Min-Ho Hsiao

Person

Miaoli County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded passive chip device and method of making the same
- Patent number 10,224,389
- Issue date Mar 5, 2019
- WAFER MEMS CO., LTD.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductor chip and method of making the same
- Patent number 10,181,378
- Issue date Jan 15, 2019
- Wafer Mems Co., Ltd.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic patterned wafer used for production of magnetic-core-induc...
- Patent number 10,109,408
- Issue date Oct 23, 2018
- Wafer Mems Co., Ltd.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a high frequency inductor chip
- Patent number 10,020,114
- Issue date Jul 10, 2018
- Wafer Mems Co., Ltd.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded passive chip device and method of making the same
- Patent number 9,812,521
- Issue date Nov 7, 2017
- WAFER MEMS CO., LTD.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive chip device and method of making the same
- Patent number 9,806,145
- Issue date Oct 31, 2017
- WAFER MEMS CO., LTD.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Patterned Wafer and Method of Making the Same
- Publication number 20180033675
- Publication date Feb 1, 2018
- WAFER MEMS CO., LTD.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Passive Chip Device and Method of Making the Same
- Publication number 20180026090
- Publication date Jan 25, 2018
- WAFER MEMS CO., LTD.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive Chip Device and Method of Making the Same
- Publication number 20180019296
- Publication date Jan 18, 2018
- WAFER MEMS CO., LTD.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic Patterned Wafer Used for Production of Magnetic-Core-Induc...
- Publication number 20160379745
- Publication date Dec 29, 2016
- WAFER MEMS CO., LTD.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic Core Inductor Chip and Method of Making the Same
- Publication number 20160379749
- Publication date Dec 29, 2016
- WAFER MEMS CO., LTD.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Passive Chip Device and Method of Making the Same
- Publication number 20160380041
- Publication date Dec 29, 2016
- WAFER MEMS CO., LTD.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive Chip Device and Method of Making the Same
- Publication number 20160380042
- Publication date Dec 29, 2016
- WAFER MEMS CO., LTD.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Frequency Inductor Chip and Method of Making the Same
- Publication number 20160379748
- Publication date Dec 29, 2016
- WAFER MEMS CO., LTD.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterned Wafer and Method of Making the Same
- Publication number 20160379969
- Publication date Dec 29, 2016
- WAFER MEMS CO., LTD.
- Min-Ho Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Min-Ho Hsiao

Person

Patents Grantslast 30 patents

Embedded passive chip device and method of making the same

Magnetic core inductor chip and method of making the same

Magnetic patterned wafer used for production of magnetic-core-induc...

Method of making a high frequency inductor chip

Embedded passive chip device and method of making the same

Passive chip device and method of making the same

Patents Applicationslast 30 patents

Patterned Wafer and Method of Making the Same

Embedded Passive Chip Device and Method of Making the Same

Passive Chip Device and Method of Making the Same

Magnetic Patterned Wafer Used for Production of Magnetic-Core-Induc...

Magnetic Core Inductor Chip and Method of Making the Same

Embedded Passive Chip Device and Method of Making the Same

Passive Chip Device and Method of Making the Same

High Frequency Inductor Chip and Method of Making the Same

Patterned Wafer and Method of Making the Same