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Mihyae PARK
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Suwon-si, KR
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Patents Grants
last 30 patents
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Patent Grant
Thermal interface material paste and semiconductor package
Patent number
11,876,031
Issue date
Jan 16, 2024
Samsung Electronics Co., Ltd.
Joungphil Lee
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
THERMAL INTERFACIAL MATERIAL FILM, SEMICONDUCTOR PACKAGE, METHOD OF...
Publication number
20240063085
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Mihyae PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COATING COMPOSITION FOR WAFER PROTECTION AND METHOD OF MANUFACTURIN...
Publication number
20240038551
Publication date
Feb 1, 2024
Samsung Electronics Co., Ltd.
Woojung PARK
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Patent Application
THERMAL INTERFACE MATERIAL PASTE AND SEMICONDUCTOR PACKAGE
Publication number
20220020664
Publication date
Jan 20, 2022
Samsung Electronics Co., Ltd.
Joungphil LEE
H01 - BASIC ELECTRIC ELEMENTS