Milind Shah

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid reconstituted substrate for electronic packaging
- Patent number 12,046,545
- Issue date Jul 23, 2024
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor assembly for high capacitance density
- Patent number 11,894,366
- Issue date Feb 6, 2024
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising an inductor and a capacitor located in an enca...
- Patent number 11,817,379
- Issue date Nov 14, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with a substrate comprising protruding pad interconnects
- Patent number 11,776,888
- Issue date Oct 3, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-module L-shaped millimeter wave antenna-in-package
- Patent number 11,764,489
- Issue date Sep 19, 2023
- QUALCOMM Incorporated
- Milind Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising stacked filters with a shared substrate cap
- Patent number 11,689,181
- Issue date Jun 27, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly with hybrid bonding
- Patent number 11,670,614
- Issue date Jun 6, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench capacitor assembly for high capacitance density
- Patent number 11,652,101
- Issue date May 16, 2023
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked decoupling capacitors with integration in a substrate
- Patent number 11,417,637
- Issue date Aug 16, 2022
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulation integrated circuit (IC) with circuit components...
- Patent number 11,320,847
- Issue date May 3, 2022
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance matching transceiver
- Patent number 11,296,670
- Issue date Apr 5, 2022
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-module L-shaped millimeter wave antenna-in-package
- Patent number 11,239,573
- Issue date Feb 1, 2022
- QUALCOMM Incorporated
- Milind Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising contact to contact coupling of packages
- Patent number 11,201,127
- Issue date Dec 14, 2021
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device coupled to a capacitor structure comprising a tre...
- Patent number 11,189,686
- Issue date Nov 30, 2021
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with a magnetic core
- Patent number 11,101,228
- Issue date Aug 24, 2021
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising embedded package on package (PoP) device
- Patent number 10,510,733
- Issue date Dec 17, 2019
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising embedded package on package (PoP) device
- Patent number 10,163,871
- Issue date Dec 25, 2018
- QUALCOMM Incorporated
- Rajneesh Kumar
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated device package comprising photo sensitive fill between a...
- Patent number 10,037,941
- Issue date Jul 31, 2018
- QUALCOMM Incorporated
- Vladimir Noveski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced wafer level package comprising a core layer for reducing...
- Patent number 9,806,063
- Issue date Oct 31, 2017
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive post protection for integrated circuit packages
- Patent number 9,768,108
- Issue date Sep 19, 2017
- QUALCOMM Incorporated
- Jie Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with embedded components and method of making...
- Patent number 9,601,435
- Issue date Mar 21, 2017
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package structure with reduced height
- Patent number 9,484,327
- Issue date Nov 1, 2016
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate comprising improved via pad placement in bump area
- Patent number 9,466,578
- Issue date Oct 11, 2016
- QUALCOMM Incorporated
- Jie Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, apparatus, and method for split die interconnection
- Patent number 9,379,090
- Issue date Jun 28, 2016
- QUALCOMM Incorporated
- Ahmer Raza Syed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface finish on trace for a thermal compression flip chip (TCFC)
- Patent number 9,269,681
- Issue date Feb 23, 2016
- QUALCOMM Incorporated
- Houssam W. Jomaa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compartmentalized shielding of selected components
- Patent number 9,137,934
- Issue date Sep 15, 2015
- RF Micro Devices, Inc.
- Thomas Scott Morris
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency package on package circuit
- Patent number 9,131,634
- Issue date Sep 8, 2015
- QUALCOMM Incorporated
- Aristotele Hadjichristos
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microelectromechanical systems embedded in a substrate
- Patent number 8,847,375
- Issue date Sep 30, 2014
- QUALCOMM Incorporated
- Milind P. Shah
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Barrier layer on bump and non-wettable coating on trace
- Patent number 8,802,556
- Issue date Aug 12, 2014
- QUALCOMM Incorporated
- Omar J. Bchir
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for improving package warpage and connection reliability th...
- Patent number 8,742,603
- Issue date Jun 3, 2014
- QUALCOMM Incorporated
- Omar J. Bchir
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE COMPRISING A SUBSTRATE AND AN INTERCONNECTION DIE CONFIGURE...
- Publication number 20230369234
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY WITH HYBRID BONDING
- Publication number 20230260947
- Publication date Aug 17, 2023
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR ASSEMBLY FOR HIGH CAPACITANCE DENSITY
- Publication number 20230246024
- Publication date Aug 3, 2023
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH A SUBSTRATE COMPRISING PROTRUDING PAD INTERCONNECTS
- Publication number 20220384328
- Publication date Dec 1, 2022
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR ASSEMBLY FOR HIGH CAPACITANCE DENSITY
- Publication number 20220223585
- Publication date Jul 14, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID RECONSTITUTED SUBSTRATE FOR ELECTRONIC PACKAGING
- Publication number 20220148953
- Publication date May 12, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE
- Publication number 20220131281
- Publication date Apr 28, 2022
- QUALCOMM Incorporated
- Milind SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLY WITH HYBRID BONDING
- Publication number 20220108968
- Publication date Apr 7, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING AN INDUCTOR AND A CAPACITOR LOCATED IN AN ENC...
- Publication number 20220013444
- Publication date Jan 13, 2022
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE
- Publication number 20210376493
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Milind SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING STACKED FILTERS WITH A SHARED SUBSTRATE CAP
- Publication number 20210376810
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DECOUPLING CAPACITORS WITH INTEGRATION IN A SUBSTRATE
- Publication number 20210343684
- Publication date Nov 4, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE COMPRISING DUMMY INTERCONNECTS
- Publication number 20210280507
- Publication date Sep 9, 2021
- QUALCOMM Incorporated
- Manuel ALDRETE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID THREE DIMENSIONAL INDUCTOR
- Publication number 20210281234
- Publication date Sep 9, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING CONTACT TO CONTACT COUPLING OF PACKAGES
- Publication number 20210280540
- Publication date Sep 9, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE REGULATION INTEGRATED CIRCUIT (IC) WITH CIRCUIT COMPONENTS...
- Publication number 20210271275
- Publication date Sep 2, 2021
- QUALCOMM Incorporated
- Jonghae Kim
- G05 - CONTROLLING REGULATING
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH A MAGNETIC CORE
- Publication number 20210257321
- Publication date Aug 19, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPEDANCE MATCHING TRANSCEIVER
- Publication number 20210234526
- Publication date Jul 29, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COUPLED TO A CAPACITOR STRUCTURE COMPRISING A TRE...
- Publication number 20210098567
- Publication date Apr 1, 2021
- QUALCOMM Incorporated
- Jonghae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE
- Publication number 20190081027
- Publication date Mar 14, 2019
- QUALCOMM Incorporated
- Rajneesh Kumar
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE
- Publication number 20170098634
- Publication date Apr 6, 2017
- QUALCOMM Incorporated
- Rajneesh Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REINFORCED WAFER LEVEL PACKAGE COMPRISING A CORE LAYER FOR REDUCING...
- Publication number 20160322332
- Publication date Nov 3, 2016
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE POST PROTECTION FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20160247754
- Publication date Aug 25, 2016
- QUALCOMM Incorporated
- Jie FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH EMBEDDED COMPONENTS AND METHOD OF MAKING...
- Publication number 20160218064
- Publication date Jul 28, 2016
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGE COMPRISING PHOTO SENSITIVE FILL BETWEEN A...
- Publication number 20160172299
- Publication date Jun 16, 2016
- QUALCOMM Incorporated
- Vladimir Noveski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR IMPROVING PACKAGE WARPAGE AND CONNECTION RELIABILITY TH...
- Publication number 20150221528
- Publication date Aug 6, 2015
- QUALCOMM Incorporated
- Omar James Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20150206812
- Publication date Jul 23, 2015
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING IMPROVED VIA PAD PLACEMENT IN BUMP AREA
- Publication number 20150179590
- Publication date Jun 25, 2015
- QUALCOMM Incorporated
- Jie Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER ON BUMP AND NON-WETTABLE COATING ON TRACE
- Publication number 20140322868
- Publication date Oct 30, 2014
- Omar James Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE STRUCTURE WITH REDUCED HEIGHT
- Publication number 20140264946
- Publication date Sep 18, 2014
- QUALCOMM Incorporated
- Chin-Kwan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Milind Shah

Person

Patents Grantslast 30 patents

Hybrid reconstituted substrate for electronic packaging

Trench capacitor assembly for high capacitance density

Substrate comprising an inductor and a capacitor located in an enca...

Package with a substrate comprising protruding pad interconnects

Sub-module L-shaped millimeter wave antenna-in-package

Package comprising stacked filters with a shared substrate cap

Integrated circuit assembly with hybrid bonding

Trench capacitor assembly for high capacitance density

Stacked decoupling capacitors with integration in a substrate

Voltage regulation integrated circuit (IC) with circuit components...

Impedance matching transceiver

Sub-module L-shaped millimeter wave antenna-in-package

Device comprising contact to contact coupling of packages

Integrated device coupled to a capacitor structure comprising a tre...

Integrated circuit package with a magnetic core

Integrated device comprising embedded package on package (PoP) device

Integrated device comprising embedded package on package (PoP) device

Integrated device package comprising photo sensitive fill between a...

Reinforced wafer level package comprising a core layer for reducing...

Conductive post protection for integrated circuit packages

Semiconductor package with embedded components and method of making...

Package-on-package structure with reduced height

Substrate comprising improved via pad placement in bump area

System, apparatus, and method for split die interconnection

Surface finish on trace for a thermal compression flip chip (TCFC)

Compartmentalized shielding of selected components

Radio frequency package on package circuit

Microelectromechanical systems embedded in a substrate

Barrier layer on bump and non-wettable coating on trace

Process for improving package warpage and connection reliability th...

Patents Applicationslast 30 patents

PACKAGE COMPRISING A SUBSTRATE AND AN INTERCONNECTION DIE CONFIGURE...

INTEGRATED CIRCUIT ASSEMBLY WITH HYBRID BONDING

TRENCH CAPACITOR ASSEMBLY FOR HIGH CAPACITANCE DENSITY

PACKAGE WITH A SUBSTRATE COMPRISING PROTRUDING PAD INTERCONNECTS

TRENCH CAPACITOR ASSEMBLY FOR HIGH CAPACITANCE DENSITY

HYBRID RECONSTITUTED SUBSTRATE FOR ELECTRONIC PACKAGING

SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE

INTEGRATED CIRCUIT ASSEMBLY WITH HYBRID BONDING

SUBSTRATE COMPRISING AN INDUCTOR AND A CAPACITOR LOCATED IN AN ENC...

SUB-MODULE L-SHAPED MILLIMETER WAVE ANTENNA-IN-PACKAGE

PACKAGE COMPRISING STACKED FILTERS WITH A SHARED SUBSTRATE CAP

STACKED DECOUPLING CAPACITORS WITH INTEGRATION IN A SUBSTRATE

PACKAGE COMPRISING DUMMY INTERCONNECTS

HYBRID THREE DIMENSIONAL INDUCTOR

DEVICE COMPRISING CONTACT TO CONTACT COUPLING OF PACKAGES

VOLTAGE REGULATION INTEGRATED CIRCUIT (IC) WITH CIRCUIT COMPONENTS...

INTEGRATED CIRCUIT PACKAGE WITH A MAGNETIC CORE

IMPEDANCE MATCHING TRANSCEIVER

INTEGRATED DEVICE COUPLED TO A CAPACITOR STRUCTURE COMPRISING A TRE...

INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE

INTEGRATED DEVICE COMPRISING EMBEDDED PACKAGE ON PACKAGE (PoP) DEVICE

REINFORCED WAFER LEVEL PACKAGE COMPRISING A CORE LAYER FOR REDUCING...

CONDUCTIVE POST PROTECTION FOR INTEGRATED CIRCUIT PACKAGES

SEMICONDUCTOR PACKAGE WITH EMBEDDED COMPONENTS AND METHOD OF MAKING...

INTEGRATED DEVICE PACKAGE COMPRISING PHOTO SENSITIVE FILL BETWEEN A...

PROCESS FOR IMPROVING PACKAGE WARPAGE AND CONNECTION RELIABILITY TH...

SUBSTRATE AND METHOD OF FORMING THE SAME

SUBSTRATE COMPRISING IMPROVED VIA PAD PLACEMENT IN BUMP AREA

BARRIER LAYER ON BUMP AND NON-WETTABLE COATING ON TRACE

PACKAGE-ON-PACKAGE STRUCTURE WITH REDUCED HEIGHT