Mike Connell

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate comprising a plurality of integrated circuitry die, and a...
- Patent number 8,461,685
- Issue date Jun 11, 2013
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer back side coating to balance stress from passivation layer on...
- Patent number 7,727,785
- Issue date Jun 1, 2010
- Micron Technology, Inc.
- Michael E. Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-lens configuration for small lens focusing in digital imaging...
- Patent number 7,557,337
- Issue date Jul 7, 2009
- Aptina Imaging Corporation
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating board on chip (BOC) semiconductor package wi...
- Patent number 7,537,966
- Issue date May 26, 2009
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package with circuit side poly...
- Patent number 7,479,413
- Issue date Jan 20, 2009
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-lens configuration for small lens focusing in digital imaging...
- Patent number 7,405,385
- Issue date Jul 29, 2008
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of stacked microelectronic devices
- Patent number 7,297,412
- Issue date Nov 20, 2007
- Micron Technology, Inc.
- Michael E. Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment of a ground semiconductor die to improve adhesive bonding...
- Patent number 7,170,184
- Issue date Jan 30, 2007
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer back side coating to balance stress from passivation layer on...
- Patent number 7,169,685
- Issue date Jan 30, 2007
- Micron Technology, Inc.
- Michael E. Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-lens configuration for small lens focusing in digital imaging...
- Patent number 7,115,853
- Issue date Oct 3, 2006
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating integrated circuitry
- Patent number 7,078,267
- Issue date Jul 18, 2006
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic devices and methods of fabricating same
- Patent number 7,037,756
- Issue date May 2, 2006
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of stacked microelectronic devices
- Patent number 7,037,751
- Issue date May 2, 2006
- Micron Technology, Inc.
- Michael E. Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of stacked microelectronic devices
- Patent number 7,022,418
- Issue date Apr 4, 2006
- Micron Technology, Inc.
- Michael Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Total internal reflection (TIR) CMOS imager
- Patent number 7,001,795
- Issue date Feb 21, 2006
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Total internal reflection (TIR) CMOS imager
- Patent number 6,995,442
- Issue date Feb 7, 2006
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with circuit side polymer layer and wafer lev...
- Patent number 6,995,041
- Issue date Feb 7, 2006
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package with circuit side polymer layer
- Patent number 6,949,834
- Issue date Sep 27, 2005
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of stacked microelectronic devices
- Patent number 6,896,760
- Issue date May 24, 2005
- Micron Technology, Inc.
- Michael Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged stacked semiconductor die and method of preparing same
- Patent number 6,894,380
- Issue date May 17, 2005
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a protective layer for use in packaging a semico...
- Patent number 6,881,606
- Issue date Apr 19, 2005
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for forming thin microelectronic dies
- Patent number 6,882,036
- Issue date Apr 19, 2005
- Micron Technology, Inc.
- Nathan R. Draney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ozone treatment of a ground semiconductor die to improve adhesive b...
- Patent number 6,812,064
- Issue date Nov 2, 2004
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with circuit side polymer layer and wafer lev...
- Patent number 6,791,168
- Issue date Sep 14, 2004
- Micron Technology, Inc.
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for forming thin microelectronic dies
- Patent number 6,762,074
- Issue date Jul 13, 2004
- Micron Technology, Inc.
- Nathan R. Draney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged stacked semiconductor die and method of preparing same
- Patent number 6,514,795
- Issue date Feb 4, 2003
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for fabricating board on chip (BOC) semiconductor package wi...
- Publication number 20060292752
- Publication date Dec 28, 2006
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of stacked microelectronic devices
- Publication number 20060172510
- Publication date Aug 3, 2006
- Micron Technology, Inc.
- Michael Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of stacked microelectronic devices
- Publication number 20060159947
- Publication date Jul 20, 2006
- Micron Technology, Inc.
- Michael Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer back side coating to balance stress from passivation layer on...
- Publication number 20060051938
- Publication date Mar 9, 2006
- Michael E. Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-lens configuration for small lens focusing in digital imaging...
- Publication number 20060038112
- Publication date Feb 23, 2006
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-lens configuration for small lens focusing in digital imaging...
- Publication number 20060033010
- Publication date Feb 16, 2006
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate comprising a plurality of integrated circuitry die, and a...
- Publication number 20060030077
- Publication date Feb 9, 2006
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabricating integrated circuitry
- Publication number 20060030078
- Publication date Feb 9, 2006
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor package with circuit side poly...
- Publication number 20060030081
- Publication date Feb 9, 2006
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOTAL INTERNAL REFLECTION (TIR) CMOS IMAGER
- Publication number 20050274993
- Publication date Dec 15, 2005
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protective layer for use in packaging a semiconductor die and metho...
- Publication number 20050158910
- Publication date Jul 21, 2005
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-lens configuration for small lens focusing in digital imaging...
- Publication number 20050061950
- Publication date Mar 24, 2005
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of stacked microelectronic devices
- Publication number 20050026415
- Publication date Feb 3, 2005
- Micron Technology, Inc.
- Michael Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of stacked microelectronic devices
- Publication number 20050026395
- Publication date Feb 3, 2005
- Micron Technology, Inc.
- Michael Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Total internal reflection (TIR) CMOS imager
- Publication number 20040227170
- Publication date Nov 18, 2004
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for forming thin microelectronic dies
- Publication number 20040203188
- Publication date Oct 14, 2004
- Nathan R. Draney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Protective Layer for Use In Packaging a Semico...
- Publication number 20040183163
- Publication date Sep 23, 2004
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor package with circuit side polymer layer
- Publication number 20040171191
- Publication date Sep 2, 2004
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer back side coating to balance stress from passivation layer on...
- Publication number 20040104491
- Publication date Jun 3, 2004
- Michael E. Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabricating integrated circuitry
- Publication number 20040102022
- Publication date May 27, 2004
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with circuit side polymer layer and wafer lev...
- Publication number 20040009631
- Publication date Jan 15, 2004
- Mike Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer back side coating to balance stress from passivation layer on...
- Publication number 20030162368
- Publication date Aug 28, 2003
- Michael E. Connell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ozone treatment of a ground semiconductor die to improve adhesive b...
- Publication number 20030109081
- Publication date Jun 12, 2003
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ozone treatment of a ground semiconductor die to improve adhesive b...
- Publication number 20030087507
- Publication date May 8, 2003
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged stacked semiconductor die and method of preparing same
- Publication number 20030067083
- Publication date Apr 10, 2003
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC DEVICES AND METHODS OF FABRICATING SAME
- Publication number 20030042615
- Publication date Mar 6, 2003
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS

Mike Connell

Person

Patents Grantslast 30 patents

Substrate comprising a plurality of integrated circuitry die, and a...

Wafer back side coating to balance stress from passivation layer on...

Micro-lens configuration for small lens focusing in digital imaging...

Method for fabricating board on chip (BOC) semiconductor package wi...

Method for fabricating semiconductor package with circuit side poly...

Micro-lens configuration for small lens focusing in digital imaging...

Fabrication of stacked microelectronic devices

Treatment of a ground semiconductor die to improve adhesive bonding...

Wafer back side coating to balance stress from passivation layer on...

Micro-lens configuration for small lens focusing in digital imaging...

Methods of fabricating integrated circuitry

Stacked microelectronic devices and methods of fabricating same

Fabrication of stacked microelectronic devices

Fabrication of stacked microelectronic devices

Total internal reflection (TIR) CMOS imager

Total internal reflection (TIR) CMOS imager

Semiconductor package with circuit side polymer layer and wafer lev...

Stacked semiconductor package with circuit side polymer layer

Fabrication of stacked microelectronic devices

Packaged stacked semiconductor die and method of preparing same

Method for forming a protective layer for use in packaging a semico...

Apparatuses for forming thin microelectronic dies

Ozone treatment of a ground semiconductor die to improve adhesive b...

Semiconductor package with circuit side polymer layer and wafer lev...

Method and apparatus for forming thin microelectronic dies

Packaged stacked semiconductor die and method of preparing same

Patents Applicationslast 30 patents

Method for fabricating board on chip (BOC) semiconductor package wi...

Fabrication of stacked microelectronic devices

Fabrication of stacked microelectronic devices

Wafer back side coating to balance stress from passivation layer on...

Micro-lens configuration for small lens focusing in digital imaging...

Micro-lens configuration for small lens focusing in digital imaging...

Substrate comprising a plurality of integrated circuitry die, and a...

Methods of fabricating integrated circuitry

Method for fabricating semiconductor package with circuit side poly...

TOTAL INTERNAL REFLECTION (TIR) CMOS IMAGER

Protective layer for use in packaging a semiconductor die and metho...

Micro-lens configuration for small lens focusing in digital imaging...

Fabrication of stacked microelectronic devices

Fabrication of stacked microelectronic devices

Total internal reflection (TIR) CMOS imager

Method and apparatus for forming thin microelectronic dies

Method for Forming a Protective Layer for Use In Packaging a Semico...

Stacked semiconductor package with circuit side polymer layer

Wafer back side coating to balance stress from passivation layer on...

Methods of fabricating integrated circuitry

Semiconductor package with circuit side polymer layer and wafer lev...

Wafer back side coating to balance stress from passivation layer on...

Ozone treatment of a ground semiconductor die to improve adhesive b...

Ozone treatment of a ground semiconductor die to improve adhesive b...

Packaged stacked semiconductor die and method of preparing same

STACKED MICROELECTRONIC DEVICES AND METHODS OF FABRICATING SAME