Min Kyu Hwang

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Uiwang-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Optically clear adhesive for dicing die bonding film
- Patent number 9,133,367
- Issue date Sep 15, 2015
- Cheil Industries, Inc.
- Kyoung Jin Ha
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing die bonding film, semiconductor wafer, and semiconductor device
- Patent number 8,609,515
- Issue date Dec 17, 2013
- Cheil Industries, Inc.
- Min Kyu Hwang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
DICING DIE BONDING FILM
- Publication number 20130273355
- Publication date Oct 17, 2013
- Dong Seon UH
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
DICING DIE BONDING FILM, SEMICONDUCTOR WAFER, AND SEMICONDUCTOR DEVICE
- Publication number 20120171844
- Publication date Jul 5, 2012
- Min Kyu HWANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
OPTICALLY CLEAR ADHESIVE FOR DICING DIE BONDING FILM
- Publication number 20120171481
- Publication date Jul 5, 2012
- Kyoung Jin Ha
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE
- Publication number 20120141786
- Publication date Jun 7, 2012
- Dong Seon UH
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIE-ATTACH FILM AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110159223
- Publication date Jun 30, 2011
- Baek Soung Park
- H01 - BASIC ELECTRIC ELEMENTS