Milad MOSTOFIZADEH

Person

Muenchen, DE

People

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...
- Publication number 20250218914
- Publication date Jul 3, 2025
- INFINEON TECHNOLOGIES AG
- Hao ZHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH INCREASED ROUTING CAPABILITY
- Publication number 20250157895
- Publication date May 15, 2025
- Infineon Technologies Austria AG
- Hao Zhuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING TOPSIDE COOLED SEMICONDUCTOR PACKAGES BY FIL...
- Publication number 20250054831
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES
- Publication number 20240355772
- Publication date Oct 24, 2024
- INFINEON TECHNOLOGIES AG
- Suhaimi Azizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A LATERAL POWER TRANSISTOR
- Publication number 20240162136
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Kok Yau Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Segmented Leadframe for Flip Chip Attaching a Semiconductor Die Inc...
- Publication number 20230108181
- Publication date Apr 6, 2023
- Michael Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH CASTELLATED BOARD
- Publication number 20220377901
- Publication date Nov 24, 2022
- INFINEON TECHNOLOGIES AG
- Tomasz NAEVE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Milad MOSTOFIZADEH

Person

Patents Applicationslast 30 patents

PACKAGE WITH COMPONENT-CARRYING INTERMEDIATE STRUCTURE AND ADDITION...

LEADFRAME PACKAGE WITH INCREASED ROUTING CAPABILITY

METHOD FOR FABRICATING TOPSIDE COOLED SEMICONDUCTOR PACKAGES BY FIL...

ELECTRICAL CONNECTION ELEMENT WITH OUTGASSING GROOVES

PACKAGE FOR A LATERAL POWER TRANSISTOR

Segmented Leadframe for Flip Chip Attaching a Semiconductor Die Inc...

ELECTRONIC DEVICE WITH CASTELLATED BOARD