Min Pei

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Camas, WA, US

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Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD...
- Publication number 20240413054
- Publication date Dec 12, 2024
- Intel Corporation
- Min Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVERS FOR INTEGRATED CIRCUIT PACKAGE SOCKETS
- Publication number 20240407092
- Publication date Dec 5, 2024
- Intel Corporation
- Ariatne Ramirez Macias
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR LOW LEVEL CONTACT RESISTANCE TESTING APPARATUS FOR PROCESS...
- Publication number 20240133945
- Publication date Apr 25, 2024
- Mohanraj Prabhugoud
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE WARPAGE REDUCTION TECHNIQUES WITH LAMINATE GLASS CLOTH W...
- Publication number 20230209702
- Publication date Jun 29, 2023
- Intel Corporation
- Satyajit WALWADKAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS TO IMPROVE PIN CONTACT OF A COMPONENT STACK
- Publication number 20230014898
- Publication date Jan 19, 2023
- Intel Corporation
- Phil Geng
- H01 - BASIC ELECTRIC ELEMENTS