Mika Kurihara

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Hadano, JP

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Patents Grantslast 30 patents

Information Patent Grant
Cup-type plating apparatus and method for plating wafer using the same
- Patent number 6,332,963
- Issue date Dec 25, 2001
- Electroplating Engineers of Japan Limited
- Yasuhiko Sakaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR