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Hsin-Chu, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Isolation rings for packages and the method of forming the same
Patent number
9,929,070
Issue date
Mar 27, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Horng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Isolation rings for packages and the method of forming the same
Patent number
9,548,245
Issue date
Jan 17, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Horng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Isolation rings for packages and the method of forming the same
Patent number
9,048,333
Issue date
Jun 2, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Horng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Isolation rings for blocking the interface between package componen...
Patent number
8,710,681
Issue date
Apr 29, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Horng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal bump structure
Patent number
8,581,399
Issue date
Nov 12, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Fu Tsai
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Repackaging IC Chip For Fault Identification
Publication number
20240036108
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chien-Yi Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Through Via Structure
Publication number
20230187315
Publication date
Jun 15, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Min-Feng Ku
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Guard Ring Design For Through Via
Publication number
20230178589
Publication date
Jun 8, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Min-Feng Ku
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GUARD RING STRUCTURE
Publication number
20230163084
Publication date
May 25, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Min-Feng Ku
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SPECIFICATDEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHOD...
Publication number
20220254739
Publication date
Aug 11, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Min-Feng KU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Isolation Rings for Packages and the Method of Forming the Same
Publication number
20170103933
Publication date
Apr 13, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Horng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Isolation Rings for Packages and the Method of Forming the Same
Publication number
20150262882
Publication date
Sep 17, 2015
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Horng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Isolation Rings for Packages and the Method of Forming the Same
Publication number
20140179062
Publication date
Jun 26, 2014
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Horng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Isolation Rings for Packages and the Method of Forming the Same
Publication number
20130320572
Publication date
Dec 5, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Horng Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL BUMP STRUCTURE
Publication number
20130026621
Publication date
Jan 31, 2013
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Fu TSAI
H01 - BASIC ELECTRIC ELEMENTS