MIN-HORNG LIU

Person

NEW TAIPEI CITY, TW

People

Patents Applicationslast 30 patents

Information Patent Application
RADIATOR STRUCTURE
- Publication number 20230332848
- Publication date Oct 19, 2023
- Amulaire thermal technology, INC.
- KUO-WEI LEE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT-DISSIPATING SUBSTRATE WITH COATING STRUCTURE
- Publication number 20230235978
- Publication date Jul 27, 2023
- Amulaire thermal technology, INC.
- MIN-HORNG LIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HEAT-DISSIPATION SUBSTRATE STRUCTURE WITH HIGH ADHESIVE STRENGTH
- Publication number 20230168049
- Publication date Jun 1, 2023
- Amulaire thermal technology, INC.
- TSUNG-RUEI SUEI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT-DISSIPATION SUBSTRATE HAVING GRADIENT SPUTTERED STRUCTURE
- Publication number 20230130677
- Publication date Apr 27, 2023
- Amulaire thermal technology, INC.
- MIN-HORNG LIU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
RADIATOR STRUCTURE
- Publication number 20230080659
- Publication date Mar 16, 2023
- Amulaire thermal technology, INC.
- KUO-WEI LEE
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION SUBSTRATE FOR INCREASING SOLDERABILITY
- Publication number 20220307779
- Publication date Sep 29, 2022
- Amulaire thermal technology, INC.
- Min-Horng LIU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT-DISSIPATING SUBSTRATE WITH COATING STRUCTURE
- Publication number 20220304186
- Publication date Sep 22, 2022
- Amulaire thermal technology, INC.
- MIN-HORNG LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-ALLOY HEAT-DISSIPATION STRUCTURE WITH MILLED SURFACE
- Publication number 20220146216
- Publication date May 12, 2022
- Amulaire thermal technology, INC.
- MIN-HORNG LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER-ALLOY HEAT-DISSIPATION STRUCTURE WITH MILLED SURFACE
- Publication number 20210180889
- Publication date Jun 17, 2021
- Amulaire thermal technology, INC.
- MIN-HORNG LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

MIN-HORNG LIU

Person

Patents Applicationslast 30 patents

RADIATOR STRUCTURE

HEAT-DISSIPATING SUBSTRATE WITH COATING STRUCTURE

HEAT-DISSIPATION SUBSTRATE STRUCTURE WITH HIGH ADHESIVE STRENGTH

HEAT-DISSIPATION SUBSTRATE HAVING GRADIENT SPUTTERED STRUCTURE

RADIATOR STRUCTURE

HEAT DISSIPATION SUBSTRATE FOR INCREASING SOLDERABILITY

HEAT-DISSIPATING SUBSTRATE WITH COATING STRUCTURE

COPPER-ALLOY HEAT-DISSIPATION STRUCTURE WITH MILLED SURFACE

COPPER-ALLOY HEAT-DISSIPATION STRUCTURE WITH MILLED SURFACE