Mikhail Pevzner

Person

Woburn, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ball bond impedance matching
- Patent number 12,266,629
- Issue date Apr 1, 2025
- Raytheon Company
- Patrick E. Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collapsible dielectric standoff
- Patent number 12,249,752
- Issue date Mar 11, 2025
- Raytheon Company
- Channing Paige Favreau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board automated layup system
- Patent number 11,653,484
- Issue date May 16, 2023
- Raytheon Company
- Mikhail Pevzner
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for forming channels in printed circuit boards by stacking s...
- Patent number 11,606,865
- Issue date Mar 14, 2023
- Raytheon Company
- Mikhail Pevzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing non-planar arrays with a single flex-hybri...
- Patent number 11,497,118
- Issue date Nov 8, 2022
- Raytheon Company
- Channing Paige Favreau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating Z-axis vertical launch
- Patent number 11,470,725
- Issue date Oct 11, 2022
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
PCB cavity mode suppression
- Patent number 11,317,502
- Issue date Apr 26, 2022
- Raytheon Company
- Thomas V. Sikina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for removing bond film from cavities in printed circuit boards
- Patent number 11,171,101
- Issue date Nov 9, 2021
- Raytheon Company
- James E. Benedict
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation of solder bump for compatibility with printed electroni...
- Patent number 11,122,692
- Issue date Sep 14, 2021
- Raytheon Company
- James E. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for fabricating Z-axis vertical launch within a printed c...
- Patent number 11,109,489
- Issue date Aug 31, 2021
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Method of wire bonding a first and second circuit card
- Patent number 10,999,938
- Issue date May 4, 2021
- Raytheon Company
- Mikhail Pevzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING CHANNELS IN PRINTED CIRCUIT BOARDS BY STACKING S...
- Publication number 20230209728
- Publication date Jun 29, 2023
- Raytheon Company
- Mikhail Pevzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLLAPSIBLE DIELECTRIC STANDOFF
- Publication number 20230170599
- Publication date Jun 1, 2023
- Raytheon Company
- Channing Paige Favreau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING NON-PLANAR ARRAYS WITH A SINGLE FLEX-HYBRI...
- Publication number 20220264745
- Publication date Aug 18, 2022
- Raytheon Company
- Channing Paige Favreau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL BOND IMPEDANCE MATCHING
- Publication number 20220254750
- Publication date Aug 11, 2022
- Raytheon Company
- Patrick E. Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREPARATION OF SOLDER BUMP FOR COMPATIBILITY WITH PRINTED ELECTRONI...
- Publication number 20210400820
- Publication date Dec 23, 2021
- Raytheon Company
- James E. Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH
- Publication number 20210368629
- Publication date Nov 25, 2021
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
PCB CAVITY MODE SUPPRESSION
- Publication number 20210360772
- Publication date Nov 18, 2021
- Raytheon Company
- Thomas V. Sikina
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR REMOVING BOND FILM FROM CAVITIES IN PRINTED CIRCUIT BOARDS
- Publication number 20210305187
- Publication date Sep 30, 2021
- Raytheon Company
- James E. Benedict
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AUTOMATED LAYUP SYSTEM
- Publication number 20210144892
- Publication date May 13, 2021
- Raytheon Company
- Mikhail Pevzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING CHANNELS IN PRINTED CIRCUIT BOARDS BY STACKING S...
- Publication number 20210144864
- Publication date May 13, 2021
- Raytheon Company
- Mikhail Pevzner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH
- Publication number 20210051805
- Publication date Feb 18, 2021
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

Mikhail Pevzner

Person

Patents Grantslast 30 patents

Ball bond impedance matching

Collapsible dielectric standoff

Printed circuit board automated layup system

Method for forming channels in printed circuit boards by stacking s...

Method for manufacturing non-planar arrays with a single flex-hybri...

Method for fabricating Z-axis vertical launch

PCB cavity mode suppression

Process for removing bond film from cavities in printed circuit boards

Preparation of solder bump for compatibility with printed electroni...

Apparatus for fabricating Z-axis vertical launch within a printed c...

Method of wire bonding a first and second circuit card

Patents Applicationslast 30 patents

METHOD FOR FORMING CHANNELS IN PRINTED CIRCUIT BOARDS BY STACKING S...

COLLAPSIBLE DIELECTRIC STANDOFF

METHOD FOR MANUFACTURING NON-PLANAR ARRAYS WITH A SINGLE FLEX-HYBRI...

BALL BOND IMPEDANCE MATCHING

PREPARATION OF SOLDER BUMP FOR COMPATIBILITY WITH PRINTED ELECTRONI...

SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH

PCB CAVITY MODE SUPPRESSION

PROCESS FOR REMOVING BOND FILM FROM CAVITIES IN PRINTED CIRCUIT BOARDS

PRINTED CIRCUIT BOARD AUTOMATED LAYUP SYSTEM

METHOD FOR FORMING CHANNELS IN PRINTED CIRCUIT BOARDS BY STACKING S...

SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH