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Mika Kiritani
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Kawasaki-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Stack MCP and manufacturing method thereof
Patent number
7,833,836
Issue date
Nov 16, 2010
Kabushiki Kaisha Toshiba
Shinya Takyu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having a semiconductor element with a...
Patent number
7,608,911
Issue date
Oct 27, 2009
Kabushiki Kaisha Toshiba
Takashi Imoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stack MCP and manufacturing method thereof
Patent number
7,482,695
Issue date
Jan 27, 2009
Kabushiki Kaisha Toshiba
Shinya Takyu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating a semiconductor device package having a semic...
Patent number
7,405,159
Issue date
Jul 29, 2008
Kabushiki Kaisha Toshiba
Takashi Imoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stack MCP
Patent number
7,285,864
Issue date
Oct 23, 2007
Kabushiki Kaisha Toshiba
Shinya Takyu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having a semiconductor element with resin
Patent number
7,202,563
Issue date
Apr 10, 2007
Kabushiki Kaisha Toshiba
Takashi Imoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor resin molding method
Patent number
6,787,093
Issue date
Sep 7, 2004
Kabushiki Kaisha Toshiba
Mika Kiritani
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Semiconductor device manufacturing method for reinforcing chip by u...
Patent number
6,777,313
Issue date
Aug 17, 2004
Kabushiki Kaisha Toshiba
Shinya Takyu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20160276312
Publication date
Sep 22, 2016
Kabushiki Kaisha Toshiba
Shinya SHIMIZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
Publication number
20120235282
Publication date
Sep 20, 2012
Kabushiki Kaisha Toshiba
Akira TOMONO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACK MCP AND MANUFACTURING METHOD THEREOF
Publication number
20090111218
Publication date
Apr 30, 2009
Kabushiki Kaisha Toshiba
Shinya Takyu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method of manufacturing the same
Publication number
20080265443
Publication date
Oct 30, 2008
KABUSHIKI KAISHA TOSHIBA,
Takashi Imoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stack MCP and manufacturing method thereof
Publication number
20070262445
Publication date
Nov 15, 2007
Kabushiki Kaisha Toshiba
Shinya Takyu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method of manufacturing the same
Publication number
20070196956
Publication date
Aug 23, 2007
Kabushiki Kaisha Toshiba
Takashi Imoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method of manufacturing the same
Publication number
20050212145
Publication date
Sep 29, 2005
Takashi Imoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stack MCP and manufacturing method thereof
Publication number
20050179127
Publication date
Aug 18, 2005
Shinya Takyu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Manufacturing method of semiconductor device
Publication number
20050026326
Publication date
Feb 3, 2005
Mika Kiritani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device manufacturing method for reinforcing chip by u...
Publication number
20030017663
Publication date
Jan 23, 2003
Shinya Takyu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor resin mold and semiconductor resin molding method usi...
Publication number
20020020940
Publication date
Feb 21, 2002
Mika Kiritani
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL