Min Suk SUH

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Actuator with multipolar magnet structure
- Patent number 11,824,417
- Issue date Nov 21, 2023
- JAHWA electronics Co., Ltd.
- Je Seung Yeon
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Actuator with multipolar magnet structure
- Patent number 10,938,290
- Issue date Mar 2, 2021
- JAHWA electronics Co., Ltd.
- Je Seung Yeon
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Apparatus for supporting optical reflector
- Patent number 10,571,093
- Issue date Feb 25, 2020
- JAHWA electronics Co., Ltd.
- Chul Soon Park
- F21 - LIGHTING
Information Patent Grant
Stacked wafer level package having a reduced size
- Patent number 8,847,377
- Issue date Sep 30, 2014
- SK Hynix Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor package and semiconductor package havin...
- Patent number 8,698,283
- Issue date Apr 15, 2014
- SK Hynix Inc.
- Min Suk Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible semiconductor package and method for fabricating the same
- Patent number 8,524,530
- Issue date Sep 3, 2013
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package module
- Patent number 8,395,245
- Issue date Mar 12, 2013
- Hynix Semiconductor Inc.
- Jong Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for manufacturing the same via hol...
- Patent number 8,361,838
- Issue date Jan 29, 2013
- Hynix Semiconductor Inc.
- Seung Taek Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an internal cooling system
- Patent number 8,358,016
- Issue date Jan 22, 2013
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stacked chips and method for manufacturi...
- Patent number 8,319,327
- Issue date Nov 27, 2012
- SK Hynix Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cube semiconductor package composed of a plurality of stacked toget...
- Patent number 8,299,592
- Issue date Oct 30, 2012
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor package and semiconductor package havin...
- Patent number 8,299,582
- Issue date Oct 30, 2012
- Hynix Semiconductor Inc.
- Min Suk Suh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package through-electrode suitable for a stacked semi...
- Patent number 8,232,654
- Issue date Jul 31, 2012
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package having reduced electrical connection length suitable...
- Patent number 8,202,762
- Issue date Jun 19, 2012
- Hynix Semiconductor Inc.
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a stacked wafer level package and meth...
- Patent number 8,203,217
- Issue date Jun 19, 2012
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an internal cooling system
- Patent number 8,159,065
- Issue date Apr 17, 2012
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible semiconductor package and method for fabricating the same
- Patent number 8,097,933
- Issue date Jan 17, 2012
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 8,049,341
- Issue date Nov 1, 2011
- Hynix Semiconductor Inc.
- Seung Taek Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having side walls and method for manufacturin...
- Patent number 8,018,043
- Issue date Sep 13, 2011
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package through-electrode suitable for a stacked semi...
- Patent number 7,973,414
- Issue date Jul 5, 2011
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same for dec...
- Patent number 7,923,294
- Issue date Apr 12, 2011
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a stacked wafer level package and meth...
- Patent number 7,911,065
- Issue date Mar 22, 2011
- Hynix Semiconductor, Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package and method for manufacturing the same
- Patent number 7,871,925
- Issue date Jan 18, 2011
- Hynix Semiconductor Inc.
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for improving characteristics for transmittin...
- Patent number 7,859,115
- Issue date Dec 28, 2010
- Hynix Semiconductor Inc.
- Jong Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package having pattern die redistribution
- Patent number 7,834,463
- Issue date Nov 16, 2010
- Hynix Semiconductor Inc.
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package
- Patent number 7,795,139
- Issue date Sep 14, 2010
- Hynix Semiconductor Inc.
- Kwon Whan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same for dec...
- Patent number 7,732,931
- Issue date Jun 8, 2010
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package utilizing through vias and re-distribution lines
- Patent number 7,598,617
- Issue date Oct 6, 2009
- Hynix Semiconductor Inc.
- Seung Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack package having guard ring which insulates through-via interco...
- Patent number 7,525,186
- Issue date Apr 28, 2009
- Hynix Semiconductor Inc.
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer level stack package
- Patent number 7,507,637
- Issue date Mar 24, 2009
- Hynix Semiconductor Inc.
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SHORT WAVELENGTH INFRARED UP-CONVERSION DEVICE
- Publication number 20240389378
- Publication date Nov 21, 2024
- University-Industry Cooperation Group of Kyung Hee University
- Hyeonggeun YU
Information Patent Application
ACTUATOR WITH MULTIPOLAR MAGNET STRUCTURE
- Publication number 20210119523
- Publication date Apr 22, 2021
- JAHWA ELECTRONICS CO., LTD.
- Je Seung YEON
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ACTUATOR WITH MULTIPOLAR MAGNET STRUCTURE
- Publication number 20200127548
- Publication date Apr 23, 2020
- JAHWA ELECTRONICS CO., LTD.
- Je Seung YEON
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
APPARATUS FOR SUPPORTING OPTICAL REFLECTOR
- Publication number 20180224088
- Publication date Aug 9, 2018
- JAHWA ELECTRONICS CO., LTD.
- Chul Soon PARK
- F21 - LIGHTING
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVIN...
- Publication number 20130020683
- Publication date Jan 24, 2013
- Hynix Semiconductor Inc.
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE
- Publication number 20120299199
- Publication date Nov 29, 2012
- SK HYNIX INC.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE
- Publication number 20120299169
- Publication date Nov 29, 2012
- SK HYNIX INC.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERNAL COOLING SYSTEM
- Publication number 20120175783
- Publication date Jul 12, 2012
- Hynix Semiconductor Inc.
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20120083074
- Publication date Apr 5, 2012
- Hynix Semiconductor Inc.
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120009736
- Publication date Jan 12, 2012
- Hynix Semiconductor Inc.
- Seung Taek YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH FINE PITCH LEADS FOR NORMAL TESTING OF SAME
- Publication number 20110309358
- Publication date Dec 22, 2011
- Hynix Semiconductor Inc.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE HAVING REDUCED ELECTRICAL CONNECTION LENGTH SUITABLE...
- Publication number 20110312128
- Publication date Dec 22, 2011
- Hynix Semiconductor Inc.
- Sung Min KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURIN...
- Publication number 20110287584
- Publication date Nov 24, 2011
- Hynix Semiconductor Inc.
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE
- Publication number 20110233795
- Publication date Sep 29, 2011
- Hynix Semiconductor Inc.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH STACKED CHIPS AND METHOD FOR MANUFACTURI...
- Publication number 20110227217
- Publication date Sep 22, 2011
- Hynix Semiconductor Inc.
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE THROUGH-ELECTRODE SUITABLE FOR A STACKED SEMI...
- Publication number 20110198722
- Publication date Aug 18, 2011
- Hynix Semiconductor Inc.
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A STACKED WAFER LEVEL PACKAGE AND METH...
- Publication number 20110127672
- Publication date Jun 2, 2011
- Hynix Semiconductor Inc.
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERNAL COOLING SYSTEM
- Publication number 20100224990
- Publication date Sep 9, 2010
- Hynix Semiconductor Inc.
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME FOR DEC...
- Publication number 20100203720
- Publication date Aug 12, 2010
- Hynix Semiconductor Inc.
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUBE SEMICONDUCTOR PACKAGE COMPOSED OF A PLURALITY OF STACKED TOGET...
- Publication number 20100187676
- Publication date Jul 29, 2010
- Min Suk Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR IMPROVING CHARACTERISTICS FOR TRANSMITTIN...
- Publication number 20100117208
- Publication date May 13, 2010
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20100084771
- Publication date Apr 8, 2010
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVIN...
- Publication number 20100052109
- Publication date Mar 4, 2010
- Min Suk SUH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090298229
- Publication date Dec 3, 2009
- Seong Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090230565
- Publication date Sep 17, 2009
- Seung Taek YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURIN...
- Publication number 20090224392
- Publication date Sep 10, 2009
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090181494
- Publication date Jul 16, 2009
- Sung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE
- Publication number 20090166836
- Publication date Jul 2, 2009
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE
- Publication number 20090121326
- Publication date May 14, 2009
- Jong Hoon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE THROUGH-ELECTRODE SUITABLE FOR A STACKED SEMI...
- Publication number 20090045504
- Publication date Feb 19, 2009
- Min Suk SUH
- H01 - BASIC ELECTRIC ELEMENTS

Min Suk SUH

Person

Patents Grantslast 30 patents

Actuator with multipolar magnet structure

Actuator with multipolar magnet structure

Apparatus for supporting optical reflector

Stacked wafer level package having a reduced size

Substrate for semiconductor package and semiconductor package havin...

Flexible semiconductor package and method for fabricating the same

Semiconductor package module

Semiconductor package and method for manufacturing the same via hol...

Semiconductor package having an internal cooling system

Semiconductor package with stacked chips and method for manufacturi...

Cube semiconductor package composed of a plurality of stacked toget...

Substrate for semiconductor package and semiconductor package havin...

Semiconductor package through-electrode suitable for a stacked semi...

Stack package having reduced electrical connection length suitable...

Semiconductor package having a stacked wafer level package and meth...

Semiconductor package having an internal cooling system

Flexible semiconductor package and method for fabricating the same

Semiconductor package and method for manufacturing the same

Semiconductor package having side walls and method for manufacturin...

Semiconductor package through-electrode suitable for a stacked semi...

Semiconductor package and method for manufacturing the same for dec...

Semiconductor package having a stacked wafer level package and meth...

Stack package and method for manufacturing the same

Semiconductor package for improving characteristics for transmittin...

Stack package having pattern die redistribution

Method for manufacturing semiconductor package

Semiconductor package and method for manufacturing the same for dec...

Stack package utilizing through vias and re-distribution lines

Stack package having guard ring which insulates through-via interco...

Method of manufacturing wafer level stack package

Patents Applicationslast 30 patents

SHORT WAVELENGTH INFRARED UP-CONVERSION DEVICE

ACTUATOR WITH MULTIPOLAR MAGNET STRUCTURE

ACTUATOR WITH MULTIPOLAR MAGNET STRUCTURE

APPARATUS FOR SUPPORTING OPTICAL REFLECTOR

SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVIN...

STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE

STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE

SEMICONDUCTOR PACKAGE HAVING AN INTERNAL COOLING SYSTEM

FLEXIBLE SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR CHIP WITH FINE PITCH LEADS FOR NORMAL TESTING OF SAME

STACK PACKAGE HAVING REDUCED ELECTRICAL CONNECTION LENGTH SUITABLE...

SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURIN...

STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE

SEMICONDUCTOR PACKAGE WITH STACKED CHIPS AND METHOD FOR MANUFACTURI...

SEMICONDUCTOR PACKAGE THROUGH-ELECTRODE SUITABLE FOR A STACKED SEMI...

SEMICONDUCTOR PACKAGE HAVING A STACKED WAFER LEVEL PACKAGE AND METH...

SEMICONDUCTOR PACKAGE HAVING AN INTERNAL COOLING SYSTEM

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME FOR DEC...

CUBE SEMICONDUCTOR PACKAGE COMPOSED OF A PLURALITY OF STACKED TOGET...

SEMICONDUCTOR PACKAGE FOR IMPROVING CHARACTERISTICS FOR TRANSMITTIN...

FLEXIBLE SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVIN...

FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURIN...

STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME

STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE

SEMICONDUCTOR PACKAGE MODULE

SEMICONDUCTOR PACKAGE THROUGH-ELECTRODE SUITABLE FOR A STACKED SEMI...