Min-Ok Na

Person

Bucheon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface material layer and package-on-package device incl...
- Patent number 10,950,521
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Min-Ok Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor packages
- Patent number 10,593,652
- Issue date Mar 17, 2020
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material layer and package-on-package device incl...
- Patent number 10,431,522
- Issue date Oct 1, 2019
- Samsung Electronics Co., Ltd.
- Min-Ok Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package
- Patent number 10,403,606
- Issue date Sep 3, 2019
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for stacked semiconductor packages and methods of fabrica...
- Patent number 9,978,721
- Issue date May 22, 2018
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material layer and package-on-package device incl...
- Patent number 9,899,294
- Issue date Feb 20, 2018
- Samsung Electronics Co., Ltd.
- Min-Ok Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packages
- Patent number 9,214,484
- Issue date Dec 15, 2015
- Samsung Electronics Co., Ltd.
- Ok-Gyeong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor packages
- Patent number 9,042,115
- Issue date May 26, 2015
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages having fastening element and halogen-free inter-pack...
- Patent number 9,040,351
- Issue date May 26, 2015
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly including adhesive containment element
- Patent number 8,829,686
- Issue date Sep 9, 2014
- Samsung Electronics Co., Ltd.
- Ji-Sun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor package
- Patent number 8,709,879
- Issue date Apr 29, 2014
- Samsung Electronics Co., Ltd.
- Ji-hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems employing a stacked semiconductor package
- Patent number 8,508,954
- Issue date Aug 13, 2013
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,426,959
- Issue date Apr 23, 2013
- Samsung Electronics Co., Ltd.
- Ji-hyun Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...
- Publication number 20200006188
- Publication date Jan 2, 2020
- SAMSUNG ELECTRONICS CO., LTD.
- Min-Ok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...
- Publication number 20190319012
- Publication date Oct 17, 2019
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...
- Publication number 20180331071
- Publication date Nov 15, 2018
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...
- Publication number 20180145006
- Publication date May 24, 2018
- Samsung Electronics Co., Ltd.
- Min-Ok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES, METHODS FOR FABRICATING THE SAME, A...
- Publication number 20160358893
- Publication date Dec 8, 2016
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...
- Publication number 20160190035
- Publication date Jun 30, 2016
- Min-Ok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES, METHODS FOR FABRICATING THE SAME, A...
- Publication number 20150228627
- Publication date Aug 13, 2015
- Heung-Kyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGES
- Publication number 20150130011
- Publication date May 14, 2015
- Samsung Electronics Co., LTD
- Ok-Gyeong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...
- Publication number 20140335657
- Publication date Nov 13, 2014
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES
- Publication number 20130292828
- Publication date Nov 7, 2013
- Heung-Kyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130203219
- Publication date Aug 8, 2013
- Ji-hyun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY
- Publication number 20130187288
- Publication date Jul 25, 2013
- Samsung Electronics Co., Ltd.
- Ji-Sun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...
- Publication number 20120280404
- Publication date Nov 8, 2012
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...
- Publication number 20110149493
- Publication date Jun 23, 2011
- Samsung Electronics Co., Ltd.
- Heung-Kyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110042797
- Publication date Feb 24, 2011
- Samsung Electronics Co., Ltd.
- Ji-hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DICING
- Publication number 20080160724
- Publication date Jul 3, 2008
- Samsung Electronics Co., Ltd.
- Hyun-Jung SONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20080064215
- Publication date Mar 13, 2008
- Samsung Electronics Co., Ltd.
- Min-ok NA
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thermal interface material layer and package-on-package device incl...

Stacked semiconductor packages

Thermal interface material layer and package-on-package device incl...

Method of fabricating a semiconductor package

Apparatus for stacked semiconductor packages and methods of fabrica...

Thermal interface material layer and package-on-package device incl...

Image sensor packages

Stacked semiconductor packages

Stack packages having fastening element and halogen-free inter-pack...

Package-on-package assembly including adhesive containment element

Method of forming a semiconductor package

Systems employing a stacked semiconductor package

Semiconductor package and method of manufacturing the same

Patents Applicationslast 30 patents

THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...

STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...

STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...

THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...

STACKED SEMICONDUCTOR PACKAGES, METHODS FOR FABRICATING THE SAME, A...

THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...

STACKED SEMICONDUCTOR PACKAGES, METHODS FOR FABRICATING THE SAME, A...

IMAGE SENSOR PACKAGES

STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...

STACKED SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE-ON-PACKAGE ASSEMBLY

STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACK...

STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AN...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHOD OF DICING

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE