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Mikio Komiyama
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Yokohama, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Die-sorting sheet and method for transporting chips having adhesive...
Patent number
8,587,130
Issue date
Nov 19, 2013
Lintec Corporation
Akie Hamasaki
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Adhesive tape, base material for adhesive tape and their manufactur...
Patent number
6,139,953
Issue date
Oct 31, 2000
Lintec Corporation
Kouichi Nagamoto
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Cover tape and coating applicator
Patent number
5,691,038
Issue date
Nov 25, 1997
Lintec Corporation
Akira Hirata
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Adhesive composition comprising (meth)acrylate polymer and epoxy resin
Patent number
5,356,949
Issue date
Oct 18, 1994
Lintec Corporation
Mikio Komiyama
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Adhesive tape and use thereof
Patent number
5,118,567
Issue date
Jun 2, 1992
Lintec Corporation
Mikio Komiyama
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Method of dicing and bonding semiconductor chips using a photocurab...
Patent number
5,110,388
Issue date
May 5, 1992
Lintec Corporation
Mikio Komiyama
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Patents Applications
last 30 patents
Information
Patent Application
Die-Sorting Sheet and Method for Transporting Chips Having Adhesive...
Publication number
20100311226
Publication date
Dec 9, 2010
LINTEC CORPORATION
Akie Hamasaki
H01 - BASIC ELECTRIC ELEMENTS