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Suwon-Si, KR
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last 30 patents
Information
Patent Grant
Printed circuit board
Patent number
11,382,213
Issue date
Jul 5, 2022
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Kee Su Jeon
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board and package structure
Patent number
10,950,587
Issue date
Mar 16, 2021
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Kee-Su Jeon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board and manufacturing method thereof
Patent number
10,064,291
Issue date
Aug 28, 2018
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Tae-Hong Min
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board and assembly thereof
Patent number
9,992,865
Issue date
Jun 5, 2018
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Tae-Hong Min
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package board, method for manufacturing the same and package on pac...
Patent number
9,793,250
Issue date
Oct 17, 2017
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Myung Sam Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board including heat dissipation structure
Patent number
9,699,885
Issue date
Jul 4, 2017
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Tae Hong Min
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
PRINTED CIRCUIT BOARD
Publication number
20220141953
Publication date
May 5, 2022
Samsung Electro-Mechanics Co., Ltd.
Kee Su Jeon
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD AND PACKAGE STRUCTURE
Publication number
20200144234
Publication date
May 7, 2020
Samsung Electro-Mechanics Co., Ltd.
Kee-Su JEON
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND ASSEMBLY THEREOF
Publication number
20160249457
Publication date
Aug 25, 2016
Samsung Electro-Mechanics Co., Ltd.
Tae-Hong MIN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Publication number
20160192471
Publication date
Jun 30, 2016
Samsung Electro-Mechanics Co., Ltd.
Tae-Hong MIN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD INCLUDING HEAT DISSIPATION STRUCTURE
Publication number
20160095198
Publication date
Mar 31, 2016
Samsung Electro-Mechanics Co., Ltd.
Tae Hong MIN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD
Publication number
20160095203
Publication date
Mar 31, 2016
Samsung Electro-Mechanics Co., Ltd.
Tae Hong MIN
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE BOARD, METHOD FOR MANUFACTURING THE SAME AND PACKAGE ON PAC...
Publication number
20160081182
Publication date
Mar 17, 2016
Samsung Electro-Mechanics Co., Ltd.
Myung Sam KANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PRINTED CIRCUIT BOARD, METHOD FOR MAUFACTURING THE SAME AND PACKAGE...
Publication number
20150342046
Publication date
Nov 26, 2015
Samsung Electro-Mechanics Co., Ltd.
Hye Jin KIM
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR