Min Wee Low

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Leadframe, semiconductor package and support lead for bonding with...
- Patent number 7,875,968
- Issue date Jan 25, 2011
- Infineon Technologies AG
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-leaded semiconductor package and a method to assemble the same
- Patent number 7,732,259
- Issue date Jun 8, 2010
- Infineon Technologies AG
- Min Wee Low
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Non-Leaded Semiconductor Package and a Method to Assemble the Same
- Publication number 20080258276
- Publication date Oct 23, 2008
- Infineon Technologies AG
- Min Wee Low
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe and Semiconductor Package
- Publication number 20080128741
- Publication date Jun 5, 2008
- Wu Hu Li
- H01 - BASIC ELECTRIC ELEMENTS