Min-Cheng Kao

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device
- Patent number 12,320,995
- Issue date Jun 3, 2025
- ASUSTeK COMPUTER Inc.
- Chienyi Huang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Metal-insulator-metal device with improved performance
- Patent number 12,322,694
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding technology for stacking integrated circuits
- Patent number 12,315,843
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,283,564
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 12,276,849
- Issue date Apr 15, 2025
- Dongguan Luxshare Technologies Co., Ltd.
- QianBing Yan
- G02 - OPTICS
Information Patent Grant
Semiconductor device including image sensor and method of forming t...
- Patent number 12,278,250
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 12,248,173
- Issue date Mar 11, 2025
- Dongguan Luxshare Technologies Co., Ltd.
- Chung-Hsin Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield structure for backside through substrate vias (TSVs)
- Patent number 12,230,554
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
- Patent number 12,218,106
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensor and method of manufacturing the same
- Patent number 12,218,165
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CSI with controllable isolation structure and methods of manufactur...
- Patent number 12,218,166
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oversized via as through-substrate-via (TSV) stop layer
- Patent number 12,205,868
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, back-side illuminated image sensor and met...
- Patent number 12,183,761
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sheng-Chau Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked structure for CMOS image sensors including through-substrat...
- Patent number 12,176,370
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,148,781
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Co-packaged integrated optoelectronic module and co-packaged optoel...
- Patent number 12,136,952
- Issue date Nov 5, 2024
- Dongguan Luxshare Technologies Co., Ltd.
- Min-Sheng Kao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Backside structure for image sensor
- Patent number 12,062,679
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and method
- Patent number 12,057,446
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside capacitor techniques
- Patent number 12,034,037
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside or frontside through substrate via (TSV) landing on metal
- Patent number 12,033,919
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zheng-Xun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate electrodes with notches and methods for forming the same
- Patent number 12,009,214
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,955,428
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsin-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon vias and methods of fabricating thereof
- Patent number 11,942,368
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and manufacturing method thereof
- Patent number 11,908,878
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor
- Patent number 11,901,387
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal device with improved performance
- Patent number 11,854,959
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device and method
- Patent number 11,791,332
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming shield structure for backside through substrate v...
- Patent number 11,764,129
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250219016
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250221067
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR WITH PARTIAL BOTTOM LANDING
- Publication number 20250203884
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jaio-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)
- Publication number 20250149407
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...
- Publication number 20250149509
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250143000
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-FENG KAO
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250125505
- Publication date Apr 17, 2025
- ASUSTek COMPUTER INC.
- Hao-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
- Publication number 20250105098
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND BACK-SIDE ILL...
- Publication number 20250089387
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- SHENG-CHAU CHEN
Information Patent Application
CO-PACKAGED INTEGRATED OPTOELECTRONIC MODULE AND CO-PACKAGED OPTOEL...
- Publication number 20250023642
- Publication date Jan 16, 2025
- DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- Min-Sheng KAO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429129
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240395843
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTUR...
- Publication number 20240379710
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING IMAGE SENSOR AND METHOD OF FORMING T...
- Publication number 20240379711
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE
- Publication number 20240379528
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE STRUCTURE FOR IMAGE SENSOR
- Publication number 20240363664
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS
- Publication number 20240355784
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240355815
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE OR FRONTSIDE THROUGH SUBSTRATE VIA (TSV) LANDING ON METAL
- Publication number 20240355710
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Xun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CAPACITOR TECHNIQUES
- Publication number 20240347582
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIAS AND METHODS OF FABRICATING THEREOF
- Publication number 20240266219
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR
- Publication number 20240234561
- Publication date Jul 11, 2024
- National Yang Ming Chiao Tung University
- Edward Yi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240234538
- Publication date Jul 11, 2024
- National Yang Ming Chiao Tung University
- Edward Yi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED STRUCTURE FOR CMOS IMAGE SENSORS
- Publication number 20240222407
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240222261
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-FENG KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240222262
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-FENG KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240186356
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145575
- Publication date May 2, 2024
- National Yang Ming Chiao Tung University
- Edward Yi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME
- Publication number 20240136422
- Publication date Apr 25, 2024
- National Yang Ming Chiao Tung University
- Edward Yi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR
- Publication number 20240136432
- Publication date Apr 25, 2024
- National Yang Ming Chiao Tung University
- Edward Yi CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Min-Cheng Kao

Person

Patents Grantslast 30 patents

Electronic device

Metal-insulator-metal device with improved performance

Hybrid bonding technology for stacking integrated circuits

Backside contact for thermal displacement in a multi-wafer stacked...

Semiconductor structure and manufacturing method thereof

Optical module

Semiconductor device including image sensor and method of forming t...

Optical module

Shield structure for backside through substrate vias (TSVs)

Backside contact to improve thermal dissipation away from semicondu...

Semiconductor image sensor and method of manufacturing the same

CSI with controllable isolation structure and methods of manufactur...

Oversized via as through-substrate-via (TSV) stop layer

Semiconductor structure, back-side illuminated image sensor and met...

Stacked structure for CMOS image sensors including through-substrat...

Image sensor device

Integrated chip for standard logic performance improvement having a...

Co-packaged integrated optoelectronic module and co-packaged optoel...

Backside structure for image sensor

Stacked semiconductor device and method

Backside capacitor techniques

Backside or frontside through substrate via (TSV) landing on metal

Gate electrodes with notches and methods for forming the same

Semiconductor structure and manufacturing method thereof

Through silicon vias and methods of fabricating thereof

Image sensor and manufacturing method thereof

Image sensor

Metal-insulator-metal device with improved performance

Stacked semiconductor device and method

Method of forming shield structure for backside through substrate v...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

METAL-INSULATOR-METAL CAPACITOR WITH PARTIAL BOTTOM LANDING

SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)

BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDU...

SEMICONDUCTOR IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE

OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER

METHODS FOR MANUFACTURING SEMICONDUCTOR STRUCTURE AND BACK-SIDE ILL...

CO-PACKAGED INTEGRATED OPTOELECTRONIC MODULE AND CO-PACKAGED OPTOEL...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

CSI WITH CONTROLLABLE ISOLATION STRUCTURE AND METHODS OF MANUFACTUR...

SEMICONDUCTOR DEVICE INCLUDING IMAGE SENSOR AND METHOD OF FORMING T...

METAL-INSULATOR-METAL DEVICE WITH IMPROVED PERFORMANCE

BACKSIDE STRUCTURE FOR IMAGE SENSOR

HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS

STACKED SEMICONDUCTOR DEVICE AND METHOD

BACKSIDE OR FRONTSIDE THROUGH SUBSTRATE VIA (TSV) LANDING ON METAL

BACKSIDE CAPACITOR TECHNIQUES

THROUGH SILICON VIAS AND METHODS OF FABRICATING THEREOF

HIGH ELECTRON MOBILITY TRANSISTOR

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME

STACKED STRUCTURE FOR CMOS IMAGE SENSORS

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

IMAGE SENSOR

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

HIGH ELECTRON MOBILITY TRANSISTOR AND METHOD FOR FABRICATING THE SAME

HIGH ELECTRON MOBILITY TRANSISTOR