Milind S. Bhagavat

Person

St. Louis, MO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and system for CMOS based MEMS bump stop contact damage prev...
- Patent number 9,850,127
- Issue date Dec 26, 2017
- Apple Inc.
- Milind S. Bhagavat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for CMOS based MEMS bump stop contact damage prev...
- Patent number 9,751,756
- Issue date Sep 5, 2017
- Apple Inc.
- Milind S. Bhagavat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS in-plane resonators
- Patent number 8,593,155
- Issue date Nov 26, 2013
- Analog Devices, Inc.
- Andrew Sparks
- G01 - MEASURING TESTING
Information Patent Grant
Methods of grinding semiconductor wafers having improved nanotopology
- Patent number 8,267,745
- Issue date Sep 18, 2012
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer clamping device for a double side grinder
- Patent number 8,066,553
- Issue date Nov 29, 2011
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Method for capping a MEMS wafer
- Patent number 8,058,144
- Issue date Nov 15, 2011
- Analog Devices, Inc.
- Milind Bhagavat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capped wafer method and apparatus
- Patent number 7,981,723
- Issue date Jul 19, 2011
- Analog Devices, Inc.
- Xue'en Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for assessing workpiece nanotopology using a double side waf...
- Patent number 7,927,185
- Issue date Apr 19, 2011
- MEMC Electronic Materials, Inc.
- Roland R. Vandamme
- B24 - GRINDING POLISHING
Information Patent Grant
Double side wafer grinder and methods for assessing workpiece nanot...
- Patent number 7,662,023
- Issue date Feb 16, 2010
- MEMC Electronic Materials, Inc.
- Ronald D. Vandamme
- B24 - GRINDING POLISHING
Information Patent Grant
Double side wafer grinder and methods for assessing workpiece nanot...
- Patent number 7,601,049
- Issue date Oct 13, 2009
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Grant
Method of estimating post-polishing waviness characteristics of a s...
- Patent number 6,613,591
- Issue date Sep 2, 2003
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR CMOS BASED MEMS BUMP STOP CONTACT DAMAGE PREV...
- Publication number 20170355599
- Publication date Dec 14, 2017
- Apple Inc.
- Milind S. Bhagavat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR CMOS BASED MEMS BUMP STOP CONTACT DAMAGE PREV...
- Publication number 20150291413
- Publication date Oct 15, 2015
- Apple Inc.
- Milind S. Bhagavat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS In-Plane Resonators
- Publication number 20120112765
- Publication date May 10, 2012
- Analog Devices, Inc.
- Andrew Sparks
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Methods of Grinding Semiconductor Wafers Having Improved Nanotopology
- Publication number 20110101504
- Publication date May 5, 2011
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
Capped Wafer Method and Apparatus
- Publication number 20100117221
- Publication date May 13, 2010
- Analog Devices, Inc.
- Xue'en Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method For Assessing Workpiece Nanotopology Using A Double Side Waf...
- Publication number 20100087123
- Publication date Apr 8, 2010
- MEMC Electronic Materials, Inc.
- Roland R. Vandamme
- B24 - GRINDING POLISHING
Information Patent Application
Method for Capping a MEMS Wafer
- Publication number 20090294879
- Publication date Dec 3, 2009
- Analog Devices, Inc.
- Milind Bhagavat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer Clamping Device For A Double Side Grinder
- Publication number 20080020684
- Publication date Jan 24, 2008
- MEMC ELECTRONIC MATERIALS, INCORPORATED
- Milind S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
Double side wafer grinder and methods for assessing workpiece nanot...
- Publication number 20070179660
- Publication date Aug 2, 2007
- MEMC Electronic Materials, Inc.
- Sumeet S. Bhagavat
- B24 - GRINDING POLISHING
Information Patent Application
Double side wafer grinder and methods for assessing workpiece nanot...
- Publication number 20070179659
- Publication date Aug 2, 2007
- MEMC Electronic Materials, Inc.
- Roland D. Vandamme
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for slicing semiconductor wafers
- Publication number 20030170948
- Publication date Sep 11, 2003
- MEMC Electronic Materials, Inc.
- Milind S. Bhagavat
- B28 - WORKING CEMENT, CLAY, OR STONE

Milind S. Bhagavat

Person

Patents Grantslast 30 patents

Method and system for CMOS based MEMS bump stop contact damage prev...

Method and system for CMOS based MEMS bump stop contact damage prev...

MEMS in-plane resonators

Methods of grinding semiconductor wafers having improved nanotopology

Wafer clamping device for a double side grinder

Method for capping a MEMS wafer

Capped wafer method and apparatus

Method for assessing workpiece nanotopology using a double side waf...

Double side wafer grinder and methods for assessing workpiece nanot...

Double side wafer grinder and methods for assessing workpiece nanot...

Method of estimating post-polishing waviness characteristics of a s...

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR CMOS BASED MEMS BUMP STOP CONTACT DAMAGE PREV...

METHOD AND SYSTEM FOR CMOS BASED MEMS BUMP STOP CONTACT DAMAGE PREV...

MEMS In-Plane Resonators

Methods of Grinding Semiconductor Wafers Having Improved Nanotopology

Capped Wafer Method and Apparatus

Method For Assessing Workpiece Nanotopology Using A Double Side Waf...

Method for Capping a MEMS Wafer

Wafer Clamping Device For A Double Side Grinder

Double side wafer grinder and methods for assessing workpiece nanot...

Double side wafer grinder and methods for assessing workpiece nanot...

Method and apparatus for slicing semiconductor wafers