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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
BBUL top side substrate layer enabling dual sided silicon interconn...
Patent number
9,691,728
Issue date
Jun 27, 2017
Intel Corporation
Robert M. Nickerson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer for hermetic sealing of sensor chips and for their integ...
Patent number
9,617,148
Issue date
Apr 11, 2017
Intel Corporation
Qing Ma
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Interposer for hermetic sealing of sensor chips and for their integ...
Patent number
9,368,429
Issue date
Jun 14, 2016
Intel Corporation
Qing Ma
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
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Patent Application
INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEG...
Publication number
20160280539
Publication date
Sep 29, 2016
Intel Corporation
Qing MA
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
BBUL TOP SIDE SUBSTRATE LAYER ENABLING DUAL SIDED SILICON INTERCONN...
Publication number
20150171044
Publication date
Jun 18, 2015
Intel Corporation
Robert M. NICKERSON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEG...
Publication number
20130249109
Publication date
Sep 26, 2013
Qing MA
B81 - MICRO-STRUCTURAL TECHNOLOGY