Min-Feng Ku

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Devices with through silicon vias, guard rings and methods of makin...
- Patent number 12,046,566
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation rings for packages and the method of forming the same
- Patent number 9,929,070
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation rings for packages and the method of forming the same
- Patent number 9,548,245
- Issue date Jan 17, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation rings for packages and the method of forming the same
- Patent number 9,048,333
- Issue date Jun 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation rings for blocking the interface between package componen...
- Patent number 8,710,681
- Issue date Apr 29, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump structure
- Patent number 8,581,399
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES
- Publication number 20240395666
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING STRUCTURE
- Publication number 20240379588
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKIN...
- Publication number 20240332218
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKIN...
- Publication number 20240332219
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Repackaging IC Chip For Fault Identification
- Publication number 20240036108
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Via Structure
- Publication number 20230187315
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Guard Ring Design For Through Via
- Publication number 20230178589
- Publication date Jun 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GUARD RING STRUCTURE
- Publication number 20230163084
- Publication date May 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Ku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPECIFICATDEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHOD...
- Publication number 20220254739
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Feng KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Rings for Packages and the Method of Forming the Same
- Publication number 20170103933
- Publication date Apr 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Rings for Packages and the Method of Forming the Same
- Publication number 20150262882
- Publication date Sep 17, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Rings for Packages and the Method of Forming the Same
- Publication number 20140179062
- Publication date Jun 26, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation Rings for Packages and the Method of Forming the Same
- Publication number 20130320572
- Publication date Dec 5, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURE
- Publication number 20130026621
- Publication date Jan 31, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu TSAI
- H01 - BASIC ELECTRIC ELEMENTS

Min-Feng Ku

Person

Patents Grantslast 30 patents

Devices with through silicon vias, guard rings and methods of makin...

Isolation rings for packages and the method of forming the same

Isolation rings for packages and the method of forming the same

Isolation rings for packages and the method of forming the same

Isolation rings for blocking the interface between package componen...

Metal bump structure

Patents Applicationslast 30 patents

THROUGH SILICON VIA WITH TEXTURED STRUCTURE AND FOOTING FEATURES

GUARD RING STRUCTURE

DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKIN...

DEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHODS OF MAKIN...

Repackaging IC Chip For Fault Identification

Through Via Structure

Guard Ring Design For Through Via

GUARD RING STRUCTURE

SPECIFICATDEVICES WITH THROUGH SILICON VIAS, GUARD RINGS AND METHOD...

Isolation Rings for Packages and the Method of Forming the Same

Isolation Rings for Packages and the Method of Forming the Same

Isolation Rings for Packages and the Method of Forming the Same

Isolation Rings for Packages and the Method of Forming the Same

METAL BUMP STRUCTURE