Mikio Watanabe

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Shizuoka-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming copper distributing wires
- Patent number 8,034,403
- Issue date Oct 11, 2011
- ULVAC, Inc.
- Mikio Watanabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method for forming copper distributing wires
- Publication number 20100291290
- Publication date Nov 18, 2010
- Mikio Watanabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Process for formation of copper-containing films
- Publication number 20090098290
- Publication date Apr 16, 2009
- Mikio Watanabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...