Min TAO

Follow

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
BBUL top side substrate layer enabling dual sided silicon interconn...
- Patent number 9,691,728
- Issue date Jun 27, 2017
- Intel Corporation
- Robert M. Nickerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer for hermetic sealing of sensor chips and for their integ...
- Patent number 9,617,148
- Issue date Apr 11, 2017
- Intel Corporation
- Qing Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interposer for hermetic sealing of sensor chips and for their integ...
- Patent number 9,368,429
- Issue date Jun 14, 2016
- Intel Corporation
- Qing Ma
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEG...
- Publication number 20160280539
- Publication date Sep 29, 2016
- Intel Corporation
- Qing MA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BBUL TOP SIDE SUBSTRATE LAYER ENABLING DUAL SIDED SILICON INTERCONN...
- Publication number 20150171044
- Publication date Jun 18, 2015
- Intel Corporation
- Robert M. NICKERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEG...
- Publication number 20130249109
- Publication date Sep 26, 2013
- Qing MA
- B81 - MICRO-STRUCTURAL TECHNOLOGY