Min-Hsiu Tsai

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method and system for creating dipole moment model
- Patent number 12,105,142
- Issue date Oct 1, 2024
- Realtek Semiconductor Corporation
- Min-Hsu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench isolations and methods of forming the same
- Patent number 12,087,801
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having stacked metal oxide films as fixed charge film
- Patent number 12,080,738
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting element with cushion part
- Patent number 12,002,904
- Issue date Jun 4, 2024
- Epistar Corporation
- Chao-Hsing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode packaging structure
- Patent number 11,949,056
- Issue date Apr 2, 2024
- Lextar Electronics Corporation
- Chih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contact for ion through-substrate via
- Patent number 11,929,379
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dice testing method
- Patent number 11,921,155
- Issue date Mar 5, 2024
- TANGO AI CORP.
- Min-Ju Tsai
- G01 - MEASURING TESTING
Information Patent Grant
Back-side deep trench isolation structure for image sensor
- Patent number 11,869,761
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of verifying slanted layout components
- Patent number 11,861,288
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yuan-Te Hou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light absorbing layer to enhance P-type diffusion for DTI in image...
- Patent number 11,817,469
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced trench isolation structure
- Patent number 11,784,204
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and layout of an integrated circuit
- Patent number 11,714,947
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mahantesh Hanchinal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Boundary cell
- Patent number 11,709,986
- Issue date Jul 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Jung Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing light emitting diode packaging structure
- Patent number 11,670,749
- Issue date Jun 6, 2023
- Lextar Electronics Corporation
- Chih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for adjusting skew of circuit signal and adjusting method...
- Patent number 11,630,479
- Issue date Apr 18, 2023
- Global Unichip Corporation
- Tse-Wei Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image sensor having improved full well capacity and related method...
- Patent number 11,545,513
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer, metal removal composition, and method of removing metal ions
- Patent number 11,472,961
- Issue date Oct 18, 2022
- Industrial Technology Research Institute
- Min-Fei Tsai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Conductive contact for ion through-substrate via
- Patent number 11,398,516
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and layout of an integrated circuit
- Patent number 11,341,308
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mahantesh Hanchinal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Detection circuit and detection method
- Patent number 11,315,656
- Issue date Apr 26, 2022
- Realtek Semiconductor Corp.
- Shih-Han Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Light emitting diode packaging structure and method for manufacturi...
- Patent number 11,296,269
- Issue date Apr 5, 2022
- Lextar Electronics Corporation
- Chih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Establishing method for timing model
- Patent number 11,256,838
- Issue date Feb 22, 2022
- Hsin-Hsiung Liao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor-on-insulator (SOI) substrate having dielectric struct...
- Patent number 11,232,975
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench isolations and methods of forming the same
- Patent number 11,217,621
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixing device for clock tree and fixing method thereof
- Patent number 11,182,524
- Issue date Nov 23, 2021
- Global Unichip Corporation
- Chen-Yuan Kao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Composite semiconductor substrate, semiconductor device and method...
- Patent number 11,171,039
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with anti-acid layer and method for...
- Patent number 11,158,659
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yin-Shuo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having stacked conformal films
- Patent number 11,101,307
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having improved full well capacity and related method...
- Patent number 11,069,733
- Issue date Jul 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boundary cell
- Patent number 11,062,074
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Jung Chang
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Mixed Compiling for Memory Units and Logic Units in an Integrated C...
- Publication number 20240354244
- Publication date Oct 24, 2024
- MEDIATEK INC.
- Chia-Yu Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT-EMITTING ELEMENT
- Publication number 20240266476
- Publication date Aug 8, 2024
- EPISTAR CORPORATION
- Chao-Hsing CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory system, memory access interface device and operation method...
- Publication number 20240231416
- Publication date Jul 11, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- FU-CHIN TSAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT EMITTING DIODE PACKAGING STRUCTURE
- Publication number 20240194848
- Publication date Jun 13, 2024
- Lextar Electronics Corporation
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACT FOR ION THROUGH-SUBSTRATE VIA
- Publication number 20240170524
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory system, memory access interface device and operation method...
- Publication number 20240134410
- Publication date Apr 25, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- FU-CHIN TSAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD OF VERIFYING SLANTED LAYOUT COMPONENTS
- Publication number 20240086613
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Te Hou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENHANCED TRENCH ISOLATION STRUCTURE
- Publication number 20240021642
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT ABSORBING LAYER TO ENHANCE P-TYPE DIFFUSION FOR DTI IN IMAGE...
- Publication number 20230411425
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICE TESTING METHOD
- Publication number 20230366927
- Publication date Nov 16, 2023
- TANGO AI CORP.
- MIN-JU TSAI
- G01 - MEASURING TESTING
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING
- Publication number 20230361164
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPTURE IR DROP ANALYZER AND ANALYZING METHOD THEREOF
- Publication number 20230342536
- Publication date Oct 26, 2023
- GLOBAL UNICHIP CORPORATION
- Chen-Yuan Kao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BOUNDARY CELL
- Publication number 20230315968
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jung Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT EMITTING DIODE PACKAGING STRUCTURE
- Publication number 20230261165
- Publication date Aug 17, 2023
- Lextar Electronics Corporation
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR CREATING DIPOLE MOMENT MODEL
- Publication number 20230103493
- Publication date Apr 6, 2023
- REALTEK SEMICONDUCTOR CORPORATION
- Min-Hsu TSAI
- G01 - MEASURING TESTING
Information Patent Application
PIXEL UNIT AND MANUFACTURING METHOD THEREOF
- Publication number 20230074731
- Publication date Mar 9, 2023
- Lextar Electronics Corporation
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230070973
- Publication date Mar 9, 2023
- Lextar Electronics Corporation
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF VERIFYING SLANTED LAYOUT COMPONENTS
- Publication number 20230045023
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Yuan-Te Hou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD
- Publication number 20220399269
- Publication date Dec 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR
- Publication number 20220384496
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT ABSORBING LAYER TO ENHANCE P-TYPE DIFFUSION FOR DTI IN IMAGE...
- Publication number 20220367535
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODIODE STRUCTURE FOR IMAGE SENSOR
- Publication number 20220320154
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACT FOR ION THROUGH-SUBSTRATE VIA
- Publication number 20220310691
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND LAYOUT OF AN INTEGRATED CIRCUIT
- Publication number 20220284165
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mahantesh HANCHINAL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGING STRUCTURE
- Publication number 20220190225
- Publication date Jun 16, 2022
- Lextar Electronics Corporation
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deep Trench Isolations and Methods of Forming the Same
- Publication number 20220130888
- Publication date Apr 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED TRENCH ISOLATION STRUCTURE
- Publication number 20220123031
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Ying Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE PACKAGING STRUCTURE AND METHOD FOR MANUFACTURI...
- Publication number 20220037569
- Publication date Feb 3, 2022
- Lextar Electronics Corporation
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20210375962
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-YU LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ADJUSTING SKEW OF CIRCUIT SIGNAL AND ADJUSTING METHOD...
- Publication number 20210341962
- Publication date Nov 4, 2021
- GLOBAL UNICHIP CORPORATION
- Tse-Wei Wu
- G06 - COMPUTING CALCULATING COUNTING

Min-Hsiu Tsai

Person

Patents Grantslast 30 patents

Method and system for creating dipole moment model

Deep trench isolations and methods of forming the same

Image sensor having stacked metal oxide films as fixed charge film

Light-emitting element with cushion part

Light emitting diode packaging structure

Conductive contact for ion through-substrate via

Dice testing method

Back-side deep trench isolation structure for image sensor

System and method of verifying slanted layout components

Light absorbing layer to enhance P-type diffusion for DTI in image...

Enhanced trench isolation structure

Method and layout of an integrated circuit

Boundary cell

Method for manufacturing light emitting diode packaging structure

Apparatus for adjusting skew of circuit signal and adjusting method...

Image sensor having improved full well capacity and related method...

Polymer, metal removal composition, and method of removing metal ions

Conductive contact for ion through-substrate via

Method and layout of an integrated circuit

Detection circuit and detection method

Light emitting diode packaging structure and method for manufacturi...

Establishing method for timing model

Semiconductor-on-insulator (SOI) substrate having dielectric struct...

Deep trench isolations and methods of forming the same

Fixing device for clock tree and fixing method thereof

Composite semiconductor substrate, semiconductor device and method...

Semiconductor device structure with anti-acid layer and method for...

Image sensor having stacked conformal films

Image sensor having improved full well capacity and related method...

Boundary cell

Patents Applicationslast 30 patents

Mixed Compiling for Memory Units and Logic Units in an Integrated C...

LIGHT-EMITTING ELEMENT

Memory system, memory access interface device and operation method...

LIGHT EMITTING DIODE PACKAGING STRUCTURE

CONDUCTIVE CONTACT FOR ION THROUGH-SUBSTRATE VIA

Memory system, memory access interface device and operation method...

SYSTEM AND METHOD OF VERIFYING SLANTED LAYOUT COMPONENTS

ENHANCED TRENCH ISOLATION STRUCTURE

LIGHT ABSORBING LAYER TO ENHANCE P-TYPE DIFFUSION FOR DTI IN IMAGE...

DICE TESTING METHOD

METAL-INSULATOR-METAL CAPACITOR AND METHODS OF MANUFACTURING

CAPTURE IR DROP ANALYZER AND ANALYZING METHOD THEREOF

BOUNDARY CELL

LIGHT EMITTING DIODE PACKAGING STRUCTURE

METHOD AND SYSTEM FOR CREATING DIPOLE MOMENT MODEL

PIXEL UNIT AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE, DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

SYSTEM AND METHOD OF VERIFYING SLANTED LAYOUT COMPONENTS

INTEGRATED CIRCUIT DEVICE AND METHOD

BACK-SIDE DEEP TRENCH ISOLATION STRUCTURE FOR IMAGE SENSOR

LIGHT ABSORBING LAYER TO ENHANCE P-TYPE DIFFUSION FOR DTI IN IMAGE...

PHOTODIODE STRUCTURE FOR IMAGE SENSOR

CONDUCTIVE CONTACT FOR ION THROUGH-SUBSTRATE VIA

METHOD AND LAYOUT OF AN INTEGRATED CIRCUIT

METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGING STRUCTURE

Deep Trench Isolations and Methods of Forming the Same

ENHANCED TRENCH ISOLATION STRUCTURE

LIGHT EMITTING DIODE PACKAGING STRUCTURE AND METHOD FOR MANUFACTURI...

IMAGE SENSOR DEVICE AND METHOD OF FABRICATING THE SAME

APPARATUS FOR ADJUSTING SKEW OF CIRCUIT SIGNAL AND ADJUSTING METHOD...