MIN KEEN TANG

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Taman Sri Nibong, MY

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic package having electromagnetic interference shielding
- Patent number 11,189,574
- Issue date Nov 30, 2021
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of millimeter wave antennas in reduced form factor plat...
- Patent number 10,522,898
- Issue date Dec 31, 2019
- Intel Corporation
- Min Keen Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package including floating package stiffener
- Patent number 9,900,976
- Issue date Feb 20, 2018
- Intel Corporation
- Chung-Hao Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Board-edge interconnection module with integrated capacitive coupli...
- Patent number 9,893,444
- Issue date Feb 13, 2018
- Intel Corporation
- Jackson Chung Peng Kong
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20210118809
- Publication date Apr 22, 2021
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF MILLIMETER WAVE ANTENNAS IN REDUCED FORM FACTOR PLAT...
- Publication number 20190058240
- Publication date Feb 21, 2019
- Intel Corporation
- MIN KEEN TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD-EDGE INTERCONNECTION MODULE WITH INTEGRATED CAPACITIVE COUPLI...
- Publication number 20170093064
- Publication date Mar 30, 2017
- Intel Corporation
- JACKSON CHUNG PENG KONG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROSTATIC DISCHARGE FOR ELECTRONIC DEVICE COUPLING
- Publication number 20160380386
- Publication date Dec 29, 2016
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE FOR ELECTRONIC DEVICE COUPLING
- Publication number 20160211619
- Publication date Jul 21, 2016
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS