Milan Djukic

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Electronic assemblies and systems with filled no-flow underfill
- Patent number 7,498,678
- Issue date Mar 3, 2009
- Intel Corporation
- Carlos A. Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies with filled no-flow underfill
- Patent number 7,323,360
- Issue date Jan 29, 2008
- Intel Corporation
- Carlos A. Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill process for flip-chip device
- Patent number 6,703,299
- Issue date Mar 9, 2004
- Intel Corporation
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC ASSEMBLIES AND SYSTEMS WITH FILLED NO-FLOW UNDERFILL
- Publication number 20070278655
- Publication date Dec 6, 2007
- Intel Corporation
- Carlos A. Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill process for flip-chip device
- Publication number 20040159945
- Publication date Aug 19, 2004
- Intel Corporation
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underfill process for flip-chip device
- Publication number 20030116864
- Publication date Jun 26, 2003
- Intel Corporation
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with filled no-flow underfill and methods of ma...
- Publication number 20030080437
- Publication date May 1, 2003
- Intel Corporation
- Carlos A. Gonzalez
- H01 - BASIC ELECTRIC ELEMENTS