Mikihiro Ogura

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor joining substrate utilizing a tape with adhesive and...
- Patent number 6,982,484
- Issue date Jan 3, 2006
- Toray Industries, Inc.
- Mikihiro Ogura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor joining substrate - use tape with adhesive and copper...
- Publication number 20030031867
- Publication date Feb 13, 2003
- Mikihiro Ogura
- H01 - BASIC ELECTRIC ELEMENTS