Mike Kwon

Person

Pleasanton, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging a substrate with an LED into an interconnect structure on...
- Patent number 10,325,890
- Issue date Jun 18, 2019
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging a substrate with an LED into an interconnect structure on...
- Patent number 9,985,004
- Issue date May 29, 2018
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging a substrate with an LED into an interconnect structure on...
- Patent number 9,893,039
- Issue date Feb 13, 2018
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging a substrate with an LED into an interconnect structure on...
- Patent number 9,653,437
- Issue date May 16, 2017
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate free LED package
- Patent number 9,627,436
- Issue date Apr 18, 2017
- Bridgelux, Inc.
- Mike Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks having only top side connections i...
- Patent number 9,312,465
- Issue date Apr 12, 2016
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks having only top side connections i...
- Patent number 9,130,139
- Issue date Sep 8, 2015
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-bead blasting process for removing a silicone flash layer
- Patent number 8,803,180
- Issue date Aug 12, 2014
- Bridgelux, Inc.
- R. Scott West
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate free LED package
- Patent number 8,748,202
- Issue date Jun 10, 2014
- Bridgelux, Inc.
- Mike Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging photon building blocks having only top side connections i...
- Patent number 8,652,860
- Issue date Feb 18, 2014
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-bead blasting process for removing a silicone flash layer
- Patent number 8,610,153
- Issue date Dec 17, 2013
- Bridgelux, Inc.
- R. Scott West
- B24 - GRINDING POLISHING
Information Patent Grant
Micro-bead blasting process for removing a silicone flash layer
- Patent number 8,536,605
- Issue date Sep 17, 2013
- Bridgelux, Inc.
- R. Scott West
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Packaging a Substrate with an LED into an Interconnect Structure On...
- Publication number 20180247921
- Publication date Aug 30, 2018
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging a Substrate with an LED into an Interconnect Structure On...
- Publication number 20170338209
- Publication date Nov 23, 2017
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FREE LED PACKAGE
- Publication number 20170244008
- Publication date Aug 24, 2017
- BRIDGELUX, INC.
- Mike Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging a Substrate with an LED into an Interconnect Structure On...
- Publication number 20170221865
- Publication date Aug 3, 2017
- Bridgelux, Inc.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging a Substrate with an LED into an Interconnect Structure On...
- Publication number 20160197061
- Publication date Jul 7, 2016
- BRIDGELUX, INC.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Photon Building Blocks Having Only Top Side Connections I...
- Publication number 20150333045
- Publication date Nov 19, 2015
- BRIDGELUX, INC.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FREE LED PACKAGE
- Publication number 20140197430
- Publication date Jul 17, 2014
- BRIDGELUX, INC.
- Mike Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Photon Building Blocks Having Only Top Side Connections I...
- Publication number 20140131747
- Publication date May 15, 2014
- BRIDGELUX, INC.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Free LED Package
- Publication number 20140077235
- Publication date Mar 20, 2014
- BRIDGELUX, INC.
- Mike Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-Bead Blasting Process for Removing a Silicone Flash Layer
- Publication number 20140048832
- Publication date Feb 20, 2014
- BRIDGELUX, INC.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-BEAD BLASTING PROCESS FOR REMOVING A SILICONE FLASH LAYER
- Publication number 20130337592
- Publication date Dec 19, 2013
- BRIDGELUX, INC.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro-Bead Blasting Process for Removing a Silicone Flash Layer
- Publication number 20130134459
- Publication date May 30, 2013
- BRIDGELUX, INC.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Photon Building Blocks Having Only Top Side Connections i...
- Publication number 20120187430
- Publication date Jul 26, 2012
- BRIDGELUX, INC.
- R. Scott West
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Packaging a substrate with an LED into an interconnect structure on...

Packaging a substrate with an LED into an interconnect structure on...

Packaging a substrate with an LED into an interconnect structure on...

Packaging a substrate with an LED into an interconnect structure on...

Substrate free LED package

Packaging photon building blocks having only top side connections i...

Packaging photon building blocks having only top side connections i...

Micro-bead blasting process for removing a silicone flash layer

Substrate free LED package

Packaging photon building blocks having only top side connections i...

Micro-bead blasting process for removing a silicone flash layer

Micro-bead blasting process for removing a silicone flash layer

Patents Applicationslast 30 patents

Packaging a Substrate with an LED into an Interconnect Structure On...

Packaging a Substrate with an LED into an Interconnect Structure On...

SUBSTRATE FREE LED PACKAGE

Packaging a Substrate with an LED into an Interconnect Structure On...

Packaging a Substrate with an LED into an Interconnect Structure On...

Packaging Photon Building Blocks Having Only Top Side Connections I...

SUBSTRATE FREE LED PACKAGE

Packaging Photon Building Blocks Having Only Top Side Connections I...

Substrate Free LED Package

Micro-Bead Blasting Process for Removing a Silicone Flash Layer

MICRO-BEAD BLASTING PROCESS FOR REMOVING A SILICONE FLASH LAYER

Micro-Bead Blasting Process for Removing a Silicone Flash Layer

Packaging Photon Building Blocks Having Only Top Side Connections i...