Mikhail Tuzov

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Mitaka-Shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wafer polishing apparatus
- Patent number 6,648,739
- Issue date Nov 18, 2003
- Tokyo Seimitsu Co., Ltd.
- Hirohiko Izumi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Wafer polishing apparatus
- Publication number 20020004361
- Publication date Jan 10, 2002
- Hirohiko Izumi
- B24 - GRINDING POLISHING