Milan Paunovic

Person

Port Washington, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure comprising an interlayer of palladium and/or platinum and...
- Patent number 6,911,229
- Issue date Jun 28, 2005
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing copper onto a barrier layer
- Patent number 6,416,812
- Issue date Jul 9, 2002
- International Business Machines Corporation
- Panayotis Andricacos
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper seed layer repair technique using electroless touch-up
- Patent number 6,395,164
- Issue date May 28, 2002
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Production of electroless Co(P) with designed coercivity
- Patent number 6,197,364
- Issue date Mar 6, 2001
- International Business Machines Corporation
- Milan Paunovic
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Identification tags using amorphous wire
- Patent number 5,729,201
- Issue date Mar 17, 1998
- International Business Machines Corporation
- Christopher Jahnes
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Palladium sulfate solution for the selective seeding of the metal i...
- Patent number 5,380,560
- Issue date Jan 10, 1995
- International Business Machines Corporation
- Suryanarayana Kaja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Barrier improvement in thin films
- Patent number 5,294,486
- Issue date Mar 15, 1994
- International Business Machines Corporation
- Milan Paunovic
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless deposition for IC fabrication
- Patent number 5,169,680
- Issue date Dec 8, 1992
- Intel Corporation
- Chiu H. Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of consistently producing a copper deposit on a substrate by...
- Patent number 4,908,242
- Issue date Mar 13, 1990
- Kollmorgen Corporation
- Rowan Hughes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Control of electroless plating baths
- Patent number 4,814,197
- Issue date Mar 21, 1989
- Kollmorgen Corporation
- John Duffy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Heat shock resistant printed circuit board assemblies
- Patent number 4,303,798
- Issue date Dec 1, 1981
- Kollmorgen Technologies Corporation
- Milan Paunovic
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE COMPRISING A BARRIER LAYER OF A TUNGSTEN ALLOY COMPRISING...
- Publication number 20080237053
- Publication date Oct 2, 2008
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Tungsten encapsulated copper interconnections using electroplating
- Publication number 20050269708
- Publication date Dec 8, 2005
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure comprising an interlayer of palladium and/or platinum and...
- Publication number 20050006777
- Publication date Jan 13, 2005
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure comprising a barrier layer of a tungsten alloy comprising...
- Publication number 20040108136
- Publication date Jun 10, 2004
- International Business Machines Corporation
- Panayotis Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Structure comprising an interlayer of palladium and/or platinum and...
- Publication number 20040028882
- Publication date Feb 12, 2004
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tungsten encapsulated copper interconnections using electroplating
- Publication number 20020092673
- Publication date Jul 18, 2002
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS

Milan Paunovic

Person

Patents Grantslast 30 patents

Structure comprising an interlayer of palladium and/or platinum and...

Method for depositing copper onto a barrier layer

Copper seed layer repair technique using electroless touch-up

Production of electroless Co(P) with designed coercivity

Identification tags using amorphous wire

Palladium sulfate solution for the selective seeding of the metal i...

Barrier improvement in thin films

Electroless deposition for IC fabrication

Method of consistently producing a copper deposit on a substrate by...

Control of electroless plating baths

Heat shock resistant printed circuit board assemblies

Patents Applicationslast 30 patents

STRUCTURE COMPRISING A BARRIER LAYER OF A TUNGSTEN ALLOY COMPRISING...

Tungsten encapsulated copper interconnections using electroplating

Structure comprising an interlayer of palladium and/or platinum and...

Structure comprising a barrier layer of a tungsten alloy comprising...

Structure comprising an interlayer of palladium and/or platinum and...

Tungsten encapsulated copper interconnections using electroplating