Min-Chien Hsiao

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of fabricating the same die stack structure and semiconduct...
- Patent number 12,119,328
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure, semiconductor structure and method of fabricat...
- Patent number 12,015,013
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with antenna element
- Patent number 11,705,411
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 11,264,362
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,244,896
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Chien Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, electronic device and method of fabricating pack...
- Patent number 11,245,176
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Chien Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,177,355
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method manufacturing the same
- Patent number 11,164,848
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with antenna element
- Patent number 11,004,809
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 10,937,719
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, electronic device and method of fabricating pack...
- Patent number 10,535,913
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Chien Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible linear sensor
- Patent number 10,490,430
- Issue date Nov 26, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Chuan Hsiao
- G08 - SIGNALLING
Information Patent Grant
Structure and formation method of chip package with antenna element
- Patent number 10,312,203
- Issue date Jun 4, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure, electronic device and method of fabricating pack...
- Patent number 10,276,920
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Chien Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,269,904
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package with through substrate vias
- Patent number 9,530,759
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package with through substrate vias
- Patent number 9,305,877
- Issue date Apr 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite substrate for counter electrode of dye-sensitized solar cell
- Patent number 9,202,635
- Issue date Dec 1, 2015
- National Tsing Hua University
- Chen-Chi Martin Ma
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250062259
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Chien Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR A THREE-DIMENSIONAL PACKAGE
- Publication number 20240404991
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240297151
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING THE SAME DIE STACK STRUCTURE AND SEMICONDUCT...
- Publication number 20240021584
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20230378012
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH ANTENNA ELEMENT
- Publication number 20230317645
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR A BRIDGE INTERCONNECT
- Publication number 20230095134
- Publication date Mar 30, 2023
- Taiwanj Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACK STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICAT...
- Publication number 20220181301
- Publication date Jun 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20210375826
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH ANTENNA ELEMENT
- Publication number 20210265289
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD MANUFACTURING THE SAME
- Publication number 20200402960
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200243441
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Chien Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, ELECTRONIC DEVICE AND METHOD OF FABRICATING PACK...
- Publication number 20200153083
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Chien Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH ANTENNA ELEMENT
- Publication number 20190279951
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, ELECTRONIC DEVICE AND METHOD OF FABRICATING PACK...
- Publication number 20190252762
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Chien Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20190237553
- Publication date Aug 1, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE LINEAR SENSOR
- Publication number 20190131151
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Min-Chuan HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, ELECTRONIC DEVICE AND METHOD OF FABRICATING PACK...
- Publication number 20190097304
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Chien Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20180269139
- Publication date Sep 20, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH ANTENNA ELEMENT
- Publication number 20180166405
- Publication date Jun 14, 2018
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Yung-Ping CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Package With Through Substrate Vias
- Publication number 20160218090
- Publication date Jul 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160126324
- Publication date May 5, 2016
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-HUA YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabrication of functionalized graphene reinforced compos...
- Publication number 20110315934
- Publication date Dec 29, 2011
- National Tsing Hua University
- Chen-Chi M. Ma
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Fabrication of polymer grafted carbon nanotubes/polypropylene compo...
- Publication number 20100283174
- Publication date Nov 11, 2010
- YUAN ZE UNIVERSITY
- Chen-Chi Martin Ma
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Composite substrate for counter electrode of dye-sensitized solar cell
- Publication number 20100154871
- Publication date Jun 24, 2010
- National Tsing Hua University
- Chen-Chi Martin Ma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Fabrication of metal meshes/carbon nanotubes/polymer composite bipo...
- Publication number 20100127424
- Publication date May 27, 2010
- YUAN ZE UNIVERSITY
- Chen-Chi Martin Ma
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Fabrication of carbon nanotubes reinforced semi-crystalline polymer...
- Publication number 20100127428
- Publication date May 27, 2010
- YUAN ZE UNIVERSITY
- Chen-Chi M. Ma
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Min-Chien Hsiao

Person

Patents Grantslast 30 patents

Methods of fabricating the same die stack structure and semiconduct...

Die stack structure, semiconductor structure and method of fabricat...

Chip package with antenna element

Semiconductor structure and method of fabricating the same

Package structure and manufacturing method thereof

Package structure, electronic device and method of fabricating pack...

Semiconductor structure and manufacturing method thereof

Semiconductor structure and method manufacturing the same

Chip package with antenna element

Package structure and method of fabricating the same

Package structure, electronic device and method of fabricating pack...

Flexible linear sensor

Structure and formation method of chip package with antenna element

Package structure, electronic device and method of fabricating pack...

Semiconductor structure and manufacturing method thereof

3D package with through substrate vias

3D package with through substrate vias

Composite substrate for counter electrode of dye-sensitized solar cell

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

METHOD AND STRUCTURE FOR A THREE-DIMENSIONAL PACKAGE

METHODS OF FABRICATING PACKAGE STRUCTURE

METHODS OF FABRICATING THE SAME DIE STACK STRUCTURE AND SEMICONDUCT...

Integrated Circuit Packages and Methods of Forming the Same

PACKAGE STRUCTURE WITH ANTENNA ELEMENT

METHOD AND STRUCTURE FOR A BRIDGE INTERCONNECT

DIE STACK STRUCTURE, SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICAT...

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

CHIP PACKAGE WITH ANTENNA ELEMENT

SEMICONDUCTOR STRUCTURE AND METHOD MANUFACTURING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE, ELECTRONIC DEVICE AND METHOD OF FABRICATING PACK...

CHIP PACKAGE WITH ANTENNA ELEMENT

PACKAGE STRUCTURE, ELECTRONIC DEVICE AND METHOD OF FABRICATING PACK...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

FLEXIBLE LINEAR SENSOR

PACKAGE STRUCTURE, ELECTRONIC DEVICE AND METHOD OF FABRICATING PACK...

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH ANTENNA ELEMENT

3D Package With Through Substrate Vias

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Method for fabrication of functionalized graphene reinforced compos...

Fabrication of polymer grafted carbon nanotubes/polypropylene compo...

Composite substrate for counter electrode of dye-sensitized solar cell

Fabrication of metal meshes/carbon nanotubes/polymer composite bipo...

Fabrication of carbon nanotubes reinforced semi-crystalline polymer...