Min-Feng Hong

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fill structures with air gaps
- Patent number 11,961,884
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Yung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using a polishing system
- Patent number 11,358,252
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Chi Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for processing wafer
- Patent number 10,861,721
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- You-Hua Chou
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Polishing system
- Patent number 10,357,867
- Issue date Jul 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Chi Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for processing wafer
- Patent number 10,204,807
- Issue date Feb 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor isolation region and method of forming the same
- Patent number 9,786,707
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing system and polishing method
- Patent number 9,718,164
- Issue date Aug 1, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chi Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Image sensor isolation region and method of forming the same
- Patent number 9,673,244
- Issue date Jun 6, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse damascene process
- Patent number 9,607,946
- Issue date Mar 28, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse damascene process
- Patent number 9,536,834
- Issue date Jan 3, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step shallow trench isolation (STI) process
- Patent number 9,502,280
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min Hao Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grids in backside illumination image sensor chips and methods for f...
- Patent number 9,478,581
- Issue date Oct 25, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CIS image sensors with epitaxy layers and methods for forming the same
- Patent number 9,368,540
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
System and method for reducing irregularities on the surface of a b...
- Patent number 9,349,902
- Issue date May 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Grids in backside illumination image sensor chips and methods for f...
- Patent number 9,257,476
- Issue date Feb 9, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming semiconductor device having stable dislocati...
- Patent number 9,214,514
- Issue date Dec 15, 2015
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hao Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grids in backside illumination image sensor chips and methods for f...
- Patent number 9,041,140
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step shallow trench isolation (STI) process
- Patent number 9,006,070
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min Hao Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CIS image sensors with epitaxy layers and methods for forming the same
- Patent number 8,889,461
- Issue date Nov 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for preparing polysilazane on a semiconductor...
- Patent number 8,796,105
- Issue date Aug 5, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for backside illumination sensor
- Patent number 8,772,899
- Issue date Jul 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-step shallow trench isolation (STI) process
- Patent number 8,692,299
- Issue date Apr 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min Hao Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reverse damascene process
- Patent number 8,518,818
- Issue date Aug 27, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stressed semiconductor device and method of manufacturing
- Patent number 8,455,883
- Issue date Jun 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Miao-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fill Structures With Air Gaps
- Publication number 20240250121
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Yung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILL STRUCTURES WITH AIR GAPS
- Publication number 20220320273
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiu-Yung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF USING A POLISHING SYSTEM
- Publication number 20190337116
- Publication date Nov 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chi LIN
- B24 - GRINDING POLISHING
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING WAFER
- Publication number 20190172735
- Publication date Jun 6, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- You-Hua CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PROCESSING WAFER
- Publication number 20180308724
- Publication date Oct 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- You-Hua CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING SYSTEM
- Publication number 20170312881
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grids in Backside Illumination Image Sensor Chips and Methods for F...
- Publication number 20160155771
- Publication date Jun 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grids in Backside Illumination Image Sensor Chips and Methods for F...
- Publication number 20150236067
- Publication date Aug 20, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-Step Shallow Trench Isolation (STI) Process
- Publication number 20150179502
- Publication date Jun 25, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min Hao Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING SEMICONDUCTOR DEVICE HAVING STABLE DISLOCAT...
- Publication number 20150132913
- Publication date May 14, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Min-Hao HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIS Image Sensors with Epitaxy Layers and Methods for Forming the Same
- Publication number 20150041851
- Publication date Feb 12, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-STEP SHALLOW TRENCH ISOLATION (STI) PROCESS
- Publication number 20140179071
- Publication date Jun 26, 2014
- Min Hao Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING SYSTEM AND POLISHING METHOD
- Publication number 20140162534
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-STEP SHALLOW TRENCH ISOLATION (STI) PROCESS
- Publication number 20140054653
- Publication date Feb 27, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min Hao Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PREPARING POLYSILAZANE ON A SEMICONDUCTOR...
- Publication number 20140030866
- Publication date Jan 30, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSE DAMASCENE PROCESS
- Publication number 20130328198
- Publication date Dec 12, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Processing a Backside Illuminated Photodiode
- Publication number 20130320478
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIS Image Sensors with Epitaxy Layers and Methods for Forming the Same
- Publication number 20130320419
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Isolation Region and Method of Forming the Same
- Publication number 20130280849
- Publication date Oct 24, 2013
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reverse Damascene Process
- Publication number 20130260552
- Publication date Oct 3, 2013
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grids in Backside Illumination Image Sensor Chips and Methods for F...
- Publication number 20130241018
- Publication date Sep 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Isolation Region and Method of Forming the Same
- Publication number 20130234202
- Publication date Sep 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Backside Illumination Sensor
- Publication number 20130228886
- Publication date Sep 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shiu-Ko JangJian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reverse Damascene Process
- Publication number 20130069233
- Publication date Mar 21, 2013
- Taiwan Semiconductor Manufacturing Co., LTD
- You-Hua Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESSED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20120292639
- Publication date Nov 22, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Miao-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vibration control of an optical table by disturbance response decou...
- Publication number 20110133049
- Publication date Jun 9, 2011
- National Taiwan University
- Fu-Cheng Wang
- G05 - CONTROLLING REGULATING

Min-Feng Hong

Person

Patents Grantslast 30 patents

Fill structures with air gaps

Method of using a polishing system

Apparatus and method for processing wafer

Polishing system

Apparatus and method for processing wafer

Image sensor isolation region and method of forming the same

Polishing system and polishing method

Image sensor isolation region and method of forming the same

Reverse damascene process

Reverse damascene process

Two-step shallow trench isolation (STI) process

Grids in backside illumination image sensor chips and methods for f...

CIS image sensors with epitaxy layers and methods for forming the same

System and method for reducing irregularities on the surface of a b...

Grids in backside illumination image sensor chips and methods for f...

Mechanisms for forming semiconductor device having stable dislocati...

Grids in backside illumination image sensor chips and methods for f...

Two-step shallow trench isolation (STI) process

CIS image sensors with epitaxy layers and methods for forming the same

Method and apparatus for preparing polysilazane on a semiconductor...

Method and apparatus for backside illumination sensor

Two-step shallow trench isolation (STI) process

Reverse damascene process

Stressed semiconductor device and method of manufacturing

Patents Applicationslast 30 patents

Fill Structures With Air Gaps

FILL STRUCTURES WITH AIR GAPS

METHOD OF USING A POLISHING SYSTEM

APPARATUS AND METHOD FOR PROCESSING WAFER

APPARATUS AND METHOD FOR PROCESSING WAFER

POLISHING SYSTEM

Grids in Backside Illumination Image Sensor Chips and Methods for F...

Grids in Backside Illumination Image Sensor Chips and Methods for F...

Two-Step Shallow Trench Isolation (STI) Process

MECHANISMS FOR FORMING SEMICONDUCTOR DEVICE HAVING STABLE DISLOCAT...

CIS Image Sensors with Epitaxy Layers and Methods for Forming the Same

TWO-STEP SHALLOW TRENCH ISOLATION (STI) PROCESS

POLISHING SYSTEM AND POLISHING METHOD

TWO-STEP SHALLOW TRENCH ISOLATION (STI) PROCESS

METHOD AND APPARATUS FOR PREPARING POLYSILAZANE ON A SEMICONDUCTOR...

REVERSE DAMASCENE PROCESS

System and Method for Processing a Backside Illuminated Photodiode

CIS Image Sensors with Epitaxy Layers and Methods for Forming the Same

Image Sensor Isolation Region and Method of Forming the Same

Reverse Damascene Process

Grids in Backside Illumination Image Sensor Chips and Methods for F...

Image Sensor Isolation Region and Method of Forming the Same

Method and Apparatus for Backside Illumination Sensor

Reverse Damascene Process

STRESSED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

Vibration control of an optical table by disturbance response decou...