Min-Tih Lai

Person

Orangeville, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Die stack with cascade and vertical connections
- Patent number 12,068,283
- Issue date Aug 20, 2024
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shrinkable package assembly
- Patent number 11,652,031
- Issue date May 16, 2023
- Intel Corporation
- Florence Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack with cascade and vertical connections
- Patent number 11,171,114
- Issue date Nov 9, 2021
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-grind die backside power delivery
- Patent number 10,910,301
- Issue date Feb 2, 2021
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array package extension
- Patent number 10,872,880
- Issue date Dec 22, 2020
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic device stacks having interior window wirebonding
- Patent number 10,770,429
- Issue date Sep 8, 2020
- Intel Corporation
- Min-Tih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates, assembles, and techniques to enable multi-chip flip chi...
- Patent number 10,748,873
- Issue date Aug 18, 2020
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with thermal fins
- Patent number 10,573,575
- Issue date Feb 25, 2020
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-grind die backside power delivery
- Patent number 10,483,198
- Issue date Nov 19, 2019
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array package extension
- Patent number 10,304,799
- Issue date May 28, 2019
- Intel Corporation
- Tyler Leuten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic convection cooling for handheld device
- Patent number 10,122,836
- Issue date Nov 6, 2018
- Intel Corporation
- Min-Tih Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Local stress-relieving devices, systems, and methods for electronic...
- Patent number 10,051,763
- Issue date Aug 14, 2018
- Intel Corporation
- Yuhong Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-grind die backside power delivery
- Patent number 10,032,707
- Issue date Jul 24, 2018
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE STACK WITH CASCADE AND VERTICAL CONNECTIONS
- Publication number 20220037291
- Publication date Feb 3, 2022
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHRINKABLE PACKAGE ASSEMBLY
- Publication number 20200194344
- Publication date Jun 18, 2020
- Intel Corporation
- Florence PON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-GRIND DIE BACKSIDE POWER DELIVERY
- Publication number 20200051903
- Publication date Feb 13, 2020
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE STACK HAVING A GROUND SHIELDING LAYER
- Publication number 20190279954
- Publication date Sep 12, 2019
- Intel Corporation
- Min-Tih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID ARRAY PACKAGE EXTENSION
- Publication number 20190244931
- Publication date Aug 8, 2019
- Intel Corporation
- Tyler LEUTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNTED CONTACT FINGERS
- Publication number 20190215970
- Publication date Jul 11, 2019
- Intel Corporation
- Min-Tih Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC DEVICE STACKS HAVING INTERIOR WINDOW WIREBONDING
- Publication number 20190139936
- Publication date May 9, 2019
- Intel Corporation
- Min-Tih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL FINS
- Publication number 20190067156
- Publication date Feb 28, 2019
- Intel Corporation
- Hyoung Il Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS DISTRIBUTION INTERPOSER FOR MITIGATING SUBSTRATE CRACKING
- Publication number 20190035720
- Publication date Jan 31, 2019
- Intel Corporation
- Min-Tih LAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE STACK WITH CASCADE AND VERTICAL CONNECTIONS
- Publication number 20180366441
- Publication date Dec 20, 2018
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-GRIND DIE BACKSIDE POWER DELIVERY
- Publication number 20180315699
- Publication date Nov 1, 2018
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES, ASSEMBLES, AND TECHNIQUES TO ENABLE MULTI-CHIP FLIP CHI...
- Publication number 20180204821
- Publication date Jul 19, 2018
- Intel Corporation
- Mao Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID ARRAY PACKAGE EXTENSION
- Publication number 20180182735
- Publication date Jun 28, 2018
- Intel Corporation
- Tyler LEUTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-GRIND DIE BACKSIDE POWER DELIVERY
- Publication number 20180182699
- Publication date Jun 28, 2018
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL STRESS-RELIEVING DEVICES, SYSTEMS, AND METHODS FOR ELECTRONIC...
- Publication number 20180098421
- Publication date Apr 5, 2018
- Intel Corporation
- Yuhong Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC CONVECTION COOLING FOR HANDHELD DEVICE
- Publication number 20180087849
- Publication date Mar 29, 2018
- Intel Corporation
- Min-Tih Lai
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LEADFRAME FOR SURFACE MOUNTED CONTACT FINGERS
- Publication number 20180088628
- Publication date Mar 29, 2018
- Intel Corporation
- Min-Tih Lai
- G06 - COMPUTING CALCULATING COUNTING

Min-Tih Lai

Person

Patents Grantslast 30 patents

Die stack with cascade and vertical connections

Shrinkable package assembly

Die stack with cascade and vertical connections

Post-grind die backside power delivery

Land grid array package extension

Microelectronic device stacks having interior window wirebonding

Substrates, assembles, and techniques to enable multi-chip flip chi...

Semiconductor package with thermal fins

Post-grind die backside power delivery

Land grid array package extension

Magnetic convection cooling for handheld device

Local stress-relieving devices, systems, and methods for electronic...

Post-grind die backside power delivery

Patents Applicationslast 30 patents

DIE STACK WITH CASCADE AND VERTICAL CONNECTIONS

SHRINKABLE PACKAGE ASSEMBLY

POST-GRIND DIE BACKSIDE POWER DELIVERY

MICROELECTRONIC DEVICE STACK HAVING A GROUND SHIELDING LAYER

LAND GRID ARRAY PACKAGE EXTENSION

SURFACE MOUNTED CONTACT FINGERS

MICROELECTRONIC DEVICE STACKS HAVING INTERIOR WINDOW WIREBONDING

SEMICONDUCTOR PACKAGE WITH THERMAL FINS

STRESS DISTRIBUTION INTERPOSER FOR MITIGATING SUBSTRATE CRACKING

DIE STACK WITH CASCADE AND VERTICAL CONNECTIONS

POST-GRIND DIE BACKSIDE POWER DELIVERY

SUBSTRATES, ASSEMBLES, AND TECHNIQUES TO ENABLE MULTI-CHIP FLIP CHI...

LAND GRID ARRAY PACKAGE EXTENSION

POST-GRIND DIE BACKSIDE POWER DELIVERY

LOCAL STRESS-RELIEVING DEVICES, SYSTEMS, AND METHODS FOR ELECTRONIC...

MAGNETIC CONVECTION COOLING FOR HANDHELD DEVICE

LEADFRAME FOR SURFACE MOUNTED CONTACT FINGERS