Min Tao

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Direct-bonded LED structure contacts and substrate contacts
- Patent number 11,329,034
- Issue date May 10, 2022
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Configurable smart object system with methods of making modules and...
- Patent number 11,246,230
- Issue date Feb 8, 2022
- Xcelsis Corporation
- Belgacem Haba
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Configurable smart object system with clip-based connectors
- Patent number 11,239,587
- Issue date Feb 1, 2022
- Xcelsis Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device display with a backlight
- Patent number 11,221,513
- Issue date Jan 11, 2022
- Apple Inc.
- Supriya Goyal
- G02 - OPTICS
Information Patent Grant
Stretchable film assembly with conductive traces
- Patent number 10,955,671
- Issue date Mar 23, 2021
- Invensas Corporation
- Belgacem Haba
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Configurable smart object system with magnetic contacts and magneti...
- Patent number 10,734,759
- Issue date Aug 4, 2020
- Xcelsis Corporation
- Belgacem Haba
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Direct-bonded LED arrays and applications
- Patent number 10,629,577
- Issue date Apr 21, 2020
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-surface edge pads for vertical mount packages and methods of...
- Patent number 10,354,945
- Issue date Jul 16, 2019
- Invensas Corporation
- Rajesh Katkar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dies-on-package devices and methods therefor
- Patent number 10,354,976
- Issue date Jul 16, 2019
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package devices with same level WLP components and metho...
- Patent number 9,991,233
- Issue date Jun 5, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package devices with upper RDL of WLPS and methods therefor
- Patent number 9,991,235
- Issue date Jun 5, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on-package devices with multiple levels and methods therefor
- Patent number 9,985,007
- Issue date May 29, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaged components and methods therefor
- Patent number 9,972,573
- Issue date May 15, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package devices with WLP components with dual RDLs for s...
- Patent number 9,972,609
- Issue date May 15, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced density assembly having microelectronic packages mounted a...
- Patent number 9,728,524
- Issue date Aug 8, 2017
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED SENSORS IN IMMERSIVE REALITY HEADSETS TO ENABLE SOCIAL PRE...
- Publication number 20240153182
- Publication date May 9, 2024
- Meta Platforms Technologies, LLC
- John Robert Volk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIRECT-BONDED LED ARRAYS AND APPLICATIONS
- Publication number 20210288037
- Publication date Sep 16, 2021
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE FILM ASSEMBLY WITH CONDUCTIVE TRACES
- Publication number 20210181511
- Publication date Jun 17, 2021
- Invensas Corporation
- Belgacem Haba
- G02 - OPTICS
Information Patent Application
DIRECT-BONDED LED ARRAYS AND APPLICATIONS
- Publication number 20200235085
- Publication date Jul 23, 2020
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device Display with a Backlight
- Publication number 20200133046
- Publication date Apr 30, 2020
- Apple Inc.
- Supriya Goyal
- G02 - OPTICS
Information Patent Application
CONFIGURABLE SMART OBJECT SYSTEM WITH CLIP-BASED CONNECTORS
- Publication number 20190280408
- Publication date Sep 12, 2019
- Xcelsis Corporation
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE SMART OBJECT SYSTEM WITH MAGNETIC CONTACTS AND MAGNETI...
- Publication number 20190280428
- Publication date Sep 12, 2019
- Xcelsis Corporation
- Belgacem HABA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONFIGURABLE SMART OBJECT SYSTEM WITH GRID OR FRAME-BASED CONNECTORS
- Publication number 20190280421
- Publication date Sep 12, 2019
- Xcelsis Corporation
- Belgacem HABA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRETCHABLE FILM ASSEMBLY WITH CONDUCTIVE TRACES
- Publication number 20190273016
- Publication date Sep 5, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE SMART OBJECT SYSTEM WITH STANDARD CONNECTORS FOR ADDIN...
- Publication number 20190097362
- Publication date Mar 28, 2019
- Xcelsis Corporation
- Belgacem HABA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Direct-Bonded LED Arrays and Applications
- Publication number 20190088633
- Publication date Mar 21, 2019
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE SMART OBJECT SYSTEM WITH METHODS OF MAKING MODULES AND...
- Publication number 20190029132
- Publication date Jan 24, 2019
- Xcelsis Corporation
- Belgacem HABA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Vertical Memory Module Enabled by Fan-Out Redistribution Layer
- Publication number 20180040587
- Publication date Feb 8, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-surface edge pads for vertical mount packages and methods of...
- Publication number 20180040544
- Publication date Feb 8, 2018
- Invensas Corporation
- Rajesh Emeka Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with Multiple Levels and Methods Therefor
- Publication number 20180026018
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Packaged Components and Methods Therefor
- Publication number 20180025987
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with Same Level WLP Components and Metho...
- Publication number 20180026011
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with Upper RDL of WLPS and Methods Therefor
- Publication number 20180026016
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dies-on-Package Devices and Methods Therefor
- Publication number 20180026017
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-Package Devices with WLP Components with Dual RDLS for S...
- Publication number 20180026019
- Publication date Jan 25, 2018
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Direct-bonded LED structure contacts and substrate contacts

Configurable smart object system with methods of making modules and...

Configurable smart object system with clip-based connectors

Electronic device display with a backlight

Stretchable film assembly with conductive traces

Configurable smart object system with magnetic contacts and magneti...

Direct-bonded LED arrays and applications

Multi-surface edge pads for vertical mount packages and methods of...

Dies-on-package devices and methods therefor

Package-on-package devices with same level WLP components and metho...

Package on-package devices with upper RDL of WLPS and methods therefor

Package on-package devices with multiple levels and methods therefor

Wafer-level packaged components and methods therefor

Package-on-package devices with WLP components with dual RDLs for s...

Enhanced density assembly having microelectronic packages mounted a...

Patents Applicationslast 30 patents

EMBEDDED SENSORS IN IMMERSIVE REALITY HEADSETS TO ENABLE SOCIAL PRE...

DIRECT-BONDED LED ARRAYS AND APPLICATIONS

STRETCHABLE FILM ASSEMBLY WITH CONDUCTIVE TRACES

DIRECT-BONDED LED ARRAYS AND APPLICATIONS

Electronic Device Display with a Backlight

CONFIGURABLE SMART OBJECT SYSTEM WITH CLIP-BASED CONNECTORS

CONFIGURABLE SMART OBJECT SYSTEM WITH MAGNETIC CONTACTS AND MAGNETI...

CONFIGURABLE SMART OBJECT SYSTEM WITH GRID OR FRAME-BASED CONNECTORS

STRETCHABLE FILM ASSEMBLY WITH CONDUCTIVE TRACES

CONFIGURABLE SMART OBJECT SYSTEM WITH STANDARD CONNECTORS FOR ADDIN...

Direct-Bonded LED Arrays and Applications

CONFIGURABLE SMART OBJECT SYSTEM WITH METHODS OF MAKING MODULES AND...

Vertical Memory Module Enabled by Fan-Out Redistribution Layer

Multi-surface edge pads for vertical mount packages and methods of...

Package-on-Package Devices with Multiple Levels and Methods Therefor

Wafer-Level Packaged Components and Methods Therefor

Package-on-Package Devices with Same Level WLP Components and Metho...

Package-on-Package Devices with Upper RDL of WLPS and Methods Therefor

Dies-on-Package Devices and Methods Therefor

Package-on-Package Devices with WLP Components with Dual RDLS for S...