Miki MORITA

Person

Ibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Dicing die bond film
- Patent number 9,123,794
- Issue date Sep 1, 2015
- Nitto Denko Corporation
- Yasuhiro Amano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Film for the backside of flip-chip type semiconductor, dicing tape-...
- Patent number 8,841,757
- Issue date Sep 23, 2014
- Nitto Denko Corporation
- Daisuke Uenda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing film for semiconductor device
- Patent number 8,658,515
- Issue date Feb 25, 2014
- Nitto Denko Corporation
- Koichi Inoue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
DICING DIE BOND FILM
- Publication number 20140057100
- Publication date Feb 27, 2014
- Nitto Denko Corporation
- Yasuhiro Amano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIE-BONDING FILM AND USE THEREOF
- Publication number 20120231583
- Publication date Sep 13, 2012
- Kenji ONISHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF MANUFACTURING FILM FOR SEMICONDUCTOR DEVICE
- Publication number 20120231557
- Publication date Sep 13, 2012
- Koichi INOUE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FILM FOR THE BACKSIDE OF FLIP-CHIP TYPE SEMICONDUCTOR, DICING TAPE-...
- Publication number 20120126380
- Publication date May 24, 2012
- Daisuke UENDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20120126381
- Publication date May 24, 2012
- Daisuke UENDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BO...
- Publication number 20120126379
- Publication date May 24, 2012
- Daisuke UENDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING DIE BOND FILM
- Publication number 20120061805
- Publication date Mar 15, 2012
- Yasuhiro AMANO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20120058625
- Publication date Mar 8, 2012
- Yasuhiro AMANO
- H01 - BASIC ELECTRIC ELEMENTS

Miki MORITA

Person

Patents Grantslast 30 patents

Dicing die bond film

Film for the backside of flip-chip type semiconductor, dicing tape-...

Method of manufacturing film for semiconductor device

Patents Applicationslast 30 patents

DICING DIE BOND FILM

DIE-BONDING FILM AND USE THEREOF

METHOD OF MANUFACTURING FILM FOR SEMICONDUCTOR DEVICE

FILM FOR THE BACKSIDE OF FLIP-CHIP TYPE SEMICONDUCTOR, DICING TAPE-...

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BO...

DICING DIE BOND FILM

FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE