Milind S. Bhagavat

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Offset-aligned three-dimensional integrated circuit
- Patent number 11,855,061
- Issue date Dec 26, 2023
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
GPU chiplets using high bandwidth crosslinks
- Patent number 11,841,803
- Issue date Dec 12, 2023
- Advanced Micro Devices, Inc.
- Skyler J. Saleh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board with compact passive component arrangement
- Patent number 11,837,588
- Issue date Dec 5, 2023
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for low temperature hybrid bonding
- Patent number 11,810,891
- Issue date Nov 7, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheme for enabling die reuse in 3D stacked products
- Patent number 11,804,479
- Issue date Oct 31, 2023
- Advanced Micro Devices, Inc.
- John J. Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package with reinforcing rivets
- Patent number 11,742,301
- Issue date Aug 29, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with integrated voltage regulator
- Patent number 11,715,691
- Issue date Aug 1, 2023
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with reduced pitch conductive pillars
- Patent number 11,676,924
- Issue date Jun 13, 2023
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit module with integrated discrete devices
- Patent number 11,670,624
- Issue date Jun 6, 2023
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bridged fanout chiplet connectivity
- Patent number 11,658,123
- Issue date May 23, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with compact passive component arrangement
- Patent number 11,495,588
- Issue date Nov 8, 2022
- Advanced Micro Devices, Inc.
- Milind Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multirow semiconductor chip connections
- Patent number 11,469,183
- Issue date Oct 11, 2022
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset-aligned three-dimensional integrated circuit
- Patent number 11,437,359
- Issue date Sep 6, 2022
- Advanced Micro Devices, Inc.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip gettering
- Patent number 11,393,697
- Issue date Jul 19, 2022
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded chip package with anchor structures
- Patent number 11,367,628
- Issue date Jun 21, 2022
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with solder cap probe test pads
- Patent number 11,309,222
- Issue date Apr 19, 2022
- Advanced Micro Devices, Inc.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded die last chip combination
- Patent number 11,211,332
- Issue date Dec 28, 2021
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 11,189,540
- Issue date Nov 30, 2021
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement and thermal management of 3D stacked dies
- Patent number 11,164,807
- Issue date Nov 2, 2021
- Advanced Micro Devices, Inc.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with offset 3D structure
- Patent number 11,018,125
- Issue date May 25, 2021
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple-die integrated circuit with integrated voltage regulator
- Patent number 11,011,495
- Issue date May 18, 2021
- Advanced Micro Devices, Inc.
- Milind Bhagavat
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integrated circuit package with integrated voltage regulator
- Patent number 11,011,466
- Issue date May 18, 2021
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical encoder with direction-dependent optical properties compris...
- Patent number 11,002,572
- Issue date May 11, 2021
- Apple Inc.
- Paisith P. Boonsom
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor chip with reduced pitch conductive pillars
- Patent number 10,943,880
- Issue date Mar 9, 2021
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads for low temperature hybrid bonding
- Patent number 10,937,755
- Issue date Mar 2, 2021
- Advanced Micro Devices, Inc.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stacking for multi-tier 3D integration
- Patent number 10,930,621
- Issue date Feb 23, 2021
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density cross link die with polymer routing layer
- Patent number 10,923,430
- Issue date Feb 16, 2021
- Advanced Micro Devices, Inc.
- Chun-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-RDL structure packages and methods of fabricating the same
- Patent number 10,903,168
- Issue date Jan 26, 2021
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit module with integrated discrete devices
- Patent number 10,867,978
- Issue date Dec 15, 2020
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip gettering
- Patent number 10,825,692
- Issue date Nov 3, 2020
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GPU CHIPLETS USING HIGH BANDWIDTH CROSSLINKS
- Publication number 20240330196
- Publication date Oct 3, 2024
- ADVANCED MICRO DEVICES, INC.
- Skyler J. SALEH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS
- Publication number 20240063206
- Publication date Feb 22, 2024
- ADVANCED MICRO DEVICES, INC.
- John J. Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH COMPACT PASSIVE COMPONENT ARRANGEMENT
- Publication number 20230047285
- Publication date Feb 16, 2023
- ADVANCED MICRO DEVICES, INC.
- MILIND S. BHAGAVAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20220392882
- Publication date Dec 8, 2022
- ADVANCED MICRO DEVICES, INC.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES
- Publication number 20220319871
- Publication date Oct 6, 2022
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIROW SEMICONDUCTOR CHIP CONNECTIONS
- Publication number 20220189879
- Publication date Jun 16, 2022
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BRIDGED FANOUT CHIPLET CONNECTIVITY
- Publication number 20220102276
- Publication date Mar 31, 2022
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES
- Publication number 20220059425
- Publication date Feb 24, 2022
- ADVANCED MICRO DEVICES, INC.
- John Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED VOLTAGE REGULATOR
- Publication number 20210313269
- Publication date Oct 7, 2021
- ADVANCED MICRO DEVICES, INC.
- MILIND S. BHAGAVAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR CHIP PACKAGE WITH STAIR-STEP MOLDING LAYER
- Publication number 20210296194
- Publication date Sep 23, 2021
- ADVANCED MICRO DEVICES, INC.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS
- Publication number 20210193604
- Publication date Jun 24, 2021
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20210183810
- Publication date Jun 17, 2021
- ADVANCED MICRO DEVICES, INC.
- PRIYAL SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING ACTIVE-BRIDGE-COUPLED GPU CHIPLETS
- Publication number 20210098419
- Publication date Apr 1, 2021
- ADVANCED MICRO DEVICES, INC.
- Skyler J. SALEH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS
- Publication number 20210098441
- Publication date Apr 1, 2021
- ADVANCED MICRO DEVICES, INC.
- John J. Wuu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MODULE WITH INTEGRATED DISCRETE DEVICES
- Publication number 20210098437
- Publication date Apr 1, 2021
- ADVANCED MICRO DEVICES, INC.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH SOLDER CAP PROBE TEST PADS
- Publication number 20210066144
- Publication date Mar 4, 2021
- ADVANCED MICRO DEVICES, INC.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE WITH REINFORCING RIVETS
- Publication number 20210057352
- Publication date Feb 25, 2021
- ADVANCED MICRO DEVICES, INC.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP GETTERING
- Publication number 20210050223
- Publication date Feb 18, 2021
- ADVANCED MICRO DEVICES, INC.
- RAHUL AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES
- Publication number 20210020459
- Publication date Jan 21, 2021
- ADVANCED MICRO DEVICES, INC.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY CROSS LINK DIE WITH POLYMER ROUTING LAYER
- Publication number 20200411443
- Publication date Dec 31, 2020
- ADVANCED MICRO DEVICES, INC.
- Fei Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GPU CHIPLETS USING HIGH BANDWIDTH CROSSLINKS
- Publication number 20200409859
- Publication date Dec 31, 2020
- ADVANCED MICRO DEVICES, INC.
- Skyler J. SALEH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS
- Publication number 20200365543
- Publication date Nov 19, 2020
- ADVANCED MICRO DEVICES, INC.
- Priyal Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING FOR MULTI-TIER 3D INTEGRATION
- Publication number 20200350292
- Publication date Nov 5, 2020
- ADVANCED MICRO DEVICES, INC.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH OFFSET 3D STRUCTURE
- Publication number 20200343236
- Publication date Oct 29, 2020
- ADVANCED MICRO DEVICES, INC.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED VOLTAGE REGULATOR
- Publication number 20200312766
- Publication date Oct 1, 2020
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-RDL STRUCTURE PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20200294923
- Publication date Sep 17, 2020
- ADVANCED MICRO DEVICES, INC.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGES WITH WARPAGE RESISTANCE
- Publication number 20200294914
- Publication date Sep 17, 2020
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ENCODER WITH DIRECTION-DEPENDENT OPTICAL PROPERTIES
- Publication number 20200271483
- Publication date Aug 27, 2020
- Apple Inc.
- Paisith P. Boonsom
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP GETTERING
- Publication number 20200203177
- Publication date Jun 25, 2020
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT
- Publication number 20200194413
- Publication date Jun 18, 2020
- ADVANCED MICRO DEVICES, INC.
- Brett P. Wilkerson
- H01 - BASIC ELECTRIC ELEMENTS

Milind S. Bhagavat

Person

Patents Grantslast 30 patents

Offset-aligned three-dimensional integrated circuit

GPU chiplets using high bandwidth crosslinks

Circuit board with compact passive component arrangement

Bond pads for low temperature hybrid bonding

Scheme for enabling die reuse in 3D stacked products

Fan-out package with reinforcing rivets

Integrated circuit package with integrated voltage regulator

Semiconductor chip with reduced pitch conductive pillars

Integrated circuit module with integrated discrete devices

Hybrid bridged fanout chiplet connectivity

Circuit board with compact passive component arrangement

Multirow semiconductor chip connections

Offset-aligned three-dimensional integrated circuit

Semiconductor chip gettering

Molded chip package with anchor structures

Semiconductor chip with solder cap probe test pads

Molded die last chip combination

Arrangement and thermal management of 3D stacked dies

Arrangement and thermal management of 3D stacked dies

Multi-chip package with offset 3D structure

Multiple-die integrated circuit with integrated voltage regulator

Integrated circuit package with integrated voltage regulator

Optical encoder with direction-dependent optical properties compris...

Semiconductor chip with reduced pitch conductive pillars

Bond pads for low temperature hybrid bonding

Die stacking for multi-tier 3D integration

High density cross link die with polymer routing layer

Multi-RDL structure packages and methods of fabricating the same

Integrated circuit module with integrated discrete devices

Semiconductor chip gettering

Patents Applicationslast 30 patents

GPU CHIPLETS USING HIGH BANDWIDTH CROSSLINKS

SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS

CIRCUIT BOARD WITH COMPACT PASSIVE COMPONENT ARRANGEMENT

OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT

MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES

MULTIROW SEMICONDUCTOR CHIP CONNECTIONS

HYBRID BRIDGED FANOUT CHIPLET CONNECTIVITY

ARRANGEMENT AND THERMAL MANAGEMENT OF 3D STACKED DIES

INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED VOLTAGE REGULATOR

MOLDED SEMICONDUCTOR CHIP PACKAGE WITH STAIR-STEP MOLDING LAYER

SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS

BOND PADS FOR LOW TEMPERATURE HYBRID BONDING

FABRICATING ACTIVE-BRIDGE-COUPLED GPU CHIPLETS

SCHEME FOR ENABLING DIE REUSE IN 3D STACKED PRODUCTS

INTEGRATED CIRCUIT MODULE WITH INTEGRATED DISCRETE DEVICES

SEMICONDUCTOR CHIP WITH SOLDER CAP PROBE TEST PADS

FAN-OUT PACKAGE WITH REINFORCING RIVETS

SEMICONDUCTOR CHIP GETTERING

MOLDED CHIP PACKAGE WITH ANCHOR STRUCTURES

HIGH DENSITY CROSS LINK DIE WITH POLYMER ROUTING LAYER

GPU CHIPLETS USING HIGH BANDWIDTH CROSSLINKS

SEMICONDUCTOR CHIP WITH REDUCED PITCH CONDUCTIVE PILLARS

DIE STACKING FOR MULTI-TIER 3D INTEGRATION

MULTI-CHIP PACKAGE WITH OFFSET 3D STRUCTURE

INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED VOLTAGE REGULATOR

MULTI-RDL STRUCTURE PACKAGES AND METHODS OF FABRICATING THE SAME

FAN-OUT PACKAGES WITH WARPAGE RESISTANCE

OPTICAL ENCODER WITH DIRECTION-DEPENDENT OPTICAL PROPERTIES

SEMICONDUCTOR CHIP GETTERING

OFFSET-ALIGNED THREE-DIMENSIONAL INTEGRATED CIRCUIT