Min-Kun Dai

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,167,609
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Min-Kun Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wide-bandgap semiconductor layer characterization
- Patent number 12,078,607
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor including a hydrogen-diffusion barrier and methods for f...
- Patent number 11,935,935
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Min-Kun Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM device structures and method of fabricating the same
- Patent number 11,856,854
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Feng Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with enhanced dopant profile and methods for forming th...
- Patent number 11,837,667
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Min-Kun Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with enhanced dopant profile and methods for forming th...
- Patent number 11,404,586
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Min-Kun Dai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTION FOR A MEMORY ARRAY AND METHODS FOR FORMING THE SAME
- Publication number 20240389465
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Yin
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240389343
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-KUN DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR INCLUDING A HYDROGEN-DIFFUSION BARRIER AND METHODS FOR F...
- Publication number 20240162318
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Min-Kun Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE STRUCTURES AND METHODS OF FABRICATING THE SAME
- Publication number 20240099149
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Yin
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD OF FORMING FERROELECTRIC MEMORY DEVICE
- Publication number 20230363173
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Rainer Yen-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIT-LINE RESISTANCE REDUCTION
- Publication number 20230157032
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Yin
- G11 - INFORMATION STORAGE
Information Patent Application
WIDE-BANDGAP SEMICONDUCTOR LAYER CHARACTERIZATION
- Publication number 20230050640
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yu CHANG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230036606
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- MIN-KUN DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR INCLUDING A HYDROGEN-DIFFUSION BARRIER AND METHODS FOR F...
- Publication number 20220352333
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Min-Kun DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnection For A Memory Array And Methods For Forming The Same
- Publication number 20220336733
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS WITH ENHANCED DOPANT PROFILE AND METHODS FOR FORMING TH...
- Publication number 20220336671
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Min-Kun Dai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM Device Structures and Method of Fabricating the Same
- Publication number 20220328758
- Publication date Oct 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Feng Yin
- G11 - INFORMATION STORAGE
Information Patent Application
Transistors with Enhanced Dopant Profile and Methods for Forming th...
- Publication number 20220254930
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Min-Kun DAI
- H01 - BASIC ELECTRIC ELEMENTS

Min-Kun Dai

Person

Patents Grantslast 30 patents

Semiconductor structure and method of forming the same

Wide-bandgap semiconductor layer characterization

Transistor including a hydrogen-diffusion barrier and methods for f...

MRAM device structures and method of fabricating the same

Transistors with enhanced dopant profile and methods for forming th...

Transistors with enhanced dopant profile and methods for forming th...

Patents Applicationslast 30 patents

INTERCONNECTION FOR A MEMORY ARRAY AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

TRANSISTOR INCLUDING A HYDROGEN-DIFFUSION BARRIER AND METHODS FOR F...

MRAM DEVICE STRUCTURES AND METHODS OF FABRICATING THE SAME

METHOD OF FORMING FERROELECTRIC MEMORY DEVICE

BIT-LINE RESISTANCE REDUCTION

WIDE-BANDGAP SEMICONDUCTOR LAYER CHARACTERIZATION

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

TRANSISTOR INCLUDING A HYDROGEN-DIFFUSION BARRIER AND METHODS FOR F...

Interconnection For A Memory Array And Methods For Forming The Same

TRANSISTORS WITH ENHANCED DOPANT PROFILE AND METHODS FOR FORMING TH...

MRAM Device Structures and Method of Fabricating the Same

Transistors with Enhanced Dopant Profile and Methods for Forming th...