Min-Chih HSUAN

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Urinal cartridge and urinal having the same
- Patent number 10,292,546
- Issue date May 21, 2019
- Kelvin Yi-Tse Lai
- E03 - WATER SUPPLY SEWERAGE
Information Patent Grant
Attachment device for micro devices and wearable micro devices havi...
- Patent number 10,165,693
- Issue date Dec 25, 2018
- Min-Chih Hsuan
- A41 - WEARING APPAREL
Information Patent Grant
Local detection processing device and system
- Patent number 8,976,018
- Issue date Mar 10, 2015
- Smile Technology Co., Ltd.
- Min-Chih Hsuan
- G08 - SIGNALLING
Information Patent Grant
Portable information detection and processing device and system
- Patent number 8,786,427
- Issue date Jul 22, 2014
- Smile Technology Co., Ltd.
- Min-Chih Hsuan
- G08 - SIGNALLING
Information Patent Grant
Manufacturing method of wafer level chip scale package of image-sen...
- Patent number 8,546,739
- Issue date Oct 1, 2013
- Min-Chih Hsuan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image-sensing module of image capture apparatus and manufacturing m...
- Patent number 7,659,501
- Issue date Feb 9, 2010
- United Microelectronics Corp.
- Min-Chih Hsuan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip packaging process
- Patent number 7,534,653
- Issue date May 19, 2009
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated audio/video sensor
- Patent number 7,450,150
- Issue date Nov 11, 2008
- United Microelectronics Corp.
- Min-Chih Hsuan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Ultra-thin wafer level stack packaging method
- Patent number 7,192,847
- Issue date Mar 20, 2007
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with improved interconnect structure and process...
- Patent number 7,179,740
- Issue date Feb 20, 2007
- United Microelectronics Corporation
- Min-Chih John Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wafer level chip scale package structure
- Patent number 7,170,167
- Issue date Jan 30, 2007
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible multi-chip module and method of making the same
- Patent number 7,141,875
- Issue date Nov 28, 2006
- Aptos Corp
- Min Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermediate structure for making integrated circuit device and wafer
- Patent number 7,030,466
- Issue date Apr 18, 2006
- United Microelectronics Corporation
- Min-Chih John Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with improved interconnect structure and process...
- Patent number 6,838,310
- Issue date Jan 4, 2005
- United Microelectronics Corporation
- Min-Chih John Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Placement and routing for wafer scale memory
- Patent number 6,512,708
- Issue date Jan 28, 2003
- United Microelectronic Corporation
- Min-Chih Hsuan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming package
- Patent number 6,461,956
- Issue date Oct 8, 2002
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with improved interconnect structure and process...
- Patent number 6,429,509
- Issue date Aug 6, 2002
- United Microelectronics Corporation
- Min-Chih John Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating direct contact through hole type
- Patent number 6,352,923
- Issue date Mar 5, 2002
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct contact through hole type wafer structure
- Patent number 6,323,546
- Issue date Nov 27, 2001
- United Microelectronics Corp.
- Min Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preburn-in dynamic random access memory module and preburn-in circu...
- Patent number 6,279,141
- Issue date Aug 21, 2001
- Min-Chih Hsuan
- G11 - INFORMATION STORAGE
Information Patent Grant
Wafer level package
- Patent number 6,268,642
- Issue date Jul 31, 2001
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct contact through hole type wafer structure
- Patent number 6,252,300
- Issue date Jun 26, 2001
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face multi-chip package
- Patent number 6,239,366
- Issue date May 29, 2001
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip chip scale package
- Patent number 6,239,367
- Issue date May 29, 2001
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip chip scale package
- Patent number 6,236,109
- Issue date May 22, 2001
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integrated circuit structure and method of manufacturin...
- Patent number 6,214,630
- Issue date Apr 10, 2001
- United Microelectronics Corp.
- Min-Chih Hsuan
- G01 - MEASURING TESTING
Information Patent Grant
Cascade-type chip module
- Patent number 6,166,444
- Issue date Dec 26, 2000
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-free bonding pad structure
- Patent number 6,031,293
- Issue date Feb 29, 2000
- United Microelectronics Corporation
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repairable memory module and method of repairing memory modules
- Patent number 5,875,136
- Issue date Feb 23, 1999
- United Microelectronics Corporation
- Min-Chih Hsuan
- G11 - INFORMATION STORAGE
Information Patent Grant
Facsimile message encryption system
- Patent number 5,159,630
- Issue date Oct 27, 1992
- International Communication Systems Corporation
- Ling-Yuan Tseng
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Patents Applicationslast 30 patents

Information Patent Application
WRITING PEN, SIGNATURE RECOGNITION METHOD AND SIGNATURE RECOGNITION...
- Publication number 20220067341
- Publication date Mar 3, 2022
- WALTOP INTERNATIONAL CORPORATION
- Min-Chih HSUAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
URINAL CARTRIDGE AND URINAL HAVING THE SAME
- Publication number 20180035851
- Publication date Feb 8, 2018
- Kelvin Yi-Tse LAI
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Application
Attachment Device for Micro Devices and Wearable Micro Devices Havi...
- Publication number 20170135231
- Publication date May 11, 2017
- Min-Chih HSUAN
- A41 - WEARING APPAREL
Information Patent Application
LOCAL DETECTION PROCESSING DEVICE AND SYSTEM
- Publication number 20120249321
- Publication date Oct 4, 2012
- Min-Chih HSUAN
- G08 - SIGNALLING
Information Patent Application
PORTABLE INFORMATION DETECTION AND PROCESSING DEVICE AND SYSTEM
- Publication number 20120249322
- Publication date Oct 4, 2012
- Min-Chih HSUAN
- G08 - SIGNALLING
Information Patent Application
HYBRID KEYBOARD
- Publication number 20120242514
- Publication date Sep 27, 2012
- Smile Technology Co., Ltd.
- Min-Chih HSUAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HAND-HELD DISPLAYING DEVICE
- Publication number 20120242567
- Publication date Sep 27, 2012
- Smile Technology Co., Ltd.
- Min-Chih HSUAN
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Application
MANUFACTURING METHOD OF WAFER LEVEL CHIP SCALE PACAKGE OF IMAGE-SEN...
- Publication number 20090305451
- Publication date Dec 10, 2009
- United Microelectronics Corp.
- Min-Chih Hsuan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP PACKAGE AND PROCESS THEREOF
- Publication number 20090218679
- Publication date Sep 3, 2009
- United Microelectronics Corp.
- MIN-CHIH HSUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlling system for illumination of a golf course and controllin...
- Publication number 20090206759
- Publication date Aug 20, 2009
- Bily Wang
- F21 - LIGHTING
Information Patent Application
PROCESSING UNIT INCLUDING A WIRELESS MODULE AND METHOD THEREOF
- Publication number 20090113211
- Publication date Apr 30, 2009
- Chun-Hung Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE-SENSING MODULE AND MANUFACTURING METHOD THEREOF, AND IMAGE CA...
- Publication number 20080239120
- Publication date Oct 2, 2008
- United Microelectronics Corp.
- Min-Chih Hsuan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP PACKAGE AND PROCESS THEREOF
- Publication number 20080185710
- Publication date Aug 7, 2008
- United Microelectronics Corp.
- MIN-CHIH HSUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING PROCESS
- Publication number 20070085206
- Publication date Apr 19, 2007
- United Microelectronics Corp.
- MIN-CHIH HSUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF AN ULTRA-THIN WAFER LEVEL STACK PACKAGE
- Publication number 20070045806
- Publication date Mar 1, 2007
- United Microelectronics Corp.
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE
- Publication number 20060065976
- Publication date Mar 30, 2006
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for repairing white spots in liquid crystal display panel
- Publication number 20060017878
- Publication date Jan 26, 2006
- Min-Chih Hsuan
- G02 - OPTICS
Information Patent Application
System-in-package (SIP) structure and fabrication thereof
- Publication number 20050269680
- Publication date Dec 8, 2005
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible multi-chip module and method of making the same
- Publication number 20050227412
- Publication date Oct 13, 2005
- Aptos Corporation
- Min Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package and process thereof
- Publication number 20050212132
- Publication date Sep 29, 2005
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN WAFER LEVEL STACK PACKAGING METHOD AND STRUCTURE THEREOF
- Publication number 20050173789
- Publication date Aug 11, 2005
- Min-Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Digital cellular phone system and cellular phone applied thereto
- Publication number 20050101322
- Publication date May 12, 2005
- Min-Chih Hsuan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method for repairing white spots in liquid crystal display panel
- Publication number 20050099587
- Publication date May 12, 2005
- Min-Chih Hsuan
- G02 - OPTICS
Information Patent Application
Integrated audio/video sensor
- Publication number 20050088517
- Publication date Apr 28, 2005
- Min-Chih Hsuan
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
System, method and chip for hardware detection of illegal software...
- Publication number 20050050347
- Publication date Mar 3, 2005
- Min-Chih Hsuan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Universal power supply system
- Publication number 20020166890
- Publication date Nov 14, 2002
- United Microelectronics Corp.,
- Min-Chih Hsuan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Direct contact through hole type wafer structure
- Publication number 20010005046
- Publication date Jun 28, 2001
- Min Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS

Min-Chih HSUAN

Person

Patents Grantslast 30 patents

Urinal cartridge and urinal having the same

Attachment device for micro devices and wearable micro devices havi...

Local detection processing device and system

Portable information detection and processing device and system

Manufacturing method of wafer level chip scale package of image-sen...

Image-sensing module of image capture apparatus and manufacturing m...

Chip packaging process

Integrated audio/video sensor

Ultra-thin wafer level stack packaging method

Integrated circuit with improved interconnect structure and process...

Method for manufacturing wafer level chip scale package structure

Flexible multi-chip module and method of making the same

Intermediate structure for making integrated circuit device and wafer

Integrated circuit with improved interconnect structure and process...

Placement and routing for wafer scale memory

Method of forming package

Integrated circuit with improved interconnect structure and process...

Method of fabricating direct contact through hole type

Direct contact through hole type wafer structure

Preburn-in dynamic random access memory module and preburn-in circu...

Wafer level package

Direct contact through hole type wafer structure

Face-to-face multi-chip package

Multi-chip chip scale package

Multi-chip chip scale package

Wafer level integrated circuit structure and method of manufacturin...

Cascade-type chip module

Package-free bonding pad structure

Repairable memory module and method of repairing memory modules

Facsimile message encryption system

Patents Applicationslast 30 patents

WRITING PEN, SIGNATURE RECOGNITION METHOD AND SIGNATURE RECOGNITION...

URINAL CARTRIDGE AND URINAL HAVING THE SAME

Attachment Device for Micro Devices and Wearable Micro Devices Havi...

LOCAL DETECTION PROCESSING DEVICE AND SYSTEM

PORTABLE INFORMATION DETECTION AND PROCESSING DEVICE AND SYSTEM

HYBRID KEYBOARD

HAND-HELD DISPLAYING DEVICE

MANUFACTURING METHOD OF WAFER LEVEL CHIP SCALE PACAKGE OF IMAGE-SEN...

CHIP PACKAGE AND PROCESS THEREOF

Controlling system for illumination of a golf course and controllin...

PROCESSING UNIT INCLUDING A WIRELESS MODULE AND METHOD THEREOF

IMAGE-SENSING MODULE AND MANUFACTURING METHOD THEREOF, AND IMAGE CA...

CHIP PACKAGE AND PROCESS THEREOF

CHIP PACKAGING PROCESS

STRUCTURE OF AN ULTRA-THIN WAFER LEVEL STACK PACKAGE

METHOD FOR MANUFACTURING WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE

Method for repairing white spots in liquid crystal display panel

System-in-package (SIP) structure and fabrication thereof

Flexible multi-chip module and method of making the same

Chip package and process thereof

ULTRA-THIN WAFER LEVEL STACK PACKAGING METHOD AND STRUCTURE THEREOF

Digital cellular phone system and cellular phone applied thereto

Method for repairing white spots in liquid crystal display panel

Integrated audio/video sensor

System, method and chip for hardware detection of illegal software...

Universal power supply system

Direct contact through hole type wafer structure