKSIDE FILM IN EMBE...
- Publication number 20140175657
- Publication date Jun 26, 2014
- Mihir A. Oka
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thermal compression bonder nozzle with vacuum relief features

Thermal compression bonder nozzle with vacuum relief features

Apparatus and method for mitigating surface imperfections on die ba...

Sintered solder for fine pitch first-level interconnect (FLI) appli...

Sintered solder for fine pitch first-level interconnect (FLI) appli...

Laser die backside film removal for integrated circuit (IC) packaging

Solder-on-die using water-soluble resist system and method

DBF film as a thermal interface material

Dry-removable protective coatings

Laser die backside film removal for integrated circuit (IC) packaging

Patents Applicationslast 30 patents

THERMOCOMPRESSION BONDING TOOL FOR PANEL-LEVEL THERMO-COMPRESSION B...

THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES

THERMAL COMPRESSION BONDER NOZZLE WITH VACUUM RELIEF FEATURES

SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLI...

APPARATUS AND METHOD FOR MITIGATING SURFACE IMPERFECTIONS ON DIE BA...

INKJET PRINTABLE MASK APPARATUS AND METHOD FOR SOLDER ON DIE TECHNO...

SINTERED SOLDER FOR FINE PITCH FIRST-LEVEL INTERCONNECT (FLI) APPLI...

DRY-REMOVABLE PROTECTIVE COATINGS

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

DRY-REMOVABLE PROTECTIVE COATINGS

SOLDER-ON-DIE USING WATER-SOLUBLE RESIST SYSTEM AND METHOD

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

DBF FILM AS A THERMAL INTERFACE MATERIAL

METHODS TO IMPROVE LASER MARK CONTRAST ON DIE BACKSIDE FILM IN EMBE...