Miki Hayashi

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 8,912,665
- Issue date Dec 16, 2014
- Nitto Denko Corporation
- Miki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bond film, dicing die bond film, and semiconductor device
- Patent number 8,779,586
- Issue date Jul 15, 2014
- Nitto Denko Corporation
- Kenji Oonishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing tape-integrated film for semiconductor back surface
- Patent number 8,415,201
- Issue date Apr 9, 2013
- Nitto Denko Corporation
- Miki Hayashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTING SEMICONDUCTOR ELEMENT
- Publication number 20220228037
- Publication date Jul 21, 2022
- Nitto Denko Corporation
- Taiki UENO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
- Publication number 20130108847
- Publication date May 2, 2013
- Nitto Denko Corporation
- Miki HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING DIE-BONDING FILM
- Publication number 20120153508
- Publication date Jun 21, 2012
- NITTO DENKO CORPORATION
- Miki Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIE BOND FILM, DICING DIE BOND FILM, AND SEMICONDUCTOR DEVICE
- Publication number 20110210455
- Publication date Sep 1, 2011
- Kenji Oonishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOSETTING DIE BONDING FILM, DICING DIE BONDING FILM AND SEMICON...
- Publication number 20110057331
- Publication date Mar 10, 2011
- Miki Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
- Publication number 20100314781
- Publication date Dec 16, 2010
- Nitto Denko Corporation
- Miki HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS

Miki Hayashi

Person

Patents Grantslast 30 patents

Dicing tape-integrated film for semiconductor back surface

Die bond film, dicing die bond film, and semiconductor device

Dicing tape-integrated film for semiconductor back surface

Patents Applicationslast 30 patents

PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTING SEMICONDUCTOR ELEMENT

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

THERMOSETTING DIE-BONDING FILM

DIE BOND FILM, DICING DIE BOND FILM, AND SEMICONDUCTOR DEVICE

THERMOSETTING DIE BONDING FILM, DICING DIE BONDING FILM AND SEMICON...

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE