Mikael TUOMINEN

Person

Pernio, FI

People

Patents Grantslast 30 patents

Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 12,127,338
- Issue date Oct 22, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-flex component carrier with dielectric material having high el...
- Patent number 12,058,810
- Issue date Aug 6, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with well-defined outline sidewall cut by short l...
- Patent number 12,048,101
- Issue date Jul 23, 2024
- AT&S(China) Co. Ltd.
- Seok Kim Tay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with low-solvent fiber-free dielectric layer
- Patent number 12,041,730
- Issue date Jul 16, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier having component covered with ultra-thin transiti...
- Patent number 11,963,310
- Issue date Apr 16, 2024
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with blind hole filled with an electrically condu...
- Patent number 11,700,690
- Issue date Jul 11, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with low shrinkage dielectric material
- Patent number 11,688,668
- Issue date Jun 27, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with improved bending performance
- Patent number 11,672,079
- Issue date Jun 6, 2023
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement with central carrier and two opposing layer stacks, com...
- Patent number 11,670,613
- Issue date Jun 6, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded component exposed by blind hole
- Patent number 11,617,259
- Issue date Mar 28, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged integrated circuit with interposing functionality and meth...
- Patent number 11,605,569
- Issue date Mar 14, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-flexible component carrier with stepped layer structure
- Patent number 11,589,462
- Issue date Feb 21, 2023
- AT&S(China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with bridge structure in through hole fulfilling...
- Patent number 11,546,990
- Issue date Jan 3, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with embedded component and horizontally elongate...
- Patent number 11,470,714
- Issue date Oct 11, 2022
- AT&S (China) Co. Ltd.
- Gin Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with electrically conductive layer structures hav...
- Patent number 11,452,212
- Issue date Sep 20, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier and method of manufacturing a component carrier
- Patent number 11,445,601
- Issue date Sep 13, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,343,916
- Issue date May 24, 2022
- AT&S(China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-flex component carrier with dielectric material surrounding an...
- Patent number 11,291,119
- Issue date Mar 29, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-flex component carrier with dielectric material having high el...
- Patent number 11,284,508
- Issue date Mar 22, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with blind hole filled with an electrically condu...
- Patent number 11,219,129
- Issue date Jan 4, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier comprising a component having vertical through co...
- Patent number 11,211,317
- Issue date Dec 28, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with through hole extending through multiple diel...
- Patent number 11,160,165
- Issue date Oct 26, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally highly conductive coating on base structure accommodating...
- Patent number 11,051,391
- Issue date Jun 29, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electronic Package Comprising a Decoupling Layer Structure
- Publication number 20240030095
- Publication date Jan 25, 2024
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Andreas Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Asymmetric Build-Up And Methods for Determin...
- Publication number 20230217589
- Publication date Jul 6, 2023
- AT&S (China) Co. Ltd.
- Diego LORENZONI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier
- Publication number 20230180383
- Publication date Jun 8, 2023
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Protection Structure for an Aperture for an Optical Component Embed...
- Publication number 20230038270
- Publication date Feb 9, 2023
- AT&S (China) Co. Ltd.
- Seok Kim TAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Different Stack Heights and Vertical Opening...
- Publication number 20230043085
- Publication date Feb 9, 2023
- AT&S (China) Co. Ltd.
- Seok Kim TAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Surrounding an...
- Publication number 20220256686
- Publication date Aug 11, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Having High El...
- Publication number 20220159828
- Publication date May 19, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Blind Hole Filled With An Electrically Condu...
- Publication number 20220095457
- Publication date Mar 24, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Low-Solvent Fiber-Free Dielectric Layer
- Publication number 20220078923
- Publication date Mar 10, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Seok Kim Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Well-Defined Outline Sidewall Cut by Short L...
- Publication number 20220061162
- Publication date Feb 24, 2022
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Flexible Component Carrier With Stepped Layer Structure
- Publication number 20220039259
- Publication date Feb 3, 2022
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Improved Bending Performance
- Publication number 20210368613
- Publication date Nov 25, 2021
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Embedded Component Exposed by Blind Hole
- Publication number 20210243889
- Publication date Aug 5, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Having Component Covered With Ultra-Thin Transiti...
- Publication number 20210227702
- Publication date Jul 22, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement With Central Carrier And Two Opposing Layer Stacks, Com...
- Publication number 20210202427
- Publication date Jul 1, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Low Shrinkage Dielectric Material
- Publication number 20210202355
- Publication date Jul 1, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing a Component Carrier
- Publication number 20210204399
- Publication date Jul 1, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20210185816
- Publication date Jun 17, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER WITH EMBEDDED COMPONENT AND HORIZONTALLY ELONGATE...
- Publication number 20210127478
- Publication date Apr 29, 2021
- AT&S (China) Co. Ltd.
- Gin Feng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Electrically Conductive Layer Structures Hav...
- Publication number 20210127496
- Publication date Apr 29, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Through Hole Extending Through Multiple Diel...
- Publication number 20210100095
- Publication date Apr 1, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Having High El...
- Publication number 20210045235
- Publication date Feb 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Flex Component Carrier With Dielectric Material Surrounding an...
- Publication number 20210045249
- Publication date Feb 11, 2021
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier Comprising a Component Having Vertical Through Co...
- Publication number 20200294900
- Publication date Sep 17, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Bridge Structure In Through Hole Fulfilling...
- Publication number 20200253050
- Publication date Aug 6, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Blind Hole Filled With An Electrically Condu...
- Publication number 20200253054
- Publication date Aug 6, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Improved Bending Performance
- Publication number 20200154558
- Publication date May 14, 2020
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaged Integrated Circuit With Interposing Functionality and Meth...
- Publication number 20190326188
- Publication date Oct 24, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Mikael Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Highly Conductive Coating on Base Structure Accommodating...
- Publication number 20180213634
- Publication date Jul 26, 2018
- Mikael TUOMINEN
- H01 - BASIC ELECTRIC ELEMENTS

Mikael TUOMINEN

Person

Patents Grantslast 30 patents

Semi-flex component carrier with dielectric material surrounding an...

Semi-flex component carrier with dielectric material having high el...

Component carrier with well-defined outline sidewall cut by short l...

Component carrier with low-solvent fiber-free dielectric layer

Component carrier having component covered with ultra-thin transiti...

Component carrier with blind hole filled with an electrically condu...

Component carrier with low shrinkage dielectric material

Component carrier with improved bending performance

Arrangement with central carrier and two opposing layer stacks, com...

Component carrier with embedded component exposed by blind hole

Packaged integrated circuit with interposing functionality and meth...

Semi-flexible component carrier with stepped layer structure

Component carrier with bridge structure in through hole fulfilling...

Component carrier with embedded component and horizontally elongate...

Component carrier with electrically conductive layer structures hav...

Component carrier and method of manufacturing a component carrier

Component carrier and method of manufacturing the same

Semi-flex component carrier with dielectric material surrounding an...

Semi-flex component carrier with dielectric material having high el...

Component carrier with blind hole filled with an electrically condu...

Component carrier comprising a component having vertical through co...

Component carrier with through hole extending through multiple diel...

Thermally highly conductive coating on base structure accommodating...

Patents Applicationslast 30 patents

Electronic Package Comprising a Decoupling Layer Structure

Component Carrier With Asymmetric Build-Up And Methods for Determin...

Component Carrier

Protection Structure for an Aperture for an Optical Component Embed...

Component Carrier With Different Stack Heights and Vertical Opening...

Semi-Flex Component Carrier With Dielectric Material Surrounding an...

Semi-Flex Component Carrier With Dielectric Material Having High El...

Component Carrier With Blind Hole Filled With An Electrically Condu...

Component Carrier With Low-Solvent Fiber-Free Dielectric Layer

Component Carrier With Well-Defined Outline Sidewall Cut by Short L...

Semi-Flexible Component Carrier With Stepped Layer Structure

Component Carrier With Improved Bending Performance

Component Carrier With Embedded Component Exposed by Blind Hole

Component Carrier Having Component Covered With Ultra-Thin Transiti...

Arrangement With Central Carrier And Two Opposing Layer Stacks, Com...

Component Carrier With Low Shrinkage Dielectric Material

Component Carrier and Method of Manufacturing a Component Carrier

Component Carrier and Method of Manufacturing the Same

COMPONENT CARRIER WITH EMBEDDED COMPONENT AND HORIZONTALLY ELONGATE...

Component Carrier With Electrically Conductive Layer Structures Hav...

Component Carrier With Through Hole Extending Through Multiple Diel...

Semi-Flex Component Carrier With Dielectric Material Having High El...

Semi-Flex Component Carrier With Dielectric Material Surrounding an...

Component Carrier Comprising a Component Having Vertical Through Co...

Component Carrier With Bridge Structure In Through Hole Fulfilling...

Component Carrier With Blind Hole Filled With An Electrically Condu...

Component Carrier With Improved Bending Performance

Packaged Integrated Circuit With Interposing Functionality and Meth...

Thermally Highly Conductive Coating on Base Structure Accommodating...